JPH0610682Y2 - 樹脂封止形半導体装置成形用モールド金型 - Google Patents

樹脂封止形半導体装置成形用モールド金型

Info

Publication number
JPH0610682Y2
JPH0610682Y2 JP19235387U JP19235387U JPH0610682Y2 JP H0610682 Y2 JPH0610682 Y2 JP H0610682Y2 JP 19235387 U JP19235387 U JP 19235387U JP 19235387 U JP19235387 U JP 19235387U JP H0610682 Y2 JPH0610682 Y2 JP H0610682Y2
Authority
JP
Japan
Prior art keywords
mold
resin
gate
cavity
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP19235387U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0195736U (OSRAM
Inventor
透 上野
康次 堤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP19235387U priority Critical patent/JPH0610682Y2/ja
Publication of JPH0195736U publication Critical patent/JPH0195736U/ja
Application granted granted Critical
Publication of JPH0610682Y2 publication Critical patent/JPH0610682Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP19235387U 1987-12-17 1987-12-17 樹脂封止形半導体装置成形用モールド金型 Expired - Lifetime JPH0610682Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19235387U JPH0610682Y2 (ja) 1987-12-17 1987-12-17 樹脂封止形半導体装置成形用モールド金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19235387U JPH0610682Y2 (ja) 1987-12-17 1987-12-17 樹脂封止形半導体装置成形用モールド金型

Publications (2)

Publication Number Publication Date
JPH0195736U JPH0195736U (OSRAM) 1989-06-26
JPH0610682Y2 true JPH0610682Y2 (ja) 1994-03-16

Family

ID=31483215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19235387U Expired - Lifetime JPH0610682Y2 (ja) 1987-12-17 1987-12-17 樹脂封止形半導体装置成形用モールド金型

Country Status (1)

Country Link
JP (1) JPH0610682Y2 (OSRAM)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5843900B2 (ja) 2014-02-17 2016-01-13 シャープ株式会社 発光装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5843900B2 (ja) 2014-02-17 2016-01-13 シャープ株式会社 発光装置

Also Published As

Publication number Publication date
JPH0195736U (OSRAM) 1989-06-26

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