JPS6421946A - Electronic element mounting module - Google Patents

Electronic element mounting module

Info

Publication number
JPS6421946A
JPS6421946A JP62177533A JP17753387A JPS6421946A JP S6421946 A JPS6421946 A JP S6421946A JP 62177533 A JP62177533 A JP 62177533A JP 17753387 A JP17753387 A JP 17753387A JP S6421946 A JPS6421946 A JP S6421946A
Authority
JP
Japan
Prior art keywords
chip carrier
hole
side face
element mounting
gas sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62177533A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0587147B2 (enrdf_load_stackoverflow
Inventor
Yoshitaka Fukuoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62177533A priority Critical patent/JPS6421946A/ja
Publication of JPS6421946A publication Critical patent/JPS6421946A/ja
Publication of JPH0587147B2 publication Critical patent/JPH0587147B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Instruments For Viewing The Inside Of Hollow Bodies (AREA)
  • Endoscopes (AREA)
JP62177533A 1987-07-16 1987-07-16 Electronic element mounting module Granted JPS6421946A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62177533A JPS6421946A (en) 1987-07-16 1987-07-16 Electronic element mounting module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62177533A JPS6421946A (en) 1987-07-16 1987-07-16 Electronic element mounting module

Publications (2)

Publication Number Publication Date
JPS6421946A true JPS6421946A (en) 1989-01-25
JPH0587147B2 JPH0587147B2 (enrdf_load_stackoverflow) 1993-12-15

Family

ID=16032595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62177533A Granted JPS6421946A (en) 1987-07-16 1987-07-16 Electronic element mounting module

Country Status (1)

Country Link
JP (1) JPS6421946A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007014651A (ja) * 2005-07-11 2007-01-25 Pentax Corp 電子内視鏡用撮像素子パッケージ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007014651A (ja) * 2005-07-11 2007-01-25 Pentax Corp 電子内視鏡用撮像素子パッケージ

Also Published As

Publication number Publication date
JPH0587147B2 (enrdf_load_stackoverflow) 1993-12-15

Similar Documents

Publication Publication Date Title
CA2014311A1 (en) Semiconductor device package and sealing method therefore
MY112121A (en) Data word indicator in a system for assembling transport data packets.
EP0358063A3 (en) Electronic component carrier
CA2202426A1 (en) Mounting structure for a semiconductor circuit
EP0393206A4 (en) Image sensor and method of producing the same
EP0710826A3 (en) High pressure sensor structure and method
MY123249A (en) A semiconductor device and a method of manufacturing the same and an electronic device
EP1154471A4 (en) SEMICONDUCTOR MICROPLATE AND METHOD OF MANUFACTURE
EP0923120A4 (en) METHOD FOR PRODUCING A SEMICONDUCTOR
SG60102A1 (en) Lead frame semiconductor package having the same and method for manufacturing the same
EP0338232A3 (en) Method for mounting a flexible film electronic device carrier on or for separating it from a substrate
CA2187653A1 (en) Sealed electronic packaging for environmental protection of active electronics
CA2024784A1 (en) Stackable multilayer substrate for mounting integrated circuits
EP0370114A4 (en) Ic card and production method thereof
EP0810440A3 (en) Optical semiconductor component and method of fabrication
IE883822L (en) Silver-filled glass
MY101869A (en) Conductive die attach tape
EP0272390A3 (en) Packages for a semiconductor device
EP0463741A3 (en) Semiconductor memory device containing a capacitor and method for manufacturing same
JPS6421946A (en) Electronic element mounting module
EP0127176A3 (en) Integrated pressure sensor
JPS5764953A (en) Semiconductor device
EP0342063A3 (en) Process for preparing an electroluminescent film
MY112400A (en) Ceramic lid assembly for semiconductor packages.
JPS53112061A (en) Wiring substrate of semiconductor chip