JPH0553311B2 - - Google Patents

Info

Publication number
JPH0553311B2
JPH0553311B2 JP9881087A JP9881087A JPH0553311B2 JP H0553311 B2 JPH0553311 B2 JP H0553311B2 JP 9881087 A JP9881087 A JP 9881087A JP 9881087 A JP9881087 A JP 9881087A JP H0553311 B2 JPH0553311 B2 JP H0553311B2
Authority
JP
Japan
Prior art keywords
resin powder
layer
external
powder
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP9881087A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63262880A (ja
Inventor
Eiju Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP62098810A priority Critical patent/JPS63262880A/ja
Publication of JPS63262880A publication Critical patent/JPS63262880A/ja
Publication of JPH0553311B2 publication Critical patent/JPH0553311B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/02—Forming enclosures or casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP62098810A 1987-04-21 1987-04-21 セラミツク積層体電子部品の製造方法 Granted JPS63262880A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62098810A JPS63262880A (ja) 1987-04-21 1987-04-21 セラミツク積層体電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62098810A JPS63262880A (ja) 1987-04-21 1987-04-21 セラミツク積層体電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPS63262880A JPS63262880A (ja) 1988-10-31
JPH0553311B2 true JPH0553311B2 (enrdf_load_stackoverflow) 1993-08-09

Family

ID=14229686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62098810A Granted JPS63262880A (ja) 1987-04-21 1987-04-21 セラミツク積層体電子部品の製造方法

Country Status (1)

Country Link
JP (1) JPS63262880A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006318703A (ja) * 2005-05-11 2006-11-24 Kojima Press Co Ltd 電池パック

Also Published As

Publication number Publication date
JPS63262880A (ja) 1988-10-31

Similar Documents

Publication Publication Date Title
CN104465078B (zh) 电子部件及其制造方法
JPH0669005B2 (ja) 多層シ−トコイル
JPH0553311B2 (enrdf_load_stackoverflow)
JPS63288076A (ja) 圧電セラミック積層体電子部品の製造方法
JPS59110217A (ja) チツプ形状の圧電振動部品とその製造方法
JP3387130B2 (ja) 面実装用磁器コンデンサ
JPH01112805A (ja) 圧電部品の製造方法
JP4158452B2 (ja) 電子部品の製造方法
JPH03248410A (ja) セラミック部品の外部電極の製造方法
JPH0472684A (ja) 電歪効果素子
JP2805375B2 (ja) 磁気シールド型インダクタの製造方法
JPH0496286A (ja) 積層型圧電体の製造方法
JP3725980B2 (ja) コイル部品の製造方法
JPH0556033B2 (enrdf_load_stackoverflow)
JP2000269003A (ja) セラミックバリスタとその製造方法
JPH03185884A (ja) 積層型圧電アクチュエータの製造方法
JPH04105375A (ja) 圧電積層体の製造方法
JP3323156B2 (ja) チップ抵抗器
JPH0749859Y2 (ja) セラミック電子部品
JPH11126961A (ja) 電子部品の接合剤類塗布装置
JPH06291381A (ja) 積層型圧電素子の製造方法
JPH04287984A (ja) 電歪効果素子
JPH01277294A (ja) 圧電ブザの製造方法
JPH05191191A (ja) チップ型圧電部品の製造方法
JPH07302731A (ja) 電子部品の製造方法