JPH0617288Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH0617288Y2
JPH0617288Y2 JP1989140899U JP14089989U JPH0617288Y2 JP H0617288 Y2 JPH0617288 Y2 JP H0617288Y2 JP 1989140899 U JP1989140899 U JP 1989140899U JP 14089989 U JP14089989 U JP 14089989U JP H0617288 Y2 JPH0617288 Y2 JP H0617288Y2
Authority
JP
Japan
Prior art keywords
circuit board
conductive foil
semiconductor pellet
semiconductor
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989140899U
Other languages
English (en)
Other versions
JPH0379433U (ja
Inventor
雅治 宮澤
Original Assignee
セイコー電子工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by セイコー電子工業株式会社 filed Critical セイコー電子工業株式会社
Priority to JP1989140899U priority Critical patent/JPH0617288Y2/ja
Publication of JPH0379433U publication Critical patent/JPH0379433U/ja
Application granted granted Critical
Publication of JPH0617288Y2 publication Critical patent/JPH0617288Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48237—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案は電子機器なとに用いられる半導体装置に関する
ものである。
〔考案の概要〕
本考案は、導電箔付回路基板を用いた半導体装置におい
て、半導体ペレット底面の領域に対応する回路基板上に
形成された導電箔の一部に、導電箔の形成されていない
回路基板の露出部を形成し、半導体ペレットの回路基板
への接着性を良好にし、その信頼性を向上させることの
できる半導体装置を得ようとするものである。
〔従来の技術〕
従来は、第３図に示すように、回路基板１上に半導体ペ
レット３が接着剤５で接着されている。なお、回路基板
１上の半導体ペレット３の取り付け位置に相当する領域
には、導電箔２が形成されている。導電箔２は回路基板
１の一方の電極と導通しており、電磁波等の半導体ペレ
ット３への影響を防止するためのシールドとなっている
ものである。半導体ペレット３のパット１０と回路基板
１のボンディングパターン７とはワイヤ８によりワイヤ
ボンディングされて、電気的導通がとれている。この状
態でボンディング等を固定するために、樹脂９で封止さ
れている。
〔考案が解決しようとする課題〕
上記したような、従来の半導体装置において、接着剤５
で接着する面は導電箔２の面と半導体ペレットの裏面で
あり、特に、導電箔２の面は平滑であるため、接着力が
弱いものであった。また、回路基板１と半導体ペレット
との間の接着力として影響のする界面は半導体ペレット
３と接着剤５、接着剤５と導電箔２、導電箔２と回路基
板１の３つであるため、接着力に信頼性が小さいもので
あった。
そこで、本考案は従来のこのような欠点を解決するもの
で、半導体ペレットと回路基板との接着力を向上し、且
つその信頼性も向上させることを目的とする。
〔課題を解決するための手段〕
上記課題を解決するために、本考案は、導電箔付回路基
板に直接半導体ペレットを接着し、半導体ペレットのパ
ットと回路基板のボンディングパターンとをワイヤによ
りワイヤボンディングし、半導体全体を樹脂等で封止す
る、半導体装置において、半導体ペレット底面の領域に
対応する回路基板上に形成されている導電箔に一部円形
の欠損部分を設けて回路基板の露出部分をつくる。以上
の構成により、半導体ペレットの回路基板上への接着力
が向上し、その信頼性もたかくなる。
〔作用〕
本考案の半導体装置は、接着部分の導電箔の一部に円形
上に導電箔が形成されていない部分があるため、半導体
ペレットと回路基板とが直接接着剤により、接着されて
いるため接着力が向上するばかりでなく、導電箔が形成
されていない部分の形状が円形であるため、接着剤の流
れが均一になり、導電箔エッジ部の段差に気泡が発生し
にくくなるため、接着力の信頼性も高くなる。
〔実施例〕
以下、本考案の実施例を図面に基づいて説明する。
第１図は、本考案の実施例の半導体の断面図であり、第
２図はその平面図である。回路基板１上には、半導体３
取り付け位置に対応して、導電箔２が形成されており、
その導電箔２は、その内側が円形上に抜き穴が形成され
ている。つまり、抜き穴部分（露出部）４は導電箔２は
形成されていない。半導体３は接着剤５により、回路基
板１に接着されている。半導体ペレット３のパット１０
と回路基板１のボンディングパターン７とはワイヤ８に
てワイヤボンディングされて、電気的導通がとれてい
る。このあと、半導体ペレット３とワイヤボンディング
部との全体を樹脂９にて封止している。回路基板１の半
導体ペレット３の取り付け位置に接着剤５の塗布して、
半導体ペレット３を取り付けると、接着剤５は矢印１１
で示すように流れる。接着剤５の流れは半導体ペレット
３を回路基板１に押し当てると、導電箔２の内側エッジ
部２０に当たり、導電箔２の上を流れていくが、内側エ
ッジ部２０が円形状に形成されているため、その流れは
互いに干渉することがなく均一に流れていく。このた
め、導電箔２の内側エッジ部２０に気泡が溜り難くなっ
ている。導電箔の穴抜き部（露出部）は半導体ペレット
３と回路基板１とが直接接着剤５で接着されており、且
つ、導電箔２の穴抜き形状が円形であるため、接着剤に
気泡が溜り難くなっている。
〔考案の効果〕
本考案は、以上説明したように、回路基板に形成され
た、導電箔の一部に円形の回路基板の露出部を設けると
言う簡単な構造で接着力が向上し、またその信頼性が高
くなる半導体装置が得られた。なお、導電箔の機能であ
る電磁波等のシールド効果は、従来例のものと殆ど差は
なかった。
【図面の簡単な説明】
第１図は、本考案の位置実施例の断面図であり、第２図
は第１図の平面図であり、第３図は、従来例として示し
た半導体装置の断面図である。 １……回路基板 ２……導電箔 ３……半導体ペレット ４……露出部 ５……接着剤 ７……ボンディングパターン ８……ワイヤ ９……樹脂 １０……パット

Claims (2)

    【実用新案登録請求の範囲】
  1. 【請求項１】導電箔付回路基板に直接半導体ペレットを
    接着し、ワイヤボンディングにより前記半導体ペレット
    と前記回路基板上のボンディングパターンとを電気的に
    接続した後、前記半導体ペレット全体を樹脂により密封
    した半導体装置において、 前記半導体ペレット底面の領域に対応する前記回路基板
    上の領域に一部前記導電箔を形成しない回路基板露出部
    を設けて前記導電箔を形成したことを特徴とする半導体
    装置。
  2. 【請求項２】前記露出部が円形であることを特徴とする
    請求項１記載の半導体装置。
JP1989140899U 1989-12-04 1989-12-04 半導体装置 Expired - Lifetime JPH0617288Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989140899U JPH0617288Y2 (ja) 1989-12-04 1989-12-04 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989140899U JPH0617288Y2 (ja) 1989-12-04 1989-12-04 半導体装置

Publications (2)

Publication Number Publication Date
JPH0379433U JPH0379433U (ja) 1991-08-13
JPH0617288Y2 true JPH0617288Y2 (ja) 1994-05-02

Family

ID=31687837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989140899U Expired - Lifetime JPH0617288Y2 (ja) 1989-12-04 1989-12-04 半導体装置

Country Status (1)

Country Link
JP (1) JPH0617288Y2 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5810381U (ja) * 1981-07-15 1983-01-22 松下電器産業株式会社 リ−ド線保持具の取付装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55173175U (ja) * 1979-05-29 1980-12-12

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5810381U (ja) * 1981-07-15 1983-01-22 松下電器産業株式会社 リ−ド線保持具の取付装置

Also Published As

Publication number Publication date
JPH0379433U (ja) 1991-08-13

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