JPH0332432U - - Google Patents
Info
- Publication number
- JPH0332432U JPH0332432U JP1989091910U JP9191089U JPH0332432U JP H0332432 U JPH0332432 U JP H0332432U JP 1989091910 U JP1989091910 U JP 1989091910U JP 9191089 U JP9191089 U JP 9191089U JP H0332432 U JPH0332432 U JP H0332432U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation fin
- semiconductor device
- view
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989091910U JPH0648865Y2 (ja) | 1989-08-03 | 1989-08-03 | 半導体装置の放熱フイン取付機構 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989091910U JPH0648865Y2 (ja) | 1989-08-03 | 1989-08-03 | 半導体装置の放熱フイン取付機構 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0332432U true JPH0332432U ( ) | 1991-03-29 |
| JPH0648865Y2 JPH0648865Y2 (ja) | 1994-12-12 |
Family
ID=31641369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989091910U Expired - Fee Related JPH0648865Y2 (ja) | 1989-08-03 | 1989-08-03 | 半導体装置の放熱フイン取付機構 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648865Y2 ( ) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101043369B1 (ko) * | 2009-03-06 | 2011-06-21 | 현대로템 주식회사 | 소화기 상태 감지 시스템 |
-
1989
- 1989-08-03 JP JP1989091910U patent/JPH0648865Y2/ja not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101043369B1 (ko) * | 2009-03-06 | 2011-06-21 | 현대로템 주식회사 | 소화기 상태 감지 시스템 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648865Y2 (ja) | 1994-12-12 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |