JPH056665Y2 - - Google Patents
Info
- Publication number
- JPH056665Y2 JPH056665Y2 JP16300585U JP16300585U JPH056665Y2 JP H056665 Y2 JPH056665 Y2 JP H056665Y2 JP 16300585 U JP16300585 U JP 16300585U JP 16300585 U JP16300585 U JP 16300585U JP H056665 Y2 JPH056665 Y2 JP H056665Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- soldering
- stack
- electronic component
- dimension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 125000006850 spacer group Chemical group 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16300585U JPH056665Y2 (enrdf_load_stackoverflow) | 1985-10-25 | 1985-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16300585U JPH056665Y2 (enrdf_load_stackoverflow) | 1985-10-25 | 1985-10-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6273557U JPS6273557U (enrdf_load_stackoverflow) | 1987-05-11 |
| JPH056665Y2 true JPH056665Y2 (enrdf_load_stackoverflow) | 1993-02-19 |
Family
ID=31090807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16300585U Expired - Lifetime JPH056665Y2 (enrdf_load_stackoverflow) | 1985-10-25 | 1985-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH056665Y2 (enrdf_load_stackoverflow) |
-
1985
- 1985-10-25 JP JP16300585U patent/JPH056665Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6273557U (enrdf_load_stackoverflow) | 1987-05-11 |
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