KR100986805B1 - 온도 가변형 프로브 스테이션 - Google Patents
온도 가변형 프로브 스테이션 Download PDFInfo
- Publication number
- KR100986805B1 KR100986805B1 KR1020080116000A KR20080116000A KR100986805B1 KR 100986805 B1 KR100986805 B1 KR 100986805B1 KR 1020080116000 A KR1020080116000 A KR 1020080116000A KR 20080116000 A KR20080116000 A KR 20080116000A KR 100986805 B1 KR100986805 B1 KR 100986805B1
- Authority
- KR
- South Korea
- Prior art keywords
- chuck
- chamber
- probe
- probe station
- stage
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2862—Chambers or ovens; Tanks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (5)
- 반도체 소자의 전기적 특성을 측정하기 위한 프로브 스테이션에 있어서,내부관찰을 위해 일측에 투명창이 설치되는 챔버;상기 챔버 내에 설치되고 상기 반도체 소자를 지지하며 평면이동 가능한 척;상기 척의 내부에 삽입 설치되어 상기 척을 가열하는 전열선;상기 척의 내부에 삽입 설치되어 상기 척을 냉각시키며, 액상 또는 기상의 냉매가 흐르는 냉각라인; 및상기 척의 상부 일측에 설치되고, 상기 반도체 소자의 표면에 접촉되도록 프로브를 이동시키는 매니퓰레이터;를 포함하는 온도 가변형 프로브 스테이션.
- 청구항 1에 있어서,상기 척의 하부에서 상기 척을 지지하는 스테이지를 더 포함하되, 상기 스테이지의 일측에는 상기 척의 평면이동을 조절할 수 있는 한 쌍의 조절노브가 구비되는 것을 특징으로 하는 온도 가변형 프로브 스테이션.
- 청구항 2에 있어서,상기 척으로부터 상기 스테이지로의 열전달을 방지하기 위해, 상기 척의 저 면과 상기 스테이지의 상측면 사이에 적어도 하나 이상의 세라믹 단열체가 개재되는 것을 특징으로 하는 온도 가변형 프로브 스테이션.
- 청구항 1에 있어서,상기 챔버의 전면에는 전방투명창이 설치되고, 상기 챔버의 상측면에는 상부투명창이 설치되며, 상기 상부투명창의 상부에는 CCD 카메라가 설치되어 상기 상부투명창을 통해 상기 챔버의 내부 촬영이 가능한 것을 특징으로 하는 온도 가변형 프로브 스테이션.
- 청구항 1에 있어서,상기 척은 무산소동 재질에 골드코팅한 것을 특징으로 하는 온도 가변형 프로브 스테이션.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080116000A KR100986805B1 (ko) | 2008-11-21 | 2008-11-21 | 온도 가변형 프로브 스테이션 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080116000A KR100986805B1 (ko) | 2008-11-21 | 2008-11-21 | 온도 가변형 프로브 스테이션 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100057118A KR20100057118A (ko) | 2010-05-31 |
KR100986805B1 true KR100986805B1 (ko) | 2010-10-11 |
Family
ID=42280924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080116000A KR100986805B1 (ko) | 2008-11-21 | 2008-11-21 | 온도 가변형 프로브 스테이션 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100986805B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101698429B1 (ko) * | 2015-10-08 | 2017-01-20 | 한국기초과학지원연구원 | 극저온 프로브 스테이션 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160066678A (ko) | 2014-12-02 | 2016-06-13 | 단국대학교 산학협력단 | 필름 히터 및 이를 구비한 프로브 스테이션 |
KR20160108630A (ko) | 2015-03-04 | 2016-09-20 | 연세대학교 산학협력단 | 전기 에너지를 이용한 박막 활성화 방법, 박막 트랜지스터 제조 방법 및 기판 처리 장치 |
KR102659896B1 (ko) * | 2019-05-07 | 2024-04-24 | 주식회사 넥스트론 | 프로브 조립체 및 이를 포함하는 마이크로 진공 프로브 스테이션 |
US11378619B2 (en) * | 2019-12-18 | 2022-07-05 | Formfactor, Inc. | Double-sided probe systems with thermal control systems and related methods |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040025841A (ko) * | 2002-09-20 | 2004-03-26 | 동경 엘렉트론 주식회사 | 기판처리장치, 기판처리방법, 도포방법 및 도포장치 |
KR20070089604A (ko) * | 2006-02-28 | 2007-08-31 | 동경 엘렉트론 주식회사 | 기판 처리 장치, 기판 처리 조건 변경 방법 및 기억 매체 |
KR20070092137A (ko) * | 2006-03-08 | 2007-09-12 | 동경 엘렉트론 주식회사 | 기판 처리 장치, 기판 처리 조건 검토 방법 및 기억 매체 |
-
2008
- 2008-11-21 KR KR1020080116000A patent/KR100986805B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040025841A (ko) * | 2002-09-20 | 2004-03-26 | 동경 엘렉트론 주식회사 | 기판처리장치, 기판처리방법, 도포방법 및 도포장치 |
KR20070089604A (ko) * | 2006-02-28 | 2007-08-31 | 동경 엘렉트론 주식회사 | 기판 처리 장치, 기판 처리 조건 변경 방법 및 기억 매체 |
KR20070092137A (ko) * | 2006-03-08 | 2007-09-12 | 동경 엘렉트론 주식회사 | 기판 처리 장치, 기판 처리 조건 검토 방법 및 기억 매체 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101698429B1 (ko) * | 2015-10-08 | 2017-01-20 | 한국기초과학지원연구원 | 극저온 프로브 스테이션 |
Also Published As
Publication number | Publication date |
---|---|
KR20100057118A (ko) | 2010-05-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5410162A (en) | Apparatus for and method of rapid testing of semiconductor components at elevated temperature | |
KR100986805B1 (ko) | 온도 가변형 프로브 스테이션 | |
CN110383092A (zh) | 电子测试器 | |
KR100436657B1 (ko) | 반도체 소자 테스트 핸들러의 소자 가열 및 냉각장치 | |
KR100876138B1 (ko) | 프로브 스테이션 | |
CN109613051B (zh) | 一种采用对比法测量材料Seebeck系数的装置及方法 | |
US9989557B2 (en) | System and method for analyzing electronic devices having opposing thermal components | |
KR100937504B1 (ko) | 홀 효과 측정장치 | |
KR102659896B1 (ko) | 프로브 조립체 및 이를 포함하는 마이크로 진공 프로브 스테이션 | |
WO2020218690A1 (ko) | 저온 초정밀 열수송 측정용 프로브 시스템 및 이를 포함하는 측정장치 | |
KR20180012972A (ko) | 반도체 소자 검사 장치 | |
CN115032230A (zh) | 一种热电材料器件的测试设备 | |
JPS5941846A (ja) | 低温用プロ−バ | |
CN220709228U (zh) | 一种电子元器件老炼测试夹具 | |
CN208173554U (zh) | 加热器以及基板处理装置 | |
JP2002214270A (ja) | 温度特性試験装置 | |
CN214627402U (zh) | 一种用于双轴力学试验机的微型局部加热装置 | |
CN114217199B (zh) | 一种实现半导体器件1/f噪声变温测试的方法及装置 | |
US20230143906A1 (en) | Semiconductor laser inspection apparatus | |
CN219715662U (zh) | 一种高温寿命测试装置 | |
CN219758126U (zh) | 老化装置 | |
JP4566072B2 (ja) | 基板試験方法及び装置 | |
KR101161990B1 (ko) | 가열 챔버 및 이를 구비하는 가열 장치 | |
US20230273241A1 (en) | Semiconductor laser inspection apparatus | |
JPH1131724A (ja) | サーモチャック及び回路板検査装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
N231 | Notification of change of applicant | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130927 Year of fee payment: 4 |
|
FPAY | Annual fee payment |
Payment date: 20141001 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20160523 Year of fee payment: 6 |
|
R401 | Registration of restoration | ||
FPAY | Annual fee payment |
Payment date: 20170927 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20181002 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20190930 Year of fee payment: 10 |