JPH053738B2 - - Google Patents

Info

Publication number
JPH053738B2
JPH053738B2 JP61095583A JP9558386A JPH053738B2 JP H053738 B2 JPH053738 B2 JP H053738B2 JP 61095583 A JP61095583 A JP 61095583A JP 9558386 A JP9558386 A JP 9558386A JP H053738 B2 JPH053738 B2 JP H053738B2
Authority
JP
Japan
Prior art keywords
tabic
ceramic substrate
buffering
electronic component
organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61095583A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62250650A (ja
Inventor
Michinori Shiina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP61095583A priority Critical patent/JPS62250650A/ja
Publication of JPS62250650A publication Critical patent/JPS62250650A/ja
Publication of JPH053738B2 publication Critical patent/JPH053738B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Wire Bonding (AREA)
JP61095583A 1986-04-23 1986-04-23 電子部品の実装構造 Granted JPS62250650A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61095583A JPS62250650A (ja) 1986-04-23 1986-04-23 電子部品の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61095583A JPS62250650A (ja) 1986-04-23 1986-04-23 電子部品の実装構造

Publications (2)

Publication Number Publication Date
JPS62250650A JPS62250650A (ja) 1987-10-31
JPH053738B2 true JPH053738B2 (cg-RX-API-DMAC10.html) 1993-01-18

Family

ID=14141606

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61095583A Granted JPS62250650A (ja) 1986-04-23 1986-04-23 電子部品の実装構造

Country Status (1)

Country Link
JP (1) JPS62250650A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5264726A (en) * 1989-07-21 1993-11-23 Nec Corporation Chip-carrier
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5810841A (ja) * 1981-07-13 1983-01-21 Mitsubishi Electric Corp 樹脂封止形半導体装置
JPS60206314A (ja) * 1984-03-30 1985-10-17 Matsushita Electric Ind Co Ltd 梯子形セラミツクフイルタ

Also Published As

Publication number Publication date
JPS62250650A (ja) 1987-10-31

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