JPS63262880A - セラミツク積層体電子部品の製造方法 - Google Patents
セラミツク積層体電子部品の製造方法Info
- Publication number
- JPS63262880A JPS63262880A JP62098810A JP9881087A JPS63262880A JP S63262880 A JPS63262880 A JP S63262880A JP 62098810 A JP62098810 A JP 62098810A JP 9881087 A JP9881087 A JP 9881087A JP S63262880 A JPS63262880 A JP S63262880A
- Authority
- JP
- Japan
- Prior art keywords
- resin powder
- layer
- external
- laminate
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 229920005989 resin Polymers 0.000 claims abstract description 40
- 239000011347 resin Substances 0.000 claims abstract description 40
- 239000000843 powder Substances 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 20
- 239000000919 ceramic Substances 0.000 claims abstract description 10
- 238000009503 electrostatic coating Methods 0.000 claims abstract description 6
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 9
- 230000000712 assembly Effects 0.000 abstract 2
- 238000000429 assembly Methods 0.000 abstract 2
- 238000002360 preparation method Methods 0.000 abstract 1
- 230000000873 masking effect Effects 0.000 description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007610 electrostatic coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/02—Forming enclosures or casings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62098810A JPS63262880A (ja) | 1987-04-21 | 1987-04-21 | セラミツク積層体電子部品の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62098810A JPS63262880A (ja) | 1987-04-21 | 1987-04-21 | セラミツク積層体電子部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63262880A true JPS63262880A (ja) | 1988-10-31 |
JPH0553311B2 JPH0553311B2 (enrdf_load_stackoverflow) | 1993-08-09 |
Family
ID=14229686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62098810A Granted JPS63262880A (ja) | 1987-04-21 | 1987-04-21 | セラミツク積層体電子部品の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63262880A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006318703A (ja) * | 2005-05-11 | 2006-11-24 | Kojima Press Co Ltd | 電池パック |
-
1987
- 1987-04-21 JP JP62098810A patent/JPS63262880A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006318703A (ja) * | 2005-05-11 | 2006-11-24 | Kojima Press Co Ltd | 電池パック |
Also Published As
Publication number | Publication date |
---|---|
JPH0553311B2 (enrdf_load_stackoverflow) | 1993-08-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4803763A (en) | Method of making a laminated piezoelectric transducer | |
JPH0669005B2 (ja) | 多層シ−トコイル | |
JPS63262880A (ja) | セラミツク積層体電子部品の製造方法 | |
JPS63288076A (ja) | 圧電セラミック積層体電子部品の製造方法 | |
JP3387130B2 (ja) | 面実装用磁器コンデンサ | |
JPH0631137U (ja) | 多連電子部品 | |
JPH01112805A (ja) | 圧電部品の製造方法 | |
JP2748548B2 (ja) | チップ形固体電解コンデンサ | |
JPS58178547A (ja) | 電気部品組立体およびその製造方法 | |
JP2518191B2 (ja) | 電子部品の製造方法 | |
JPH0217619A (ja) | チップ状電子部品 | |
JP3725980B2 (ja) | コイル部品の製造方法 | |
JPH0225230Y2 (enrdf_load_stackoverflow) | ||
JP2805375B2 (ja) | 磁気シールド型インダクタの製造方法 | |
JPH10199755A (ja) | 薄膜コンデンサ | |
JPH0496285A (ja) | 積層型圧電体 | |
JPS593886B2 (ja) | 圧電素子部品の製造方法 | |
JPH0365651B2 (enrdf_load_stackoverflow) | ||
JPS5953692B2 (ja) | 磁器回路素子 | |
JPH0334508A (ja) | 表面再酸化型半導体磁器コンデンサの製造方法 | |
JPH04105375A (ja) | 圧電積層体の製造方法 | |
JPH07283006A (ja) | 電気素子基板及びその製造方法 | |
JP2001085236A (ja) | 面実装型複合部品 | |
JPS6216532B2 (enrdf_load_stackoverflow) | ||
JPH01277294A (ja) | 圧電ブザの製造方法 |