JPH0572102B2 - - Google Patents
Info
- Publication number
- JPH0572102B2 JPH0572102B2 JP1186636A JP18663689A JPH0572102B2 JP H0572102 B2 JPH0572102 B2 JP H0572102B2 JP 1186636 A JP1186636 A JP 1186636A JP 18663689 A JP18663689 A JP 18663689A JP H0572102 B2 JPH0572102 B2 JP H0572102B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- separator
- hole
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 8
- 239000011347 resin Substances 0.000 description 27
- 229920005989 resin Polymers 0.000 description 27
- 238000005538 encapsulation Methods 0.000 description 9
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1186636A JPH0350841A (ja) | 1989-07-19 | 1989-07-19 | 半導体樹脂封止用金型装置 |
| KR1019900010954A KR930006590B1 (ko) | 1989-07-19 | 1990-07-19 | 반도체 수지봉합용 금형장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1186636A JPH0350841A (ja) | 1989-07-19 | 1989-07-19 | 半導体樹脂封止用金型装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0350841A JPH0350841A (ja) | 1991-03-05 |
| JPH0572102B2 true JPH0572102B2 (enExample) | 1993-10-08 |
Family
ID=16192054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1186636A Granted JPH0350841A (ja) | 1989-07-19 | 1989-07-19 | 半導体樹脂封止用金型装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH0350841A (enExample) |
| KR (1) | KR930006590B1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998047174A1 (en) * | 1997-04-16 | 1998-10-22 | Hitachi, Ltd. | Mold, device, and method for molding laminated element |
| JP4855026B2 (ja) * | 2005-09-27 | 2012-01-18 | Ｔｏｗａ株式会社 | 電子部品の樹脂封止成形方法及び装置 |
| JP2007095804A (ja) * | 2005-09-27 | 2007-04-12 | Towa Corp | 電子部品の樹脂封止成形方法及び装置 |
| JP2008235489A (ja) * | 2007-03-19 | 2008-10-02 | Fujitsu Ltd | 樹脂封止方法、樹脂封止用金型、及び樹脂封止装置 |
| KR20220166558A (ko) | 2021-06-10 | 2022-12-19 | 주식회사 아이티엠반도체 | 적층 몰딩 장치 |
-
1989
- 1989-07-19 JP JP1186636A patent/JPH0350841A/ja active Granted
-
1990
- 1990-07-19 KR KR1019900010954A patent/KR930006590B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR910003790A (ko) | 1991-02-28 |
| KR930006590B1 (ko) | 1993-07-21 |
| JPH0350841A (ja) | 1991-03-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081008 Year of fee payment: 15 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081008 Year of fee payment: 15 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091008 Year of fee payment: 16 |
|
| EXPY | Cancellation because of completion of term |