JPH0584666B2 - - Google Patents

Info

Publication number
JPH0584666B2
JPH0584666B2 JP60259089A JP25908985A JPH0584666B2 JP H0584666 B2 JPH0584666 B2 JP H0584666B2 JP 60259089 A JP60259089 A JP 60259089A JP 25908985 A JP25908985 A JP 25908985A JP H0584666 B2 JPH0584666 B2 JP H0584666B2
Authority
JP
Japan
Prior art keywords
layer
aluminum
hole
insulating film
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60259089A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62222653A (ja
Inventor
Shigeru Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP25908985A priority Critical patent/JPS62222653A/ja
Publication of JPS62222653A publication Critical patent/JPS62222653A/ja
Publication of JPH0584666B2 publication Critical patent/JPH0584666B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Local Oxidation Of Silicon (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP25908985A 1985-11-18 1985-11-18 半導体装置及びその製造方法 Granted JPS62222653A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25908985A JPS62222653A (ja) 1985-11-18 1985-11-18 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25908985A JPS62222653A (ja) 1985-11-18 1985-11-18 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPS62222653A JPS62222653A (ja) 1987-09-30
JPH0584666B2 true JPH0584666B2 (en, 2012) 1993-12-02

Family

ID=17329159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25908985A Granted JPS62222653A (ja) 1985-11-18 1985-11-18 半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JPS62222653A (en, 2012)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100241529B1 (ko) * 1996-12-12 2000-02-01 김영환 플라즈마를 이용한 반도체 소자의 금속배선 부식방지방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51150985A (en) * 1975-06-19 1976-12-24 Mitsubishi Electric Corp Fabrication method of semiconductor device
JPS526795A (en) * 1975-07-07 1977-01-19 Mitsubishi Rayon Co Ltd Process for producing polyester polymers
JPS5261964A (en) * 1975-11-18 1977-05-21 Seiko Epson Corp Semiconductor device
JPS5630744A (en) * 1979-08-21 1981-03-27 Nippon Telegr & Teleph Corp <Ntt> Semiconductor device
JPS5831215B2 (ja) * 1979-09-29 1983-07-05 森六株式会社 配位型高分子鉄（２）ポルフィリン錯体を有効成分としてなる酸素吸脱着剤

Also Published As

Publication number Publication date
JPS62222653A (ja) 1987-09-30

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