JPH0565076B2 - - Google Patents
Info
- Publication number
- JPH0565076B2 JPH0565076B2 JP62120751A JP12075187A JPH0565076B2 JP H0565076 B2 JPH0565076 B2 JP H0565076B2 JP 62120751 A JP62120751 A JP 62120751A JP 12075187 A JP12075187 A JP 12075187A JP H0565076 B2 JPH0565076 B2 JP H0565076B2
- Authority
- JP
- Japan
- Prior art keywords
- sides
- manufacturing
- prepreg
- adhesive
- manufactured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 claims description 43
- 239000011347 resin Substances 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 24
- 239000002131 composite material Substances 0.000 claims description 21
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 239000011162 core material Substances 0.000 claims description 20
- 239000004020 conductor Substances 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000012783 reinforcing fiber Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 10
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 238000003825 pressing Methods 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 229910001220 stainless steel Inorganic materials 0.000 description 8
- 239000010935 stainless steel Substances 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62120751A JPS63285997A (ja) | 1987-05-18 | 1987-05-18 | 多層基板の製造方法および装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62120751A JPS63285997A (ja) | 1987-05-18 | 1987-05-18 | 多層基板の製造方法および装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63285997A JPS63285997A (ja) | 1988-11-22 |
JPH0565076B2 true JPH0565076B2 (US07202987-20070410-C00007.png) | 1993-09-16 |
Family
ID=14794085
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62120751A Granted JPS63285997A (ja) | 1987-05-18 | 1987-05-18 | 多層基板の製造方法および装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63285997A (US07202987-20070410-C00007.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001138437A (ja) * | 1999-11-17 | 2001-05-22 | Sumitomo Bakelite Co Ltd | 積層板の製造方法 |
JP2001334543A (ja) * | 2000-05-26 | 2001-12-04 | Sumitomo Bakelite Co Ltd | 積層板の製造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05226833A (ja) * | 1992-02-17 | 1993-09-03 | Toshiba Corp | 配線板の製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5236761A (en) * | 1975-09-18 | 1977-03-22 | Koito Mfg Co Ltd | Method of producing printed circuit board conductor circuit |
JPS5789920A (en) * | 1980-07-24 | 1982-06-04 | Held Kurt | Machine with duplex belt press |
JPS5850797A (ja) * | 1981-09-21 | 1983-03-25 | 株式会社井上ジャパックス研究所 | プリント配線板の製造方法 |
JPS5989494A (ja) * | 1982-11-15 | 1984-05-23 | 松下電工株式会社 | プリント配線板用多層銅張積層板の製造法 |
JPS6186257A (ja) * | 1984-10-05 | 1986-05-01 | 松下電工株式会社 | 積層板の製法 |
JPS61255858A (ja) * | 1985-05-02 | 1986-11-13 | クルト・ヘルト | 銅張りラミネ−トを製造する方法および装置 |
-
1987
- 1987-05-18 JP JP62120751A patent/JPS63285997A/ja active Granted
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5236761A (en) * | 1975-09-18 | 1977-03-22 | Koito Mfg Co Ltd | Method of producing printed circuit board conductor circuit |
JPS5789920A (en) * | 1980-07-24 | 1982-06-04 | Held Kurt | Machine with duplex belt press |
JPS5850797A (ja) * | 1981-09-21 | 1983-03-25 | 株式会社井上ジャパックス研究所 | プリント配線板の製造方法 |
JPS5989494A (ja) * | 1982-11-15 | 1984-05-23 | 松下電工株式会社 | プリント配線板用多層銅張積層板の製造法 |
JPS6186257A (ja) * | 1984-10-05 | 1986-05-01 | 松下電工株式会社 | 積層板の製法 |
JPS61255858A (ja) * | 1985-05-02 | 1986-11-13 | クルト・ヘルト | 銅張りラミネ−トを製造する方法および装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001138437A (ja) * | 1999-11-17 | 2001-05-22 | Sumitomo Bakelite Co Ltd | 積層板の製造方法 |
JP2001334543A (ja) * | 2000-05-26 | 2001-12-04 | Sumitomo Bakelite Co Ltd | 積層板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS63285997A (ja) | 1988-11-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2004327510A (ja) | 多層プリント配線板用銅張り積層板、多層プリント配線板、多層プリント配線板の製造方法 | |
JPH0565076B2 (US07202987-20070410-C00007.png) | ||
JP2991032B2 (ja) | 多層基板の製造方法 | |
JP2013026456A (ja) | 配線基板の製造方法 | |
JP3705370B2 (ja) | 多層プリント配線板の製造方法 | |
JPH07106760A (ja) | 多層基板の製造方法 | |
JPH0565077B2 (US07202987-20070410-C00007.png) | ||
JPS63136689A (ja) | 両面回路形成方法および装置 | |
JPH0565075B2 (US07202987-20070410-C00007.png) | ||
JPS63136696A (ja) | シ−ルド板の製造方法および装置 | |
JPH07202426A (ja) | 多層プリント配線板の製造方法 | |
JPH01272416A (ja) | プリプレグの製造方法 | |
JPH0320917B2 (US07202987-20070410-C00007.png) | ||
JP2000151116A (ja) | 多層プリント基板の製造方法とその製造装置 | |
JP4058218B2 (ja) | プリント配線基板の製造方法 | |
JP2621359B2 (ja) | 多層プリント基板の製造方法 | |
JPH11238958A (ja) | 回路基板の製造方法及び製造装置 | |
JPH0476784B2 (US07202987-20070410-C00007.png) | ||
JPH10126058A (ja) | 多層プリント配線板の製造方法 | |
JP3944987B2 (ja) | 多層板の製造方法 | |
JPH07336049A (ja) | 多層プリント配線板の製造方法 | |
JPS61120736A (ja) | 多層プリント配線板の製法 | |
JPS63136693A (ja) | 金属ベ−スプリント配線板の製造方法および装置 | |
JP2004066702A (ja) | 樹脂フィルムへの銅箔貼り付け方法およびプリント基板の製造方法 | |
JPH08125333A (ja) | 多層プリント配線板の製造方法 |