JPH05506871A - 半結晶質半芳香族コポリアミド - Google Patents
半結晶質半芳香族コポリアミドInfo
- Publication number
- JPH05506871A JPH05506871A JP91506480A JP50648091A JPH05506871A JP H05506871 A JPH05506871 A JP H05506871A JP 91506480 A JP91506480 A JP 91506480A JP 50648091 A JP50648091 A JP 50648091A JP H05506871 A JPH05506871 A JP H05506871A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- range
- pressure
- copolyamide
- iii
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920006024 semi-aromatic copolyamide Polymers 0.000 title claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 61
- 239000000203 mixture Substances 0.000 claims description 58
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 51
- 238000000034 method Methods 0.000 claims description 45
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 40
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 36
- 238000006068 polycondensation reaction Methods 0.000 claims description 35
- 229920000642 polymer Polymers 0.000 claims description 33
- 150000004985 diamines Chemical class 0.000 claims description 28
- 238000004821 distillation Methods 0.000 claims description 28
- 229910052757 nitrogen Inorganic materials 0.000 claims description 26
- 150000001412 amines Chemical class 0.000 claims description 24
- 150000003839 salts Chemical class 0.000 claims description 19
- 239000000945 filler Substances 0.000 claims description 18
- 239000000243 solution Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 15
- 239000003365 glass fiber Substances 0.000 claims description 14
- -1 cyclic amine Chemical class 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 13
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 claims description 12
- 239000002904 solvent Substances 0.000 claims description 12
- 239000004952 Polyamide Substances 0.000 claims description 11
- 229920002647 polyamide Polymers 0.000 claims description 11
- 239000012298 atmosphere Substances 0.000 claims description 10
- 230000002787 reinforcement Effects 0.000 claims description 10
- MRNZSTMRDWRNNR-UHFFFAOYSA-N bis(hexamethylene)triamine Chemical compound NCCCCCCNCCCCCCN MRNZSTMRDWRNNR-UHFFFAOYSA-N 0.000 claims description 8
- 238000007872 degassing Methods 0.000 claims description 8
- 239000000835 fiber Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 239000012071 phase Substances 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 6
- 238000009833 condensation Methods 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 238000007112 amidation reaction Methods 0.000 claims description 5
- 239000003054 catalyst Substances 0.000 claims description 5
- 239000007789 gas Substances 0.000 claims description 5
- 239000004615 ingredient Substances 0.000 claims description 5
- 238000001746 injection moulding Methods 0.000 claims description 5
- 239000007790 solid phase Substances 0.000 claims description 5
- 150000001408 amides Chemical class 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 238000009835 boiling Methods 0.000 claims description 3
- 239000012765 fibrous filler Substances 0.000 claims description 3
- 230000009477 glass transition Effects 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims description 3
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- 239000010425 asbestos Substances 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- 238000011049 filling Methods 0.000 claims description 2
- 239000011261 inert gas Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052752 metalloid Inorganic materials 0.000 claims description 2
- 150000002738 metalloids Chemical class 0.000 claims description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- 229910052895 riebeckite Inorganic materials 0.000 claims description 2
- 230000009435 amidation Effects 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 239000003610 charcoal Substances 0.000 claims 1
- 125000004122 cyclic group Chemical group 0.000 claims 1
- 238000005516 engineering process Methods 0.000 claims 1
- 238000000227 grinding Methods 0.000 claims 1
- 239000012943 hotmelt Substances 0.000 claims 1
- 239000003586 protic polar solvent Substances 0.000 claims 1
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 31
- 239000007864 aqueous solution Substances 0.000 description 13
- 238000005259 measurement Methods 0.000 description 13
- 239000002253 acid Substances 0.000 description 12
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 12
- 238000002425 crystallisation Methods 0.000 description 10
- 230000008025 crystallization Effects 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 10
- 238000002347 injection Methods 0.000 description 10
- 239000007924 injection Substances 0.000 description 10
- 239000000376 reactant Substances 0.000 description 10
- 238000000465 moulding Methods 0.000 description 7
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 7
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000010926 purge Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 5
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 5
- JEGMWWXJUXDNJN-UHFFFAOYSA-N 3-methylpiperidine Chemical compound CC1CCCNC1 JEGMWWXJUXDNJN-UHFFFAOYSA-N 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 238000004587 chromatography analysis Methods 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 4
- 239000002657 fibrous material Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 4
- 229920006114 semi-crystalline semi-aromatic polyamide Polymers 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- OGBVRMYSNSKIEF-UHFFFAOYSA-N Benzylphosphonic acid Chemical compound OP(O)(=O)CC1=CC=CC=C1 OGBVRMYSNSKIEF-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000000930 thermomechanical effect Effects 0.000 description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000012267 brine Substances 0.000 description 2
- 238000007707 calorimetry Methods 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000002026 chloroform extract Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000005984 hydrogenation reaction Methods 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- YACKEPLHDIMKIO-UHFFFAOYSA-N methylphosphonic acid Chemical compound CP(O)(O)=O YACKEPLHDIMKIO-UHFFFAOYSA-N 0.000 description 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 159000000001 potassium salts Chemical class 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000003303 reheating Methods 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 238000007363 ring formation reaction Methods 0.000 description 2
- 239000012266 salt solution Substances 0.000 description 2
- 230000002000 scavenging effect Effects 0.000 description 2
- 229920006126 semicrystalline polymer Polymers 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 2
- 238000009987 spinning Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 2
- PAMIQIKDUOTOBW-UHFFFAOYSA-N 1-methylpiperidine Chemical compound CN1CCCCC1 PAMIQIKDUOTOBW-UHFFFAOYSA-N 0.000 description 1
- XGJHPGPVESLKKD-UHFFFAOYSA-N 2-ethylbutane-1,4-diamine Chemical compound CCC(CN)CCN XGJHPGPVESLKKD-UHFFFAOYSA-N 0.000 description 1
- RVHOBHMAPRVOLO-UHFFFAOYSA-N 2-ethylbutanedioic acid Chemical compound CCC(C(O)=O)CC(O)=O RVHOBHMAPRVOLO-UHFFFAOYSA-N 0.000 description 1
- GGQJPAQXCYUEKB-UHFFFAOYSA-N 2-methylbutane-1,4-diamine Chemical compound NCC(C)CCN GGQJPAQXCYUEKB-UHFFFAOYSA-N 0.000 description 1
- AQYCMVICBNBXNA-UHFFFAOYSA-N 2-methylglutaric acid Chemical compound OC(=O)C(C)CCC(O)=O AQYCMVICBNBXNA-UHFFFAOYSA-N 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- JJHHIJFTHRNPIK-UHFFFAOYSA-N Diphenyl sulfoxide Chemical compound C=1C=CC=CC=1S(=O)C1=CC=CC=C1 JJHHIJFTHRNPIK-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 238000012696 Interfacial polycondensation Methods 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- QLZHNIAADXEJJP-UHFFFAOYSA-N Phenylphosphonic acid Chemical compound OP(O)(=O)C1=CC=CC=C1 QLZHNIAADXEJJP-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 241001619461 Poria <basidiomycete fungus> Species 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- SQVRNKJHWKZAKO-UHFFFAOYSA-N beta-N-Acetyl-D-neuraminic acid Natural products CC(=O)NC1C(O)CC(O)(C(O)=O)OC1C(O)C(O)CO SQVRNKJHWKZAKO-UHFFFAOYSA-N 0.000 description 1
- 239000007844 bleaching agent Substances 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- LGMGVCQVPSHUCO-UHFFFAOYSA-N dibenzylphosphinic acid Chemical compound C=1C=CC=CC=1CP(=O)(O)CC1=CC=CC=C1 LGMGVCQVPSHUCO-UHFFFAOYSA-N 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 238000006471 dimerization reaction Methods 0.000 description 1
- GOJNABIZVJCYFL-UHFFFAOYSA-N dimethylphosphinic acid Chemical compound CP(C)(O)=O GOJNABIZVJCYFL-UHFFFAOYSA-N 0.000 description 1
- BEQVQKJCLJBTKZ-UHFFFAOYSA-N diphenylphosphinic acid Chemical compound C=1C=CC=CC=1P(=O)(O)C1=CC=CC=C1 BEQVQKJCLJBTKZ-UHFFFAOYSA-N 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- GUVUOGQBMYCBQP-UHFFFAOYSA-N dmpu Chemical compound CN1CCCN(C)C1=O GUVUOGQBMYCBQP-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003623 enhancer Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 229920006017 homo-polyamide Polymers 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000010813 internal standard method Methods 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- RMJCJLHZCBFPDN-UHFFFAOYSA-N methyl(phenyl)phosphinic acid Chemical compound CP(O)(=O)C1=CC=CC=C1 RMJCJLHZCBFPDN-UHFFFAOYSA-N 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 125000004334 oxygen containing inorganic group Chemical group 0.000 description 1
- MLCHBQKMVKNBOV-UHFFFAOYSA-N phenylphosphinic acid Chemical compound OP(=O)C1=CC=CC=C1 MLCHBQKMVKNBOV-UHFFFAOYSA-N 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000003141 primary amines Chemical group 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229920006012 semi-aromatic polyamide Polymers 0.000 description 1
- SQVRNKJHWKZAKO-OQPLDHBCSA-N sialic acid Chemical compound CC(=O)N[C@@H]1[C@@H](O)C[C@@](O)(C(O)=O)OC1[C@H](O)[C@H](O)CO SQVRNKJHWKZAKO-OQPLDHBCSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- SEEPANYCNGTZFQ-UHFFFAOYSA-N sulfadiazine Chemical compound C1=CC(N)=CC=C1S(=O)(=O)NC1=NC=CC=N1 SEEPANYCNGTZFQ-UHFFFAOYSA-N 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003504 terephthalic acids Chemical class 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 229910000634 wood's metal Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Polyamides (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Pyridine Compounds (AREA)
Abstract
Description
Claims (12)
- 1.テレフタル酸及び2−メチルペンタメチレンジアミンを含む反応成分から得 られる半結晶質半芳香族コポリアミドであって、 少なくとも120℃のガラス転移温度Tgを有し、且つ、少なくとも1種の充填 材又は強化材を充填され次いで成形された時に1.8MPaにおいて少なくとも 240℃の荷重撓み温度(NF規格T−51005による)を有し、 次の点: 構造中に式(I)、(II)、(III)及び(IV):(I)構造:▲数式、 化学式、表等があります▼(II)構造:▲数式、化学式、表等があります▼( III)構造:▲数式、化学式、表等があります▼(IV)構造:−HN−(C H2)6−NH−の繰返し単位を含み、 式(III)の単位は随意であること;単位(II)と単位(III)と単位( IV)との合計に対する単位(I)の分子比が1であること;(II)と(II I)との混合物中の単位(III)の量が0〜5モル%の範囲内にあり、該混合 物中の単位(II)の量が100〜95モル%の範囲内にあること;(II)と (III)と(IV)との混合物中の単位(IV)の量が40〜90モル%の範 囲内にあること;さらに、ビスヘキサメチレントリアミンから誘導される規定外 単位を、得られるコポリアミドの重量に対するビスヘキサメチレントリアミンの 重量百分率で表わして0.5%より低い含有率で含むこと;を特徴とする、前記 コポリアミド。
- 2.(II)と(III)と(IV)との混合物中の単位(IV)の量が45〜 75モル%の範囲内にある構造を持つことを特徴とする、請求の範囲第1項記載 のコポリアミド。
- 3.連鎖制限性の環状アミン型末端基の濃度が70meq/kgより低いことを 特徴とする、請求の範囲第1及び2項のいずれかに記載のコポリアミド。
- 4.熱溶融重縮合技術から成る請求の範囲第1〜3項のいずれかに記載のコポリ アミドの製造方法であって、(i)同数若しくはほとんど同数のC00H及びN H2基をもたらす化学量論的量若しくはほとんど化学量論的量の二酸及びジアミ ン、又はそれらの化学量論的塩{随意に過剰分の遊離の二酸及び(若しくは)ジ アミンを含有するもの}のいずれか、 (2i)下記の工程1における蒸留が下記の特定温度(T1及びT2)及び特定 圧力(P)条件下で実施されるのに充分な量の水 並びに (3i)随意としての触媒 を含有する出発組成物の重縮合を、 オートクレーブ型密閉系中で操作し、且つ次の工程: ・工程1:オートクレーブを密閉して出発組成物の温度を170℃〜240℃の 範囲内にある所定の値T1まで漸次上昇させ、次いで、得られる水蒸気の自己圧 に等しい0.7〜2.6MPaの範囲内にある一定圧力Pにおいて、反応塊中に 存在する水を定常蒸留によって除去しながら、同時に、反応塊の温度を蒸留前に 達していた温度T1より高く且つ215°C〜320°Cの範囲内にある値T2 まで漸次上昇させる工程;・工程2:圧力を自己圧の値から大気圧値まで漸次低 下させ且つ随意に反応塊の温度を圧力低下前に達していた温度T2より約10〜 数十℃高い値T3まで同時に上昇させ、その際に、この圧力低下期間の量水の定 常蒸留を確保し続ける工程; ・工程3:反応塊を所定の期間撹伴しながら、工程2の終わりに得られた温度T 2又はT3と同じ又はそれより高い反応塊温度で、大気圧下及び随意に(又は) 減圧下で、所望の分子特性及び粘度特性を持つポリアミドを得るのに充分な期間 操作することによって重縮合を完了させる工程: を順次実施する ことによって実施することを特徴とする、前記製造方法。
- 5.工程1を実施した後に、工程2及び3の代わりに次の新たな工程: ・工程2′:素早く5分〜30分の期間で反応器を空にし、この期間の際に、水 蒸気の自己圧を自己圧の値から大気圧値まで低下させ、操作を不活性(窒素)雰 囲気下で実施しながら、生成したプレポリマーを回収し、次いでこれを冷却し、 粉砕して粉末状にする工程; ・工程3′:得られた粉末状プレポリマーの後縮合を、・固相において、随意に 不活性ガス(窒素)の存在下で、大気圧値〜それより低い0.1×102Paの 値の範囲内の圧力に保った反応器内で、200°C〜280℃の範囲内の温度で 、所望の分子特性及び粘度特性を有するコポリアミドを得るのに充分な10分〜 5時間の範囲内の期間操作するか、・溶融相において、1個以上のスクリューを 有する脱ガス押出機(該脱ガス押出機の必須の運転パラメーターは310°C〜 360℃の範囲内にある反応帯域温度、大気圧値〜それより低い0.1×102 Paの値の範囲内にあるこの帯域の脱蔵圧力及び30秒〜5分の範囲内にある脱 ガス押出機中のプレポリマーの滞留時間から成る)中で操作するか 又は ・溶融相における後縮合と固相における後縮合とを組み合わせるか のいずれかによって実施することによって、重縮合完了反応を実施する工程: を順次実施することを特徴とする、請求の範囲第4項記載の製造方法。
- 6.請求の範囲第1〜3項のいずれかに記載のコポリアミドの製造方法であって 、溶液状で実施される熱重縮合技術から成り、次の工程: ・工程1′′:不活性雰囲気(窒素)下で操作し、請求の範囲第4項記載の成分 (i)及び(3i)を含有させた出発組成物を220°Cより高い沸点を持つ非 プロトン系極性溶媒又はかかる溶媒の混合物中に20°C〜30℃の周囲温度に おいて溶解させ、次いで得られた溶液の温度を190°C〜220°Cの範囲内 の所望の反応温度まで上昇させ、アミド化反応による水を20分〜2時間の範囲 内の時間をかけて大気圧下での定常蒸留によって除去する工程; ・工程2′′:不活性雰囲気下で操作し、反応溶液の温度を用いた溶媒の沸点よ り高い値まで上昇させ、次いでアミド化による水の残り及び存在させた溶媒を大 気圧下での蒸留によって除去する工程; ・工程3′′:溶媒を除去した後に、300〜340℃の範囲内の温度において 、0.1×102Pa〜1×102Paの範囲内にある減圧下で、所望の分子特 性及び粘度特性を持つコポリアミドを得るのに充分な10分〜1時間の範囲内の 期間(減圧にするまでの時間も含む)操作して、反応塊を反応させることによっ て重縮合を完了させる工程: を順次実施することを特徴とする、前記製造方法。
- 7.請求の範囲第1〜3項のいずれかに記載のコポリアミドから得られた成形品 、フィラメント又はフィルムのような造形品。
- 8.(α)テレフタル酸(又はその誘導体)及び2−メチルペンタメチレンジア ミンを含む反応成分から得られる半結晶質半芳香族コポリアミド並びに(β)少 なくとも1種の充填材又は強化材(ポリマーと充填材又は強化材との合計重量の 80%を越えない量)を含み、特に射出成形を実施するための組成物であって、 少なくとも1種の繊維質充填材又は強化材を用いて組成物を形成させ、次いで成 形した時に1.8MPaにおいて少なくとも240°Cの荷重撓み温度を示し、 コポリアミド成分が次の点: ・構造中に式(I)、(II)、(III)及び(IV):(I)構造:▲数式 、化学式、表等があります▼(II)構造:▲数式、化学式、表等があります▼ (III)構造:▲数式、化学式、表等があります▼(IV)構造:−HN−( CH2)6−NH−の繰返し単位を含み、 式(III)の単位は随意であること;・単位(II)と単位(III)と単位 (IV)との合計に対する単位(I)の分子比が1であること;・(II)と( III)との混合物中の単位(III)の量が0〜5モル%の範囲内にあり、該 混合物中の単位(II)の量が100〜95モル%の範囲内にあること;・(I I)と(III)と(IV)との混合物中の単位(IV)の量が40〜90モル %の範囲内にあること;・さらに、ビスヘキサメチレントリアミンから誘導され る規定外単位を、得られるコポリアミドの重量に対するビスヘキサメチレントリ アミンの重量百分率で表わして0.5%より低い含有率で含むこと:に従って規 定されることを特徴とする、前記組成物。
- 9.コポリアミド成分が(II)と(III)と(IV)との混合物中の単位( IV)の量が45〜75モル%の範囲内にある構造を持つことを特徴とする、請 求の範囲第8項記載の組成物。
- 10.コポリアミド成分中の連鎖制限性の環状アミン型末端基の濃度が70me q/kgより低いことを特徴とする、請求の範囲第8及び9項のいずれかに記載 の組成物。
- 11.充填材又は強化材が、石綿繊維、炭素繊維、金属若しくはメタロイドの炭 化物若しくは窒化物の繊維、ガラス繊維、有機繊維、パロチニ、雲母薄片、タル ク又はこれらの2種以上の物質の混合物より成る群から選択される、請求の範囲 第8〜10項のいずれがに記載の組成物。
- 12.請求の範囲第8〜11項のいずれかに記載の組成物から得られる成形品の 形の造形品。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR90/04398 | 1990-03-30 | ||
FR9004398A FR2660316B1 (fr) | 1990-03-30 | 1990-03-30 | Copolyamides semi-aromatiques semi-cristallins obtenus a partir d'acide terephtalique et de melanges comprenant une alkylpentamethylenediamine et de l'hexamethylenediamine. |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH05506871A true JPH05506871A (ja) | 1993-10-07 |
JP3167719B2 JP3167719B2 (ja) | 2001-05-21 |
Family
ID=9395486
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50648091A Expired - Lifetime JP3167719B2 (ja) | 1990-03-30 | 1991-03-22 | 半結晶質半芳香族コポリアミド |
Country Status (9)
Country | Link |
---|---|
US (2) | US5322923A (ja) |
EP (1) | EP0522027B1 (ja) |
JP (1) | JP3167719B2 (ja) |
AT (1) | ATE119176T1 (ja) |
DE (1) | DE69107840T2 (ja) |
DK (1) | DK0522027T3 (ja) |
ES (1) | ES2069288T3 (ja) |
FR (1) | FR2660316B1 (ja) |
WO (1) | WO1991015537A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995020630A1 (en) * | 1994-01-26 | 1995-08-03 | E.I. Du Pont De Nemours And Company | Polyamide resin composition and molding thereof |
JP2008239908A (ja) * | 2007-03-29 | 2008-10-09 | Mitsui Chemicals Inc | ポリアミドの製造方法 |
JP2011016913A (ja) * | 2009-07-08 | 2011-01-27 | Asahi Kasei Chemicals Corp | ポリアミド組成物 |
JP2011016912A (ja) * | 2009-07-08 | 2011-01-27 | Asahi Kasei Chemicals Corp | ポリアミド組成物 |
JP2014518301A (ja) * | 2011-07-01 | 2014-07-28 | ディーエスエム アイピー アセッツ ビー.ブイ. | 分枝ポリアミド |
JP2019529608A (ja) * | 2016-09-28 | 2019-10-17 | ディーエスエム アイピー アセッツ ビー.ブイ.Dsm Ip Assets B.V. | ポリマー組成物、成形部品およびそれを製造するための方法 |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2097615C (en) * | 1990-12-12 | 2002-12-17 | E.I. Du Pont De Nemours And Company | Terephthalic acid copolyamides |
US5302691A (en) * | 1992-05-19 | 1994-04-12 | Du Pont Canada Inc. | Manufacture of terephthalic acid/2-methylpentamethylene diamine/hexamethylene diamine copolyamides |
US5516882A (en) * | 1992-05-19 | 1996-05-14 | E. I. Du Pont De Nemours And Company | Manufacture of terephthalic acid copolyamides |
GB9304403D0 (en) * | 1993-03-04 | 1993-04-21 | Du Pont Canada | Manufacture of partially aromatic polyamides |
US5500473A (en) * | 1993-04-30 | 1996-03-19 | E. I. Du Pont De Nemours And Company | Mineral filled copolyamide compositions |
GB9311754D0 (en) * | 1993-06-08 | 1993-07-28 | Du Pont Canada | High pressure process for the manufacture of terephthalic acid copolyamides |
US5750639A (en) * | 1994-01-26 | 1998-05-12 | E. I. Du Pont De Nemours And Company | Polyamide resin composition and molding thereof |
TW339343B (en) * | 1994-08-17 | 1998-09-01 | Toray Industries | Copolymerized polyamide and a production process/thereof |
DE19528901B4 (de) * | 1995-08-05 | 2004-08-05 | A-Z Ausrüstung und Zubehör GmbH & Co KG | Höhenverstellbarer Fuß für Küchengeräte oder Möbel |
JP3824654B2 (ja) * | 1996-05-16 | 2006-09-20 | デュポン カナダ インコーポレイテッド | 成形後の収縮および機械特性に優れた半結晶性および半芳香族の3元重合体 |
US5763561A (en) * | 1996-09-06 | 1998-06-09 | Amoco Corporation | Polyamide compositions having improved thermal stability |
US5981692A (en) * | 1997-05-15 | 1999-11-09 | Du Pont Canada Inc. | Semi-crystalline, semi-aromatic terpolymers with superior post-molding shrinkage and balance of mechanical performance |
US6576340B1 (en) * | 1999-11-12 | 2003-06-10 | E. I. Du Pont De Nemours And Company | Acid dyeable polyester compositions |
DE50113321D1 (de) * | 2001-03-15 | 2008-01-10 | Ems Chemie Ag | Gefüllte, thermoplastische Polyamidformmassen mit verbesserten Eigenschaften |
EP1266930B1 (en) * | 2001-06-05 | 2006-12-20 | Kuraray Co., Ltd. | Polyamide composition |
US6723799B2 (en) | 2001-08-24 | 2004-04-20 | E I. Du Pont De Nemours And Company | Acid-dyeable polymer compositions |
US6713653B2 (en) | 2001-08-24 | 2004-03-30 | E. I. Du Pont De Nemours And Company | Polyamines and polymers made therewith |
DE502008000140D1 (de) | 2007-05-03 | 2009-11-26 | Ems Patent Ag | Teilaromatische Polyamidformmassen und deren Verwendungen |
FR2934864B1 (fr) * | 2008-08-08 | 2012-05-25 | Arkema France | Polyamide semi-aromatique a terminaison de chaine |
WO2010081872A2 (en) * | 2009-01-16 | 2010-07-22 | Dsm Ip Assets B.V. | Polymer optical interconnect component |
FR2946652B1 (fr) * | 2009-06-12 | 2012-07-20 | Rhodia Operations | Polyamide de haute viscosite. |
WO2011015790A2 (fr) * | 2009-08-06 | 2011-02-10 | Arkema France | Composition comprenant un copolyamide et une polyolefine reticulee |
US8530571B2 (en) * | 2009-12-21 | 2013-09-10 | E I Du Pont De Nemours And Company | Polyamide compositions having high acid ends |
US8784719B2 (en) | 2011-06-30 | 2014-07-22 | Sabic Global Technologies B.V. | Flow in reinforced polyimide compositions |
US9732190B2 (en) * | 2011-08-17 | 2017-08-15 | Toray Industries Inc. | Production method of crystalline polyamide resin |
FR3002233B1 (fr) | 2013-02-18 | 2016-01-22 | Arkema France | Structure thermoplastique pour le transport de fluide frigorigene |
FR3002180B1 (fr) | 2013-02-18 | 2017-12-29 | Arkema France | Utilisation de copolyamide semi-aromatique pour le transport de fluide frigorigene |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4921315A (ja) * | 1972-06-20 | 1974-02-25 | ||
DE2542938A1 (de) * | 1975-09-26 | 1977-04-07 | Dynamit Nobel Ag | Transparente polyamide |
DE2627342A1 (de) * | 1976-06-18 | 1977-12-22 | Dynamit Nobel Ag | Verfahren zur herstellung von gegebenenfalls modifiziertem poly- (alkylpentamethylenterephthalamid) |
FR2632958B1 (fr) * | 1988-06-15 | 1990-10-05 | Rhone Poulenc Chimie | Polyamides amorphes transparents ayant une temperature de transition vitreuse elevee |
FR2632959B1 (fr) * | 1988-06-15 | 1990-10-05 | Rhone Poulenc Chimie | Polyamides semi-aromatiques cristallises ayant une temperature de fusion inferieure a 290 oc |
FR2643377B1 (fr) * | 1989-02-21 | 1992-09-11 | Rhone Poulenc Chimie | Procede de preparation de polyamides semi-aromatiques comprenant des restes d'acide(s) dicarboxylique(s) aromatique(s) et d'alkylpentamethylenediamine |
-
1990
- 1990-03-30 FR FR9004398A patent/FR2660316B1/fr not_active Expired - Fee Related
-
1991
- 1991-03-22 WO PCT/FR1991/000235 patent/WO1991015537A1/fr active IP Right Grant
- 1991-03-22 AT AT91907238T patent/ATE119176T1/de not_active IP Right Cessation
- 1991-03-22 US US07/930,528 patent/US5322923A/en not_active Expired - Lifetime
- 1991-03-22 DE DE69107840T patent/DE69107840T2/de not_active Expired - Lifetime
- 1991-03-22 EP EP19910907238 patent/EP0522027B1/fr not_active Expired - Lifetime
- 1991-03-22 ES ES91907238T patent/ES2069288T3/es not_active Expired - Lifetime
- 1991-03-22 JP JP50648091A patent/JP3167719B2/ja not_active Expired - Lifetime
- 1991-03-22 DK DK91907238T patent/DK0522027T3/da active
-
1994
- 1994-03-16 US US08/213,698 patent/US5440006A/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995020630A1 (en) * | 1994-01-26 | 1995-08-03 | E.I. Du Pont De Nemours And Company | Polyamide resin composition and molding thereof |
JP2008239908A (ja) * | 2007-03-29 | 2008-10-09 | Mitsui Chemicals Inc | ポリアミドの製造方法 |
JP2011016913A (ja) * | 2009-07-08 | 2011-01-27 | Asahi Kasei Chemicals Corp | ポリアミド組成物 |
JP2011016912A (ja) * | 2009-07-08 | 2011-01-27 | Asahi Kasei Chemicals Corp | ポリアミド組成物 |
JP2014518301A (ja) * | 2011-07-01 | 2014-07-28 | ディーエスエム アイピー アセッツ ビー.ブイ. | 分枝ポリアミド |
JP2019529608A (ja) * | 2016-09-28 | 2019-10-17 | ディーエスエム アイピー アセッツ ビー.ブイ.Dsm Ip Assets B.V. | ポリマー組成物、成形部品およびそれを製造するための方法 |
Also Published As
Publication number | Publication date |
---|---|
ES2069288T3 (es) | 1995-05-01 |
DE69107840D1 (de) | 1995-04-06 |
US5440006A (en) | 1995-08-08 |
ATE119176T1 (de) | 1995-03-15 |
WO1991015537A1 (fr) | 1991-10-17 |
DE69107840T2 (de) | 1995-07-06 |
FR2660316B1 (fr) | 1994-03-11 |
DK0522027T3 (da) | 1995-06-26 |
US5322923A (en) | 1994-06-21 |
EP0522027A1 (fr) | 1993-01-13 |
JP3167719B2 (ja) | 2001-05-21 |
FR2660316A1 (fr) | 1991-10-04 |
EP0522027B1 (fr) | 1995-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH05506871A (ja) | 半結晶質半芳香族コポリアミド | |
JP2780902B2 (ja) | 新規ポリアミドと、それで作られた製品 | |
KR0168468B1 (ko) | 폴리아미드 및 폴리아미드 조성물 | |
JP3449483B2 (ja) | ポリアミド及びその製造法並びにそれを含有する組成物 | |
JP4676122B2 (ja) | テトラメチレンテレフタルアミドおよびヘキサメチレンテレフタルアミドに基づくコポリアミド | |
US5310860A (en) | Process for the preparation of polyamides with oligomer formation | |
JP3741762B2 (ja) | 無色透明コポリアミドとその製法、およびこれらコポリアミド、それらのブレンドまたはアロイから製造される成形品 | |
EP0121983B2 (en) | Polyamide compositions from mixtures of trimethylhexamethylene diamine, hexamethylene diamine and diacids | |
BRPI0707219B1 (pt) | Poliamida semi-aromática semicristalina, seu processo de preparação, composição de polímero, uso da referida poliamida ou da composição de polímero, parte moldada e seu uso | |
JPH07508064A (ja) | テレフタル酸コポリアミドの製造 | |
JPS5946974B2 (ja) | 透明な高分子コポリアミド | |
JP6060424B2 (ja) | 種々のブロックを有する分枝ポリアミド | |
JP2012503695A (ja) | 補強されたポリアミド組成物 | |
JPH0357137B2 (ja) | ||
CN110964316A (zh) | 聚酰胺组合物、成型品和半芳香族聚酰胺 | |
JPWO2013062089A1 (ja) | ポリアミド樹脂及びそれからなる成形品 | |
KR20150135737A (ko) | 공중합 폴리아미드 수지, 이의 제조방법 및 이를 포함하는 성형품 | |
KR101771781B1 (ko) | 폴리아미드에스테르 수지, 이의 제조방법 및 이를 포함하는 성형품 | |
CN113015759B (zh) | 用于生产透明聚酰胺的改进方法 | |
JP4096446B2 (ja) | 透明ポリアミド樹脂及びその製造法 | |
KR101987540B1 (ko) | 공중합 폴리아미드 수지, 이의 제조방법 및 이를 포함하는 성형품 | |
JP2534220B2 (ja) | 新規な高融点結晶性ポリアミド | |
JP3570990B2 (ja) | 分枝ポリアミドの製造 | |
KR20160017197A (ko) | 공중합 폴리아미드 수지, 이의 제조방법 및 이를 포함하는 성형품 | |
JP6464567B2 (ja) | ポリアミド樹脂及びそれを用いて製造される成形品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080309 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090309 Year of fee payment: 8 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100309 Year of fee payment: 9 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110309 Year of fee payment: 10 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110309 Year of fee payment: 10 |
|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120309 Year of fee payment: 11 |