JPH0563956B2 - - Google Patents

Info

Publication number
JPH0563956B2
JPH0563956B2 JP59152955A JP15295584A JPH0563956B2 JP H0563956 B2 JPH0563956 B2 JP H0563956B2 JP 59152955 A JP59152955 A JP 59152955A JP 15295584 A JP15295584 A JP 15295584A JP H0563956 B2 JPH0563956 B2 JP H0563956B2
Authority
JP
Japan
Prior art keywords
active element
mounted active
hole
wiring pattern
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59152955A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6132592A (ja
Inventor
Takashi Saito
Shinya Niizaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15295584A priority Critical patent/JPS6132592A/ja
Publication of JPS6132592A publication Critical patent/JPS6132592A/ja
Publication of JPH0563956B2 publication Critical patent/JPH0563956B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP15295584A 1984-07-25 1984-07-25 混成集積回路 Granted JPS6132592A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15295584A JPS6132592A (ja) 1984-07-25 1984-07-25 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15295584A JPS6132592A (ja) 1984-07-25 1984-07-25 混成集積回路

Publications (2)

Publication Number Publication Date
JPS6132592A JPS6132592A (ja) 1986-02-15
JPH0563956B2 true JPH0563956B2 (enrdf_load_stackoverflow) 1993-09-13

Family

ID=15551811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15295584A Granted JPS6132592A (ja) 1984-07-25 1984-07-25 混成集積回路

Country Status (1)

Country Link
JP (1) JPS6132592A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4828969B2 (ja) * 2006-03-10 2011-11-30 株式会社東芝 半導体装置の実装構造

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5694053U (enrdf_load_stackoverflow) * 1979-12-20 1981-07-25
JPS591218U (ja) * 1982-06-24 1984-01-06 ソニー株式会社 高周波回路

Also Published As

Publication number Publication date
JPS6132592A (ja) 1986-02-15

Similar Documents

Publication Publication Date Title
JP3051011B2 (ja) パワ−モジュ−ル
JPH0563956B2 (enrdf_load_stackoverflow)
JPH05327249A (ja) 電子回路モジュール及びその製造方法
JPH05198696A (ja) 半導体チップの実装構造
JP2691352B2 (ja) 電子部品塔載装置
JP2524482B2 (ja) Qfp構造半導体装置
JP3156630B2 (ja) パワー回路実装ユニット
JPH1074887A (ja) 電子部品及びその製造方法
JP2515515Y2 (ja) 電子機器
JP3959839B2 (ja) 半導体装置の製造方法
JP2778790B2 (ja) 半導体装置の実装構造及び実装方法
JPH0513963A (ja) 電子部品搭載用基板
JP3328146B2 (ja) 半導体装置
JP2737332B2 (ja) 集積回路装置
JPH0430566A (ja) 高出力用混成集積回路装置
JPH04269841A (ja) 半導体装置
JP3034657B2 (ja) 半導体装置用パッケージ
JP3450465B2 (ja) 高周波パワーモジュール
JPS5954254A (ja) 半導体集積回路装置
JP2770043B2 (ja) 電子部品搭載用基板
KR100241199B1 (ko) 반도체장치와 그 제조방법 및 반도체장치용 테이프 캐리어
JPH0648876Y2 (ja) 半導体装置
JPH0685102A (ja) 半導体集積回路装置
JPH0222886A (ja) 混成集積回路
JP3024886B2 (ja) チップキャリア