JPH0562732B2 - - Google Patents
Info
- Publication number
- JPH0562732B2 JPH0562732B2 JP60107786A JP10778685A JPH0562732B2 JP H0562732 B2 JPH0562732 B2 JP H0562732B2 JP 60107786 A JP60107786 A JP 60107786A JP 10778685 A JP10778685 A JP 10778685A JP H0562732 B2 JPH0562732 B2 JP H0562732B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- equivalent
- acid
- photosensitive resin
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10778685A JPS61264340A (ja) | 1985-05-20 | 1985-05-20 | 感光性樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10778685A JPS61264340A (ja) | 1985-05-20 | 1985-05-20 | 感光性樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61264340A JPS61264340A (ja) | 1986-11-22 |
JPH0562732B2 true JPH0562732B2 (enrdf_load_stackoverflow) | 1993-09-09 |
Family
ID=14467986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10778685A Granted JPS61264340A (ja) | 1985-05-20 | 1985-05-20 | 感光性樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61264340A (enrdf_load_stackoverflow) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH083632B2 (ja) * | 1986-04-21 | 1996-01-17 | 日立化成工業株式会社 | 感光性エレメント |
JPH0814697B2 (ja) * | 1987-05-12 | 1996-02-14 | 日立化成工業株式会社 | 感光性樹脂組成物 |
IL94474A (en) * | 1989-06-09 | 1993-07-08 | Morton Int Inc | Photoimageable compositions |
JP4839710B2 (ja) * | 2004-08-09 | 2011-12-21 | 三菱化学株式会社 | 感光性樹脂組成物、カラーフィルタ及び液晶表示装置 |
JP2016041778A (ja) * | 2014-08-14 | 2016-03-31 | 株式会社巴川製紙所 | 保護フィルム、フィルム積層体および偏光板 |
WO2016088540A1 (ja) * | 2014-12-05 | 2016-06-09 | 三井金属鉱業株式会社 | 導電性組成物並びに配線基板及びその製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2557408C2 (de) * | 1975-12-19 | 1983-08-25 | Bayer Ag, 5090 Leverkusen | Verfahren zur Herstellung eines in organischen Lösungsmitteln löslichen, vernetzbaren Acryloyl- und/oder Methacryloylgruppen und Carboxylgruppen enthaltenden Urethanharzes und seine Verwendung |
JPS5923723B2 (ja) * | 1980-09-19 | 1984-06-04 | 日立化成工業株式会社 | 感光性樹脂組成物および感光性エレメント |
JPS60188413A (ja) * | 1984-03-09 | 1985-09-25 | Toyobo Co Ltd | 光重合性樹脂組成物 |
JPS60195171A (ja) * | 1984-03-19 | 1985-10-03 | Mitsubishi Rayon Co Ltd | 紫外線硬化型インキ組成物 |
JPS61130946A (ja) * | 1984-11-29 | 1986-06-18 | Hitachi Chem Co Ltd | 感光性樹脂組成物 |
JPS61200536A (ja) * | 1985-03-01 | 1986-09-05 | Hitachi Chem Co Ltd | 感光性組成物 |
JPS61264341A (ja) * | 1985-05-20 | 1986-11-22 | Hitachi Chem Co Ltd | 感光性樹脂組成物 |
-
1985
- 1985-05-20 JP JP10778685A patent/JPS61264340A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61264340A (ja) | 1986-11-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |