JPH0350841A - 半導体樹脂封止用金型装置 - Google Patents

半導体樹脂封止用金型装置

Info

Publication number
JPH0350841A
JPH0350841A JP1186636A JP18663689A JPH0350841A JP H0350841 A JPH0350841 A JP H0350841A JP 1186636 A JP1186636 A JP 1186636A JP 18663689 A JP18663689 A JP 18663689A JP H0350841 A JPH0350841 A JP H0350841A
Authority
JP
Japan
Prior art keywords
metal mold
mold
resin
press machine
another
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1186636A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0572102B2 (enExample
Inventor
Masamichi Shindo
進藤　政道
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1186636A priority Critical patent/JPH0350841A/ja
Priority to KR1019900010954A priority patent/KR930006590B1/ko
Publication of JPH0350841A publication Critical patent/JPH0350841A/ja
Publication of JPH0572102B2 publication Critical patent/JPH0572102B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP1186636A 1989-07-19 1989-07-19 半導体樹脂封止用金型装置 Granted JPH0350841A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1186636A JPH0350841A (ja) 1989-07-19 1989-07-19 半導体樹脂封止用金型装置
KR1019900010954A KR930006590B1 (ko) 1989-07-19 1990-07-19 반도체 수지봉합용 금형장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1186636A JPH0350841A (ja) 1989-07-19 1989-07-19 半導体樹脂封止用金型装置

Publications (2)

Publication Number Publication Date
JPH0350841A true JPH0350841A (ja) 1991-03-05
JPH0572102B2 JPH0572102B2 (enExample) 1993-10-08

Family

ID=16192054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1186636A Granted JPH0350841A (ja) 1989-07-19 1989-07-19 半導体樹脂封止用金型装置

Country Status (2)

Country Link
JP (1) JPH0350841A (enExample)
KR (1) KR930006590B1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998047174A1 (en) * 1997-04-16 1998-10-22 Hitachi, Ltd. Mold, device, and method for molding laminated element
JP2007095802A (ja) * 2005-09-27 2007-04-12 Towa Corp 電子部品の樹脂封止成形方法及び装置
JP2007095804A (ja) * 2005-09-27 2007-04-12 Towa Corp 電子部品の樹脂封止成形方法及び装置
JP2008235489A (ja) * 2007-03-19 2008-10-02 Fujitsu Ltd 樹脂封止方法、樹脂封止用金型、及び樹脂封止装置
US12138832B2 (en) 2021-06-10 2024-11-12 Itm Semiconductor Co., Ltd. Stack molding machine

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998047174A1 (en) * 1997-04-16 1998-10-22 Hitachi, Ltd. Mold, device, and method for molding laminated element
JP2007095802A (ja) * 2005-09-27 2007-04-12 Towa Corp 電子部品の樹脂封止成形方法及び装置
JP2007095804A (ja) * 2005-09-27 2007-04-12 Towa Corp 電子部品の樹脂封止成形方法及び装置
JP2008235489A (ja) * 2007-03-19 2008-10-02 Fujitsu Ltd 樹脂封止方法、樹脂封止用金型、及び樹脂封止装置
US12138832B2 (en) 2021-06-10 2024-11-12 Itm Semiconductor Co., Ltd. Stack molding machine

Also Published As

Publication number Publication date
KR910003790A (ko) 1991-02-28
KR930006590B1 (ko) 1993-07-21
JPH0572102B2 (enExample) 1993-10-08

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