JPH0581175B2 - - Google Patents

Info

Publication number
JPH0581175B2
JPH0581175B2 JP63108304A JP10830488A JPH0581175B2 JP H0581175 B2 JPH0581175 B2 JP H0581175B2 JP 63108304 A JP63108304 A JP 63108304A JP 10830488 A JP10830488 A JP 10830488A JP H0581175 B2 JPH0581175 B2 JP H0581175B2
Authority
JP
Japan
Prior art keywords
wafer
tested
probe card
temperature
storage chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP63108304A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01278739A (ja
Inventor
Masao Ookubo
Yukifumi Oda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Electronic Materials Corp
Original Assignee
Japan Electronic Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Electronic Materials Corp filed Critical Japan Electronic Materials Corp
Priority to JP63108304A priority Critical patent/JPH01278739A/ja
Publication of JPH01278739A publication Critical patent/JPH01278739A/ja
Publication of JPH0581175B2 publication Critical patent/JPH0581175B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP63108304A 1988-04-30 1988-04-30 半導体ウェハー低温試験装置 Granted JPH01278739A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63108304A JPH01278739A (ja) 1988-04-30 1988-04-30 半導体ウェハー低温試験装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63108304A JPH01278739A (ja) 1988-04-30 1988-04-30 半導体ウェハー低温試験装置

Publications (2)

Publication Number Publication Date
JPH01278739A JPH01278739A (ja) 1989-11-09
JPH0581175B2 true JPH0581175B2 (enrdf_load_stackoverflow) 1993-11-11

Family

ID=14481305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63108304A Granted JPH01278739A (ja) 1988-04-30 1988-04-30 半導体ウェハー低温試験装置

Country Status (1)

Country Link
JP (1) JPH01278739A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004128509A (ja) * 2002-10-02 2004-04-22 Suss Microtec Test Systems Gmbh 低温で基板を試験するプローバ

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0671037B2 (ja) * 1990-09-27 1994-09-07 長瀬産業株式会社 連続式ウエハ冷却装置
JP2004150999A (ja) * 2002-10-31 2004-05-27 Advantest Corp プローブカード
JP4744383B2 (ja) * 2006-07-21 2011-08-10 株式会社東京精密 プローバ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004128509A (ja) * 2002-10-02 2004-04-22 Suss Microtec Test Systems Gmbh 低温で基板を試験するプローバ

Also Published As

Publication number Publication date
JPH01278739A (ja) 1989-11-09

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees