JPH0528242B2 - - Google Patents
Info
- Publication number
- JPH0528242B2 JPH0528242B2 JP60128813A JP12881385A JPH0528242B2 JP H0528242 B2 JPH0528242 B2 JP H0528242B2 JP 60128813 A JP60128813 A JP 60128813A JP 12881385 A JP12881385 A JP 12881385A JP H0528242 B2 JPH0528242 B2 JP H0528242B2
- Authority
- JP
- Japan
- Prior art keywords
- molding
- rubber
- mold
- molding material
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920001971 elastomer Polymers 0.000 claims description 15
- 239000005060 rubber Substances 0.000 claims description 14
- 239000003822 epoxy resin Substances 0.000 claims description 12
- 239000012778 molding material Substances 0.000 claims description 12
- 229920000647 polyepoxide Polymers 0.000 claims description 12
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 10
- 239000006229 carbon black Substances 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- 239000006082 mold release agent Substances 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- 238000004898 kneading Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 description 14
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000032683 aging Effects 0.000 description 4
- 238000011109 contamination Methods 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- -1 resistors Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000000378 calcium silicate Substances 0.000 description 2
- 229910052918 calcium silicate Inorganic materials 0.000 description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
〔技術分野〕
本発明は、コンデンサ、抵抗、半導体等電子部
品の成形材料に関するもので、特にエポキシ樹脂
にブタジエン系ゴムポリマーを添加し、低応力化
した材料に関するものである。
〔背景技術〕
従来の電子部品用成形材料、例えばエポキシ樹
脂成形材料は曲げ弾性率が1300〜2000Kg/mm2と高
いため、これを用いて成形した成形品には内部応
力が蓄積され、外部からの機械的もしくは熱的衝
撃により成形品にしばしばクラツクが生ずること
が知られている。成形品の内部応力σは(1)式で示
される。
σ=K.E.Δα.ΔT ……(1)
ここでKは常数、Eは曲げ弾性率、Δαは膨脹
係数、ΔTは成形材料のガラス転位点と室温との
温度差である。従つて内部応力σを小さくするに
は、E、Δα、ΔTを小さくすればよいが、Δαを
小さくするためには熱伝導率の低い溶融シリカを
充填剤として用いなければならず、又ΔTを小さ
くするためにはガラス転位点を低下させる必要が
あり各れも信頼性の低下を惹起する。このため曲
げ弾性率Eを小さくする工夫がなされ、例えば環
状ゴムや鎖状ゴム等の可撓剤を添加することによ
つて曲げ弾性率を小さくしていたものである。し
かしゴム系ポリマーを用い成形を反復すると分離
ゴム成分により早期に成形金型が汚染し、その結
果成形品の外観不良や、金型に成形品が付着する
いわゆる離型不良を惹起する欠点があつた。
〔発明の効果〕
本発明の目的とするところは、曲げ弾性率の小
さい成形材料による成形時の金型汚染を防止し、
成形品の外観向上、成形不良等の減少、金型表面
クリーニング回数の減少を実現できる電子部品用
成形材料を提供することにある。
〔発明の開示〕
本発明はエポキシ樹脂、フエノール樹脂、カー
ボンブラツク、充填剤、硬化促進剤、離型剤等か
らなる成形材料に、ブタジエン系ゴムポリマーを
添加、混練後、35〜44℃の雰囲気で5〜30時間熟
成したことを特徴とする電子部品用成形材料のた
め、成形時分離しやすいゴム成分をカーボンブラ
ツクで予じめ結合しておくことができるのでゴム
成分による成形時の金型汚染を防止することがで
きるもので、以下本発明を詳細に説明する。
本発明に用いるエポキシ樹脂は、1分子中に2
個以上のエポキシ基を有する硬化可能なエポキシ
樹脂であるならばビスフエノールA型エポキシ樹
脂、ノボラツク型エポキシ樹脂、グリシジルエス
テル型エポキシ樹脂、ハロゲン化エポキシ樹脂、
可撓性エポキシ樹脂、高分子型エポキシ樹脂等各
れでもよく特に限定するものではないが好ましく
は性能バランスのとれたノボラツク型エポキシ樹
脂を用いることが望ましい。硬化剤としてはアミ
ン系硬化剤、ポリアミド樹脂、ポリアミン、酸無
水物硬化剤、ルイス酸錯化合物、フエノール樹
脂、イソシアネート等を用いることができ特に限
定するものではないが好ましくはフエノール樹脂
を用いることが耐熱性の点でよく望ましいことで
ある。カーボンブラツクとしてはゴム用フアーネ
ス、ゴム用熱分解、電池用、ゴム用チヤンネル、
着色剤用等のようにカーボンブラツク全般を用い
ることができ特に限定するものではない。充填剤
としてはシリカ、ガラス繊維、ガラス粉、ケイ酸
カルシウム、炭酸カルシウム、アルミナ、クレ
ー、タルク、硫酸バリウム、窒化ホウ素、炭化ケ
イ素等を用いることができ、更に離型剤、硬化促
進剤、カツプリング剤等を添加することができる
ものである。ブタジエン系ゴムポリマーとしては
日本合成ゴム株式会社製のDN20HA、DH30A、
N220SH、グツドリツチ社製のハイカー1411、日
本ゼオン株式会社製のHF01、HF21、BR1220、
宇部興産株式会社製ハイカーC7B、VTB等を用
いることができ特に限定するものではないが粒子
径が10メツシユ以下であることが望ましいことで
ある。熟成は35〜44℃の雰囲気で5〜30時間行な
うことが必要である。35℃〜44℃において44℃に
近い程短時間でよく、35℃に近い程長時間熟成す
ることが必要である。更に成形材料の成形につい
てはトランスフアー成形、射出成形等によるトラ
ンジスタ、ダイオード、コンデンサー、フイルタ
ー、整流器、抵抗体、コイル等の電子部品と多数
個取り成形に適することは勿論、圧縮成形等にも
適用できるものである。
以下本発明を実施例にもとづいて説明する。
実施例1乃至6と比較例1乃至4
ノボラツク型エポキシ樹脂100重量部(以下単
に部と記す)に対しフエノール樹脂60部、2メチ
ルイミダゾール1部、カルナウバワツクス2部、
カーボンブラツク3部、ケイ酸カルシウム100部、
結晶シリカ350部、ブタジエン系ゴムポリマー
(日本合成ゴム株式会社製N220SH)130部を添加
し加熱ロールで混練してから所要粒度に粉砕、造
粒し第1表の熟成条件に従つて熟成し電部品用成
形材料を得、トランスフアー成形機を用いて金型
温度175℃、成形圧力50Kg/cm2、硬化時間3分間
でハイブリツド1Cを封止成形した。
[Technical Field] The present invention relates to a molding material for electronic parts such as capacitors, resistors, and semiconductors, and particularly to a material in which stress is reduced by adding a butadiene-based rubber polymer to an epoxy resin. [Background technology] Conventional molding materials for electronic parts, such as epoxy resin molding materials, have a high flexural modulus of 1300 to 2000 Kg/mm 2 , so internal stress accumulates in molded products made using this material, causing external stress to build up. It is known that cracks often occur in molded products due to mechanical or thermal shock. The internal stress σ of the molded product is expressed by equation (1). σ=KEΔα.ΔT (1) where K is a constant, E is the flexural modulus, Δα is the expansion coefficient, and ΔT is the temperature difference between the glass transition point of the molding material and room temperature. Therefore, to reduce internal stress σ, E, Δα, and ΔT can be reduced, but in order to reduce Δα, fused silica with low thermal conductivity must be used as a filler, and ΔT must be reduced. In order to make it smaller, it is necessary to lower the glass transition point, and each of these causes a decrease in reliability. For this reason, efforts have been made to reduce the bending elastic modulus E, for example by adding a flexibilizing agent such as annular rubber or chain rubber. However, when molding is repeated using rubber-based polymers, the molding mold is contaminated early by the separated rubber component, resulting in poor appearance of the molded product and the drawback of causing so-called mold release failure, where the molded product adheres to the mold. Ta. [Effects of the Invention] It is an object of the present invention to prevent mold contamination during molding due to a molding material with a small flexural modulus,
The object of the present invention is to provide a molding material for electronic parts that can improve the appearance of molded products, reduce molding defects, and reduce the number of times the mold surface is cleaned. [Disclosure of the Invention] The present invention involves adding a butadiene-based rubber polymer to a molding material consisting of an epoxy resin, a phenol resin, carbon black, a filler, a hardening accelerator, a mold release agent, etc., and then kneading the mixture in an atmosphere of 35 to 44°C. This is a molding material for electronic parts that has been aged for 5 to 30 hours.The rubber component, which easily separates during molding, can be pre-bonded with carbon black, making it easier to mold the rubber component during molding. The present invention will be described in detail below as it can prevent contamination. The epoxy resin used in the present invention has two
Curable epoxy resins having more than one epoxy group include bisphenol A type epoxy resins, novolac type epoxy resins, glycidyl ester type epoxy resins, halogenated epoxy resins,
Flexible epoxy resins, polymeric epoxy resins, etc. may be used, but there is no particular limitation, but it is preferable to use a novolac type epoxy resin with well-balanced performance. As the curing agent, amine curing agents, polyamide resins, polyamines, acid anhydride curing agents, Lewis acid complex compounds, phenolic resins, isocyanates, etc. can be used, and although there are no particular limitations, it is preferable to use phenolic resins. This is highly desirable in terms of heat resistance. Carbon black is used for rubber furnaces, rubber pyrolysis, batteries, rubber channels,
Any carbon black can be used as a coloring agent, and there is no particular limitation. Silica, glass fiber, glass powder, calcium silicate, calcium carbonate, alumina, clay, talc, barium sulfate, boron nitride, silicon carbide, etc. can be used as fillers, and in addition, mold release agents, hardening accelerators, and coupling agents can be used. It is possible to add agents, etc. Butadiene-based rubber polymers include DN20HA and DH30A manufactured by Japan Synthetic Rubber Co., Ltd.
N220SH, Hiker 1411 manufactured by Gutsudoritsuchi, HF01, HF21, BR1220 manufactured by Zeon Corporation,
Hiker C7B, VTB, etc. manufactured by Ube Industries, Ltd. can be used, and although there is no particular limitation, it is desirable that the particle size is 10 mesh or less. Aging must be carried out for 5 to 30 hours in an atmosphere of 35 to 44°C. At 35°C to 44°C, the closer the temperature is to 44°C, the shorter the aging time, and the closer the temperature is to 35°C, the longer the aging process is required. Furthermore, regarding the molding of molding materials, it is suitable for multi-cavity molding of electronic parts such as transistors, diodes, capacitors, filters, rectifiers, resistors, coils, etc. by transfer molding, injection molding, etc., as well as compression molding, etc. It is possible. The present invention will be explained below based on examples. Examples 1 to 6 and Comparative Examples 1 to 4 60 parts of phenolic resin, 1 part of 2-methylimidazole, 2 parts of carnauba wax,
3 parts carbon black, 100 parts calcium silicate,
350 parts of crystalline silica and 130 parts of butadiene-based rubber polymer (N220SH manufactured by Nippon Gosei Rubber Co., Ltd.) were added, kneaded with heated rolls, pulverized and granulated to the required particle size, aged according to the aging conditions in Table 1, and electrolyzed. A molding material for parts was obtained, and Hybrid 1C was encapsulated using a transfer molding machine at a mold temperature of 175°C, a molding pressure of 50 kg/cm 2 , and a curing time of 3 minutes.
実施例1乃至3と比較例1乃至4の成形時の金
型汚染は、実施例1乃至3においては200回成形
後にも認められず、従つて成形品外観はよく且つ
成形不良率、金型表面クリーニング回数を殆んど
なくすることができたに反し、比較例1乃至4に
おいては50回成形後に早くも金型汚染が早期発生
し成形品外観は低下し且つ成形不良率、金型表面
クリーニング回数を減少させることはできず、本
発明の優れていることを確認した。
The mold contamination during molding in Examples 1 to 3 and Comparative Examples 1 to 4 was not observed in Examples 1 to 3 even after 200 moldings, and therefore the molded product appearance was good and the molding defect rate and mold Although the number of surface cleanings could be almost eliminated, in Comparative Examples 1 to 4, mold contamination occurred as early as after 50 moldings, the appearance of the molded product deteriorated, and the molding defect rate and mold surface decreased. The number of times of cleaning could not be reduced, confirming the superiority of the present invention.
Claims (1)
ラツク、充填剤、硬化促進剤、離型剤等からなる
成形材料に、ブタジエン系ゴムポリマーを添加、
混練後、35〜44℃の雰囲気で5〜30時間熟成した
ことを特徴とする電子部品用成形材料。1 Adding a butadiene-based rubber polymer to a molding material consisting of epoxy resin, phenolic resin, carbon black, filler, hardening accelerator, mold release agent, etc.
A molding material for electronic parts, which is aged in an atmosphere of 35 to 44°C for 5 to 30 hours after kneading.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60128813A JPS61285244A (en) | 1985-06-13 | 1985-06-13 | Molding material for electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60128813A JPS61285244A (en) | 1985-06-13 | 1985-06-13 | Molding material for electronic parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61285244A JPS61285244A (en) | 1986-12-16 |
JPH0528242B2 true JPH0528242B2 (en) | 1993-04-23 |
Family
ID=14994050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60128813A Granted JPS61285244A (en) | 1985-06-13 | 1985-06-13 | Molding material for electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61285244A (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57131223A (en) * | 1981-02-06 | 1982-08-14 | Hitachi Ltd | Resin composition |
JPS58121653A (en) * | 1982-01-12 | 1983-07-20 | Hitachi Ltd | Epoxy resin composition for sealing semiconductor device and manufacture thereof |
JPS58210920A (en) * | 1982-05-31 | 1983-12-08 | Shin Etsu Chem Co Ltd | Thermosetting epoxy resin composition |
JPS5922963A (en) * | 1982-07-29 | 1984-02-06 | Hitachi Chem Co Ltd | Manufacture of molding compound for sealing |
JPS601220A (en) * | 1983-06-17 | 1985-01-07 | Denki Kagaku Kogyo Kk | Epoxy resin composition for semiconductor sealing |
-
1985
- 1985-06-13 JP JP60128813A patent/JPS61285244A/en active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57131223A (en) * | 1981-02-06 | 1982-08-14 | Hitachi Ltd | Resin composition |
JPS58121653A (en) * | 1982-01-12 | 1983-07-20 | Hitachi Ltd | Epoxy resin composition for sealing semiconductor device and manufacture thereof |
JPS58210920A (en) * | 1982-05-31 | 1983-12-08 | Shin Etsu Chem Co Ltd | Thermosetting epoxy resin composition |
JPS5922963A (en) * | 1982-07-29 | 1984-02-06 | Hitachi Chem Co Ltd | Manufacture of molding compound for sealing |
JPS601220A (en) * | 1983-06-17 | 1985-01-07 | Denki Kagaku Kogyo Kk | Epoxy resin composition for semiconductor sealing |
Also Published As
Publication number | Publication date |
---|---|
JPS61285244A (en) | 1986-12-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |