JPH06196479A - 半導体接続装置 - Google Patents

半導体接続装置

Info

Publication number
JPH06196479A
JPH06196479A JP5250513A JP25051393A JPH06196479A JP H06196479 A JPH06196479 A JP H06196479A JP 5250513 A JP5250513 A JP 5250513A JP 25051393 A JP25051393 A JP 25051393A JP H06196479 A JPH06196479 A JP H06196479A
Authority
JP
Japan
Prior art keywords
word line
line
metal
conductive material
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5250513A
Other languages
English (en)
Japanese (ja)
Inventor
Jae-Kap Kim
ゼー ガプ キム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
Hyundai Electronics Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics Industries Co Ltd filed Critical Hyundai Electronics Industries Co Ltd
Publication of JPH06196479A publication Critical patent/JPH06196479A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/535—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including internal interconnections, e.g. cross-under constructions

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Memories (AREA)
JP5250513A 1992-10-06 1993-10-06 半導体接続装置 Pending JPH06196479A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019920018286A KR950008239B1 (ko) 1992-10-06 1992-10-06 반도체접속장치
KR1992-18286 1992-10-06

Publications (1)

Publication Number Publication Date
JPH06196479A true JPH06196479A (ja) 1994-07-15

Family

ID=19340664

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5250513A Pending JPH06196479A (ja) 1992-10-06 1993-10-06 半導体接続装置

Country Status (2)

Country Link
JP (1) JPH06196479A (ko)
KR (1) KR950008239B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006339343A (ja) * 2005-06-01 2006-12-14 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100353397B1 (ko) * 2000-02-01 2002-09-18 박용선 음이온 접착제 및 그의 제조방법
KR102184078B1 (ko) * 2020-05-11 2020-11-27 (주)세림박스 항균성, 항곰팡이성 및 항충성 기능을 갖는 친환경 기능성 골판지 제조용 조성물

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02250372A (ja) * 1989-03-24 1990-10-08 Hitachi Ltd 半導体集積回路装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02250372A (ja) * 1989-03-24 1990-10-08 Hitachi Ltd 半導体集積回路装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006339343A (ja) * 2005-06-01 2006-12-14 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
US8198733B2 (en) 2005-06-01 2012-06-12 Panasonic Corporation Semiconductor device with deviation compensation and method for fabricating the same
US8421125B2 (en) 2005-06-01 2013-04-16 Pansonic Corporation Semiconductor device with deviation compensation and method for fabricating the same

Also Published As

Publication number Publication date
KR940010302A (ko) 1994-05-24
KR950008239B1 (ko) 1995-07-26

Similar Documents

Publication Publication Date Title
US4970564A (en) Semiconductor memory device having stacked capacitor cells
KR970007830B1 (ko) 반도체 장치 및 그 제조방법
JPH0546984B2 (ko)
JP2000031088A (ja) 半導体装置のコンタクトホ―ルを形成する方法
JP2009524215A (ja) 半導体デバイスにおいて付加的金属ルーティングを形成するためのシステムおよび方法
JPH06196479A (ja) 半導体接続装置
JPH11251430A (ja) 集積回路の中の導電素子を相互に接続する方法とシステム
JPH08330518A (ja) 半導体集積回路及びその製造方法
JPH0254960A (ja) 半導体装置の製造方法
US20060138559A1 (en) Flash memories having at least one resistance pattern on gate pattern and methods of fabricating the same
JPH11186386A (ja) 半導体装置およびその製造方法
JPH01215060A (ja) メモリ装置の製造方法
JPS6386455A (ja) 半導体装置
JPH05243397A (ja) 半導体装置の製造方法
JP2551030B2 (ja) 半導体装置およびその製造方法
JPH0427125A (ja) 配線部材の製造方法
JP2869978B2 (ja) 半導体装置
KR950011982B1 (ko) 전도물질 패드를 갖는 반도체 접속장치 및 그 제조방법
JPS59129461A (ja) 半導体装置とその製造方法
JPH04207053A (ja) 半導体装置の配線構造
KR20030020554A (ko) 반도체 메모리 소자의 제조방법
JPH03116852A (ja) 半導体装置
KR100358164B1 (ko) 강유전체 메모리 소자의 제조 방법
KR100256799B1 (ko) 반도체소자의 콘택제조방법
JPH02250372A (ja) 半導体集積回路装置