JPH0630448Y2 - 光プリントヘッド - Google Patents

光プリントヘッド

Info

Publication number
JPH0630448Y2
JPH0630448Y2 JP1987201448U JP20144887U JPH0630448Y2 JP H0630448 Y2 JPH0630448 Y2 JP H0630448Y2 JP 1987201448 U JP1987201448 U JP 1987201448U JP 20144887 U JP20144887 U JP 20144887U JP H0630448 Y2 JPH0630448 Y2 JP H0630448Y2
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
diode array
wiring
print head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987201448U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01104343U (de
Inventor
俊男 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tottori Sanyo Electric Co Ltd
Priority to JP1987201448U priority Critical patent/JPH0630448Y2/ja
Publication of JPH01104343U publication Critical patent/JPH01104343U/ja
Application granted granted Critical
Publication of JPH0630448Y2 publication Critical patent/JPH0630448Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79Apparatus for Tape Automated Bonding [TAB]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Dot-Matrix Printers And Others (AREA)
JP1987201448U 1987-12-28 1987-12-28 光プリントヘッド Expired - Lifetime JPH0630448Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987201448U JPH0630448Y2 (ja) 1987-12-28 1987-12-28 光プリントヘッド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987201448U JPH0630448Y2 (ja) 1987-12-28 1987-12-28 光プリントヘッド

Publications (2)

Publication Number Publication Date
JPH01104343U JPH01104343U (de) 1989-07-13
JPH0630448Y2 true JPH0630448Y2 (ja) 1994-08-17

Family

ID=31491806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987201448U Expired - Lifetime JPH0630448Y2 (ja) 1987-12-28 1987-12-28 光プリントヘッド

Country Status (1)

Country Link
JP (1) JPH0630448Y2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007097281A1 (ja) * 2006-02-22 2007-08-30 Stanley Electric Co., Ltd. 照明装置
JP5195476B2 (ja) * 2009-02-04 2013-05-08 日立電線株式会社 光伝送モジュール

Also Published As

Publication number Publication date
JPH01104343U (de) 1989-07-13

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