JPS63262880A - Manufacture of ceramic-laminate electronic component - Google Patents

Abstract

PURPOSE:To eliminate the need for finishing and correction processes, and to facilitate and simplify preparation by a method wherein an external leading-out terminal assembly is thermocompression-bonded and connected, insulating resin powder is attached through electrostatic coating, one part of the powder is sucked and removed and the powder is melted and cured. CONSTITUTION:A plurality of ceramic electrostriction material layers 3, on one surfaces of which internal electrode layers 2 are formed respectively, are laminated, the end sections of the electrodes 2 exposed on both side faces as piezoelectric elements 1 are coated alternately with insulating layers 4 at every one layer, and external electrode layers 5 connecting the end sections of the electrodes 2 exposed are shaped. External leading-out terminal assemblies 6a, 6b are contact-bonded and connected at the central section of the layers 5 by the pushing of a heated pressure bar, both surfaces of the elements are masked with mask jigs, an outer circumference is coated electrostatically with resin powder to form a resin layer 9, and the resin powder of the terminal assemblies 6a, 6b is sucked and removed. When the layer 9 is melted and cured in a furnace, resin powder hardly adheres on the mask jigs, and ceramic laminate electronic components such as the piezoelectric elements are prepared easily and simply without finishing and correction processes.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing a ceramic laminate electronic component such as a piezoelectric element, and particularly to a method of connecting an external lead terminal and a method of packaging the same.

[Conventional technology]

FIG. 5 is a sectional view of an example of a laminated piezoelectric element manufactured by a conventional method after resin hardening.

The conventional manufacturing method includes a process of connecting a lead wire 11 by soldering to an external electrode layer 5 formed on the side surface of a laminate in which electrostrictive material layers 3 and internal electrode layers 2 are alternately laminated; The piezoelectric element 1 is sandwiched between the upper and lower surfaces of the element 1 by the masking jig 8 to prevent the insulating exterior resin from adhering to it.
a step of attaching the exterior resin 12 by a fluidized dipping method in which the resin powder is heated to about 100° C. and immersed in resin powder powder (not shown); and a heat curing step to completely harden the exterior resin. It consisted of

[Problem that the invention seeks to solve]

In the conventional manufacturing method described above, the resin powder also adheres to the masking jig 8 and the lead wires 11 and hardens, resulting in the removal of the piezoelectric element, the paring treatment of the piezoelectric element, the removal of the resin attached to the lead wires, and The drawback is that it takes a huge amount of time to clean the jig, and the process is complicated.
The disadvantage is that it is difficult to automate the manufacturing process.

[Means for solving problems]

The method for manufacturing a ceramic laminate electronic component of the present invention includes the steps of connecting an external lead terminal plate made of a metal material to an external electrode layer by thermocompression bonding, and applying insulating resin powder to the outer periphery of the laminate by electrostatic coating. a step of suctioning and removing only the insulating resin powder adhering to the external lead-out terminal plate made of metal, and a step of melting and hardening the insulating resin powder.

(Function) In this way, among the insulating resin powder that has adhered to the laminate by the electrostatic coating method, unnecessary powder that has adhered to the vicinity of the external lead terminal board can be easily removed by suctioning it with the suction nozzle. Next, the masking jig is removed and the resin powder is cured, eliminating the need for subsequent finishing and modification steps for the completed electronic component.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view of a piezoelectric element manufactured by an embodiment of the method for manufacturing a ceramic laminate electronic component of the present invention, and FIG.
Figures (a) and (b) are respectively a perspective view and a cross-sectional view of the piezoelectric element in the process of connecting the external lead terminal, and Figure 3 shows the piezoelectric element (
FIG. 4 is a cross-sectional view of the piezoelectric element after the resin powder adhering to the vicinity of the external lead-out terminal has been removed by a suction nozzle.

In the laminated piezoelectric element 1, internal electrode layers 2 and electrostrictive material layers 3 are alternately laminated, and the ends of the internal electrode layers 2 exposed on both opposing sides are covered with an insulating layer 4 every other layer. The ends of the internal electrode layer 2 that are not covered are electrically connected by an external electrode layer 5 made of a conductive material, and external lead terminal plates 6α and 6b made of oxygen-free copper are connected to the external electrode layer 5. has been done. In this piezoelectric element 1, when a predetermined voltage is applied between the external lead terminal plates 6a and 6b, the voltage is applied to the upper and lower surfaces of each electrostrictive material layer 3, and the same strain is generated in each electrostrictive material layer 3. As a result, desired pressure is generated on the upper and lower surfaces of the piezoelectric element, which is used in printer heads and the like.

Next, each process of this example will be explained.

First, a plurality of ceramic electrostrictive material layers 1 each having an internal electrode layer 2 formed on one side are sequentially laminated so that each electrostrictive material layer 1 is in contact with another internal electrode layer 2, and the opposite side of this laminated body is The ends of the internal electrode layer 2 exposed on both sides are covered with an insulating layer 4 every other layer and alternately between both sides, and the exposed ends of the internal electrode layer 2 are each connected with a conductive layer 4. An external electrode layer 5 made of a material is formed. Next, by pressing the crimping frame 7 heated to about 400° C. with a force of 1 for 1 second, an L-shaped external drawer made of oxygen-free copper is formed approximately in the center of the external electrode layer 5. Connect the terminal boards 6a and 6b (
2(a), (b)) Next, the top and bottom surfaces of the piezoelectric element 1 are sandwiched between masking jigs 8 made of synthetic resin, placed in an electrostatic coating machine (not shown), and heated with a 50 KV DC current. The resin powder charged by the bias is blown up with air to create the piezoelectric element 1.
to form a resin powder layer 9 (FIG. 3). Next, the resin powder adhering to the external lead terminal boards 6a, 6b is removed by suction nozzle 10 (Fig. 4), the masking jig 8 is removed, and the external lead terminal boards 6a, 6b are removed by suction.
In step b, the piezoelectric element 1 is suspended in an oven (not shown), and the resin powder layer 9 is melted and hardened to form the resin layer 9 shown in FIG. 1, thereby obtaining the laminated piezoelectric element 1. Note that almost no resin powder adheres to the masking jig 8, and even a small amount of resin powder that adheres can be easily removed.

(Effects of the Invention) As explained above, the present invention involves bonding an external lead-out terminal plate to an external electrode layer by thermocompression, then masking the upper and lower surfaces with a masking jig and forming a resin powder layer by electrostatic coating. , completely remove the unnecessary part of the resin powder on the external lead terminal board,
After that, by curing the resin powder, (1) the external terminal board is connected to the external electrode layer by thermocompression bonding instead of the lead wire, eliminating the need for a flux cleaning process, and (2) making it possible to use the masking jig. The attached resin is also in powder form and can be easily removed. (3) Processes can be simplified by eliminating the need for finishing and modification processes for finished electronic components, making it possible to significantly reduce costs. , it is possible to achieve the effect of achieving automation of the manufacturing line for laminated electronic components.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of a piezoelectric element manufactured by the method of manufacturing a ceramic laminate electronic component of the present invention, and FIG.
b) are respectively a perspective view and a sectional view of the piezoelectric element in the process of connecting the external lead terminal, and FIG. 3 is a sectional view of the piezoelectric element (laminate) immediately after forming a resin powder layer by electrostatic coating. Figure 4 is a cross-sectional view of the piezoelectric element after the resin powder adhering to the vicinity of the external lead-out terminal has been removed using a suction nozzle.
FIG. 5 is a cross-sectional view of a conventional piezoelectric element after resin hardening. DESCRIPTION OF SYMBOLS 1... Laminated piezoelectric element, 2... Internal electrode layer, 3... Electrostrictive material layer, 4... Insulating layer, 5... External electrode layer, 6a, 6b... External drawer Terminal board, 7... Crimp frame, 8... Masking jig, 9... Resin powder layer (resin layer), 10... Suction nozzle, 11... Lead wire, 12... Exterior resin .

Claims (1)

[Claims] An external electrode in which ceramic layers and internal electrodes are alternately laminated to form a laminate, and end portions of the internal electrodes are connected every other layer to each of opposing sides of the laminate. In the method for manufacturing a ceramic laminate electronic component, the method comprises: forming a layer, attaching an external lead terminal to the external electrode layer, and then covering the laminate with an insulating resin layer, wherein the external electrode layer is provided with an external lead terminal made of a metal material. A process of connecting the terminal boards by thermocompression bonding, a process of adhering insulating resin powder to the outer periphery of the laminate by electrostatic coating, and sucking and removing only the insulating resin powder adhering to the external lead-out terminals. A method for manufacturing a ceramic laminate electronic component, comprising: a step of melting and hardening the insulating resin powder.