JPH01104343U - - Google Patents
Info
- Publication number
- JPH01104343U JPH01104343U JP1987201448U JP20144887U JPH01104343U JP H01104343 U JPH01104343 U JP H01104343U JP 1987201448 U JP1987201448 U JP 1987201448U JP 20144887 U JP20144887 U JP 20144887U JP H01104343 U JPH01104343 U JP H01104343U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- diode array
- driving element
- wiring means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987201448U JPH0630448Y2 (ja) | 1987-12-28 | 1987-12-28 | 光プリントヘッド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987201448U JPH0630448Y2 (ja) | 1987-12-28 | 1987-12-28 | 光プリントヘッド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01104343U true JPH01104343U (de) | 1989-07-13 |
| JPH0630448Y2 JPH0630448Y2 (ja) | 1994-08-17 |
Family
ID=31491806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987201448U Expired - Lifetime JPH0630448Y2 (ja) | 1987-12-28 | 1987-12-28 | 光プリントヘッド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0630448Y2 (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007097281A1 (ja) * | 2006-02-22 | 2007-08-30 | Stanley Electric Co., Ltd. | 照明装置 |
| JP2010182800A (ja) * | 2009-02-04 | 2010-08-19 | Hitachi Cable Ltd | 光伝送モジュール |
-
1987
- 1987-12-28 JP JP1987201448U patent/JPH0630448Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007097281A1 (ja) * | 2006-02-22 | 2007-08-30 | Stanley Electric Co., Ltd. | 照明装置 |
| JP2010182800A (ja) * | 2009-02-04 | 2010-08-19 | Hitachi Cable Ltd | 光伝送モジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0630448Y2 (ja) | 1994-08-17 |