JPH0588320B2 - - Google Patents
Info
- Publication number
- JPH0588320B2 JPH0588320B2 JP62298211A JP29821187A JPH0588320B2 JP H0588320 B2 JPH0588320 B2 JP H0588320B2 JP 62298211 A JP62298211 A JP 62298211A JP 29821187 A JP29821187 A JP 29821187A JP H0588320 B2 JPH0588320 B2 JP H0588320B2
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- layer
- conductive
- electrodeposited
- peeling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 59
- 239000002184 metal Substances 0.000 claims description 59
- 229920005989 resin Polymers 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 21
- 239000002313 adhesive film Substances 0.000 claims description 17
- 238000005323 electroforming Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 239000000057 synthetic resin Substances 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 80
- 238000004070 electrodeposition Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 5
- 239000002932 luster Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000008151 electrolyte solution Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29821187A JPH01139791A (ja) | 1987-11-26 | 1987-11-26 | メタルステッカーの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29821187A JPH01139791A (ja) | 1987-11-26 | 1987-11-26 | メタルステッカーの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01139791A JPH01139791A (ja) | 1989-06-01 |
JPH0588320B2 true JPH0588320B2 (ko) | 1993-12-21 |
Family
ID=17856655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29821187A Granted JPH01139791A (ja) | 1987-11-26 | 1987-11-26 | メタルステッカーの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01139791A (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002356793A (ja) * | 2001-05-30 | 2002-12-13 | Kyushu Hitachi Maxell Ltd | 電鋳メタルとその製造方法 |
KR100438321B1 (ko) * | 2001-09-28 | 2004-07-01 | 김영준 | 금속 스티커의 제조방법 |
JP4530262B2 (ja) * | 2004-03-31 | 2010-08-25 | セイコーインスツル株式会社 | 低融点金属を用いた電鋳部品の製造方法 |
KR100869289B1 (ko) * | 2007-05-16 | 2008-11-19 | 김원철 | 금속스티커의 제작방법 |
JP5141320B2 (ja) * | 2008-03-17 | 2013-02-13 | 株式会社村田製作所 | ワイヤーグリッド用金属板、自立型ワイヤーグリッド及びワイヤーグリッド用金属板の製造方法 |
KR101108093B1 (ko) * | 2009-01-07 | 2012-01-31 | 김영준 | 금속스티커 및 이의 제조방법 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5137821A (en) * | 1974-09-28 | 1976-03-30 | Kubota Ltd | Chuzoyo shoshitsuseimokeizairyo |
JPS5916989A (ja) * | 1982-07-16 | 1984-01-28 | Oudenshiya:Kk | 電鋳によるバラ文字の製造方法 |
JPS6120979A (ja) * | 1984-07-10 | 1986-01-29 | 華陽技研工業株式会社 | ステツカ−等の製造方法 |
-
1987
- 1987-11-26 JP JP29821187A patent/JPH01139791A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5137821A (en) * | 1974-09-28 | 1976-03-30 | Kubota Ltd | Chuzoyo shoshitsuseimokeizairyo |
JPS5916989A (ja) * | 1982-07-16 | 1984-01-28 | Oudenshiya:Kk | 電鋳によるバラ文字の製造方法 |
JPS6120979A (ja) * | 1984-07-10 | 1986-01-29 | 華陽技研工業株式会社 | ステツカ−等の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH01139791A (ja) | 1989-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4869760A (en) | Method for production of metallic sticker | |
CN1831202A (zh) | 金属标签的制造方法 | |
JPH0588320B2 (ko) | ||
JPH08183151A (ja) | メッシュ一体型メタルマスクの製造方法 | |
JP2578167B2 (ja) | 装飾板とその製造方法 | |
JPH07243086A (ja) | 装飾板及びその製造方法 | |
KR100366013B1 (ko) | 스티커형 컬러 문자판 및 그의 제조 방법 | |
JPH11323592A (ja) | 電鋳金属体およびその製造方法 | |
JPH06234202A (ja) | スクリーン印刷用マスクの製造方法 | |
JPH0866961A (ja) | エンボス賦型フィルム製造用原版およびその製造方法 | |
JPS63303737A (ja) | スクリ−ン印刷用メタルマスク、及びその製造法 | |
JPH09148714A (ja) | 立体成形回路基板の製造方法 | |
JPH06130676A (ja) | スクリーン印刷用マスクの製造方法 | |
JPS61288094A (ja) | 透光性プラスチツクのメツキ方法 | |
JPS6120979A (ja) | ステツカ−等の製造方法 | |
JP2001131793A (ja) | 装飾品の製造方法 | |
JPH0540182A (ja) | 装飾部材の製造方法 | |
JP2987389B2 (ja) | スクリーン印刷用製版スクリーンの製造方法 | |
JPS6362736B2 (ko) | ||
JP2840666B2 (ja) | スクリーン印刷用メッシュ、並びにその製造方法 | |
JP2987390B2 (ja) | スクリーンマスクの製造方法 | |
JPH02270991A (ja) | 金属製装飾板の製造方法 | |
JPH04276096A (ja) | 文字,模様の形成方法 | |
JPH05220921A (ja) | 印刷用メタルマスク版の製造方法 | |
JPS6050196A (ja) | プラスチック上への部分電気めっき方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |