JPH0566732B2 - - Google Patents

Info

Publication number
JPH0566732B2
JPH0566732B2 JP2846584A JP2846584A JPH0566732B2 JP H0566732 B2 JPH0566732 B2 JP H0566732B2 JP 2846584 A JP2846584 A JP 2846584A JP 2846584 A JP2846584 A JP 2846584A JP H0566732 B2 JPH0566732 B2 JP H0566732B2
Authority
JP
Japan
Prior art keywords
semiconductor device
probe
needle
conductive member
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2846584A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60173850A (ja
Inventor
Masaaki Minami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP2846584A priority Critical patent/JPS60173850A/ja
Publication of JPS60173850A publication Critical patent/JPS60173850A/ja
Publication of JPH0566732B2 publication Critical patent/JPH0566732B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2846584A 1984-02-20 1984-02-20 半導体装置の試験装置 Granted JPS60173850A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2846584A JPS60173850A (ja) 1984-02-20 1984-02-20 半導体装置の試験装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2846584A JPS60173850A (ja) 1984-02-20 1984-02-20 半導体装置の試験装置

Publications (2)

Publication Number Publication Date
JPS60173850A JPS60173850A (ja) 1985-09-07
JPH0566732B2 true JPH0566732B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-09-22

Family

ID=12249399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2846584A Granted JPS60173850A (ja) 1984-02-20 1984-02-20 半導体装置の試験装置

Country Status (1)

Country Link
JP (1) JPS60173850A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5011661B2 (ja) * 2005-06-03 2012-08-29 富士電機株式会社 半導体素子の試験方法
JP5489356B2 (ja) * 2010-10-20 2014-05-14 株式会社日本マイクロニクス 半導体測定装置
JP2011174946A (ja) * 2011-06-02 2011-09-08 Fuji Electric Co Ltd 半導体素子の試験方法
JP6044489B2 (ja) * 2013-08-30 2016-12-14 三菱電機株式会社 接触子、測定装置

Also Published As

Publication number Publication date
JPS60173850A (ja) 1985-09-07

Similar Documents

Publication Publication Date Title
US4801869A (en) Semiconductor defect monitor for diagnosing processing-induced defects
JPH02124469A (ja) プローブカード
JP2011034999A (ja) 半導体装置およびその製造方法
JP2002176140A (ja) 半導体集積回路ウェハ
JP6155725B2 (ja) 半導体装置の検査方法及びその方法を用いた半導体装置の製造方法
JPH0566732B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2657315B2 (ja) プローブカード
JPH0829475A (ja) 実装基板検査装置のコンタクトプローブ
JPH08330368A (ja) 半導体回路装置群及びそのプローブ試験方法
JPH0541419A (ja) 検査装置の評価方法
JPS626653B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2007121015A (ja) 半導体検査装置及びウエハチャック
JPS6278842A (ja) プロ−ブカ−ドの検査方法
JP3153834B2 (ja) 半導体装置のテスト装置及び半導体装置の検査方法
JPS5918864B2 (ja) 半導体ウエハ−検査装置
JPS618939A (ja) 半導体装置
JPS59208469A (ja) プロ−ブカ−ド
JPH03185744A (ja) 半導体素子
JP2002100658A (ja) 半導体装置の検査装置
JPS6137776B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2591453B2 (ja) バーンインボード検査装置およびバーンインボード検査方法
JPH03190148A (ja) 半導体ウェハーのプローブ針あわせ方法
JPH0666869A (ja) 半導体テスタ及び半導体テスタのプローブ針の電気的導 通判定方法
JPH05346453A (ja) 半導体集積回路装置の試験治具
JPH03109749A (ja) 集積回路装置の試験方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term