JPH0587147B2 - - Google Patents
Info
- Publication number
- JPH0587147B2 JPH0587147B2 JP62177533A JP17753387A JPH0587147B2 JP H0587147 B2 JPH0587147 B2 JP H0587147B2 JP 62177533 A JP62177533 A JP 62177533A JP 17753387 A JP17753387 A JP 17753387A JP H0587147 B2 JPH0587147 B2 JP H0587147B2
- Authority
- JP
- Japan
- Prior art keywords
- module
- chip carrier
- metal cap
- gas filling
- filling hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 20
- 238000003384 imaging method Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000009747 swallowing Effects 0.000 description 1
Landscapes
- Instruments For Viewing The Inside Of Hollow Bodies (AREA)
- Endoscopes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62177533A JPS6421946A (en) | 1987-07-16 | 1987-07-16 | Electronic element mounting module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62177533A JPS6421946A (en) | 1987-07-16 | 1987-07-16 | Electronic element mounting module |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6421946A JPS6421946A (en) | 1989-01-25 |
JPH0587147B2 true JPH0587147B2 (enrdf_load_stackoverflow) | 1993-12-15 |
Family
ID=16032595
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62177533A Granted JPS6421946A (en) | 1987-07-16 | 1987-07-16 | Electronic element mounting module |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6421946A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4648780B2 (ja) * | 2005-07-11 | 2011-03-09 | Hoya株式会社 | 電子内視鏡用撮像素子パッケージ |
-
1987
- 1987-07-16 JP JP62177533A patent/JPS6421946A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6421946A (en) | 1989-01-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6800943B2 (en) | Solid image pickup device | |
US5534725A (en) | Resin molded charge coupled device package and method for preparation thereof | |
US20050189622A1 (en) | Packaged acoustic and electromagnetic transducer chips | |
US20050156266A1 (en) | Die package having an adhesive flow restriction area | |
JPH02129948A (ja) | プリモールド型半導体装置 | |
US8786165B2 (en) | QFN/SON compatible package with SMT land pads | |
JPH085566Y2 (ja) | 固体撮像装置 | |
JPS61198769A (ja) | 混成集積回路 | |
JPH0587147B2 (enrdf_load_stackoverflow) | ||
JPWO2006075381A1 (ja) | カメラモジュールおよび半導体装置 | |
JPH06233196A (ja) | 小型カメラ装置 | |
JPH11271646A (ja) | 電子内視鏡用固体撮像装置 | |
JPH04317280A (ja) | 固体撮像装置 | |
JPS62272222A (ja) | 固体撮像装置 | |
JP3317010B2 (ja) | 電子装置 | |
JP4859016B2 (ja) | 半導体パッケージ | |
JPH0964330A (ja) | 電子内視鏡用固体撮像装置 | |
JP2522182B2 (ja) | 半導体装置 | |
JP2737332B2 (ja) | 集積回路装置 | |
JPH08307777A (ja) | 電子内視鏡用固体撮像装置 | |
JPS61253034A (ja) | 内視鏡 | |
JPH065717B2 (ja) | 固 体 撮 像 装 置 | |
JP3051225B2 (ja) | 集積回路用パッケージ | |
JPS6345842A (ja) | プラスチツク・パツケ−ジ | |
JPH04117940A (ja) | 電子内視鏡撮像装置 |