JPH0563034B2 - - Google Patents

Info

Publication number
JPH0563034B2
JPH0563034B2 JP62105979A JP10597987A JPH0563034B2 JP H0563034 B2 JPH0563034 B2 JP H0563034B2 JP 62105979 A JP62105979 A JP 62105979A JP 10597987 A JP10597987 A JP 10597987A JP H0563034 B2 JPH0563034 B2 JP H0563034B2
Authority
JP
Japan
Prior art keywords
copper foil
large current
hole
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62105979A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63271996A (ja
Inventor
Yoshimoto Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fanuc Corp
Original Assignee
Fanuc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fanuc Corp filed Critical Fanuc Corp
Priority to JP62105979A priority Critical patent/JPS63271996A/ja
Priority to PCT/JP1988/000407 priority patent/WO1988008660A1/ja
Priority to EP88903402A priority patent/EP0312607B1/en
Priority to US07/276,453 priority patent/US4945190A/en
Priority to DE88903402T priority patent/DE3884736T2/de
Publication of JPS63271996A publication Critical patent/JPS63271996A/ja
Publication of JPH0563034B2 publication Critical patent/JPH0563034B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Non-Insulated Conductors (AREA)
JP62105979A 1987-04-28 1987-04-28 大電流用プリント基板 Granted JPS63271996A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP62105979A JPS63271996A (ja) 1987-04-28 1987-04-28 大電流用プリント基板
PCT/JP1988/000407 WO1988008660A1 (en) 1987-04-28 1988-04-26 Power circuit board and manufacturing method
EP88903402A EP0312607B1 (en) 1987-04-28 1988-04-26 Power circuit board and manufacturing method
US07/276,453 US4945190A (en) 1987-04-28 1988-04-26 Circuit board device for magnetics circuit and method of manufacturing same
DE88903402T DE3884736T2 (de) 1987-04-28 1988-04-26 Stromversorgungsleiterplatte und verfahren zu ihrer herstellung.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62105979A JPS63271996A (ja) 1987-04-28 1987-04-28 大電流用プリント基板

Publications (2)

Publication Number Publication Date
JPS63271996A JPS63271996A (ja) 1988-11-09
JPH0563034B2 true JPH0563034B2 (US07413550-20080819-C00001.png) 1993-09-09

Family

ID=14421869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62105979A Granted JPS63271996A (ja) 1987-04-28 1987-04-28 大電流用プリント基板

Country Status (5)

Country Link
US (1) US4945190A (US07413550-20080819-C00001.png)
EP (1) EP0312607B1 (US07413550-20080819-C00001.png)
JP (1) JPS63271996A (US07413550-20080819-C00001.png)
DE (1) DE3884736T2 (US07413550-20080819-C00001.png)
WO (1) WO1988008660A1 (US07413550-20080819-C00001.png)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4967042A (en) * 1988-12-22 1990-10-30 Texas Instruments Incorporated System for enhancing current carrying capacity of printed wiring board
FR2657217A1 (fr) * 1990-01-16 1991-07-19 Thomson Csf Carte a circuit imprime comportant des barreaux conducteurs de forte section, et son procede de fabrication.
JP2584115B2 (ja) * 1990-07-31 1997-02-19 オークマ株式会社 パワー回路配線用プリント基板
US5622520A (en) * 1996-04-02 1997-04-22 International Business Machines Corporation High-density board connector attachment
DE19825451A1 (de) * 1998-06-06 1999-12-09 Ego Elektro Geraetebau Gmbh Keramischer Träger mit einer elektrischen Schaltung und mit einer Anschlußvorrichtung
DE10228756A1 (de) * 2002-06-27 2004-01-29 Epcos Ag Leiterplatte, Leiterplattenanordnung und Verwendung der Leiterplatte
JP2007174746A (ja) * 2005-12-19 2007-07-05 Jtekt Corp 電気回路基板、基板装置、モータ、モータ装置、電動ポンプ及びモータと電気回路基板又は基板装置とを接続する方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332371A (en) * 1976-09-07 1978-03-27 Seiko Instr & Electronics Fixture structure of electric parts
JPS53146173A (en) * 1977-05-25 1978-12-19 Hitachi Ltd Power module circuit board and method of producing same
JPS63237495A (ja) * 1987-03-26 1988-10-03 古河電気工業株式会社 複合回路基板

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3370351A (en) * 1964-11-02 1968-02-27 Gen Dynamics Corp Method of manufacturing electrical connectors
US3431350A (en) * 1966-03-31 1969-03-04 Texas Instruments Inc Circuit board
US3501831A (en) * 1968-06-17 1970-03-24 Rogers Corp Eyelet
US3514538A (en) * 1968-11-01 1970-05-26 Intern Electronics Research Co Thermal dissipating metal core printed circuit board
JPS4885150U (US07413550-20080819-C00001.png) * 1971-12-04 1973-10-16
JPS51133761A (en) * 1975-05-16 1976-11-19 Hitachi Ltd Through holes in printed circuit board
JPS5545207U (US07413550-20080819-C00001.png) * 1978-09-14 1980-03-25
JPS5545207A (en) * 1978-09-26 1980-03-29 Oki Electric Ind Co Ltd Complementary mos inverter circuit unit and its production
JPS5932077B2 (ja) * 1979-08-21 1984-08-06 富士通株式会社 金属コアの接地方法
JPS565321Y2 (US07413550-20080819-C00001.png) * 1980-03-12 1981-02-05
DE3110528A1 (de) * 1981-03-18 1982-10-07 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur herstellung gedruckter schaltungen
JPS59177215U (ja) * 1983-05-16 1984-11-27 ソニー株式会社 高周波回路
GB8322473D0 (en) * 1983-08-20 1983-09-21 Int Computers Ltd Printed circuit boards
JPS614172A (ja) * 1984-06-18 1986-01-10 ファナック株式会社 交流電動機制御盤
US4711026A (en) * 1985-07-19 1987-12-08 Kollmorgen Technologies Corporation Method of making wires scribed circuit boards

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332371A (en) * 1976-09-07 1978-03-27 Seiko Instr & Electronics Fixture structure of electric parts
JPS53146173A (en) * 1977-05-25 1978-12-19 Hitachi Ltd Power module circuit board and method of producing same
JPS63237495A (ja) * 1987-03-26 1988-10-03 古河電気工業株式会社 複合回路基板

Also Published As

Publication number Publication date
EP0312607A1 (en) 1989-04-26
WO1988008660A1 (en) 1988-11-03
JPS63271996A (ja) 1988-11-09
EP0312607B1 (en) 1993-10-06
DE3884736T2 (de) 1994-01-27
US4945190A (en) 1990-07-31
DE3884736D1 (de) 1993-11-11
EP0312607A4 (en) 1990-09-26

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