JPH0528242B2 - - Google Patents

Info

Publication number
JPH0528242B2
JPH0528242B2 JP60128813A JP12881385A JPH0528242B2 JP H0528242 B2 JPH0528242 B2 JP H0528242B2 JP 60128813 A JP60128813 A JP 60128813A JP 12881385 A JP12881385 A JP 12881385A JP H0528242 B2 JPH0528242 B2 JP H0528242B2
Authority
JP
Japan
Prior art keywords
molding
rubber
mold
molding material
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60128813A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61285244A (ja
Inventor
Tsutomu Hamada
Takeshi Ito
Yoshihiro Aso
Masahiro Ihara
Masami Yokozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd, Matsushita Electric Works Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60128813A priority Critical patent/JPS61285244A/ja
Publication of JPS61285244A publication Critical patent/JPS61285244A/ja
Publication of JPH0528242B2 publication Critical patent/JPH0528242B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/473—

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
  • Organic Insulating Materials (AREA)
JP60128813A 1985-06-13 1985-06-13 電子部品用成形材料 Granted JPS61285244A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60128813A JPS61285244A (ja) 1985-06-13 1985-06-13 電子部品用成形材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60128813A JPS61285244A (ja) 1985-06-13 1985-06-13 電子部品用成形材料

Publications (2)

Publication Number Publication Date
JPS61285244A JPS61285244A (ja) 1986-12-16
JPH0528242B2 true JPH0528242B2 (enExample) 1993-04-23

Family

ID=14994050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60128813A Granted JPS61285244A (ja) 1985-06-13 1985-06-13 電子部品用成形材料

Country Status (1)

Country Link
JP (1) JPS61285244A (enExample)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57131223A (en) * 1981-02-06 1982-08-14 Hitachi Ltd Resin composition
JPS58121653A (ja) * 1982-01-12 1983-07-20 Hitachi Ltd 半導体装置封止用エポキシ樹脂組成物とその製法
JPS58210920A (ja) * 1982-05-31 1983-12-08 Shin Etsu Chem Co Ltd 熱硬化性エポキシ樹脂組成物
JPS5922963A (ja) * 1982-07-29 1984-02-06 Hitachi Chem Co Ltd 封止用成形材料の製造法
JPS601220A (ja) * 1983-06-17 1985-01-07 Denki Kagaku Kogyo Kk 半導体封止用エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPS61285244A (ja) 1986-12-16

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term