JPH0525255Y2 - - Google Patents

Info

Publication number
JPH0525255Y2
JPH0525255Y2 JP1989001016U JP101689U JPH0525255Y2 JP H0525255 Y2 JPH0525255 Y2 JP H0525255Y2 JP 1989001016 U JP1989001016 U JP 1989001016U JP 101689 U JP101689 U JP 101689U JP H0525255 Y2 JPH0525255 Y2 JP H0525255Y2
Authority
JP
Japan
Prior art keywords
reflector
lead frame
resin
led
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989001016U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0292953U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989001016U priority Critical patent/JPH0525255Y2/ja
Publication of JPH0292953U publication Critical patent/JPH0292953U/ja
Application granted granted Critical
Publication of JPH0525255Y2 publication Critical patent/JPH0525255Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1989001016U 1989-01-09 1989-01-09 Expired - Lifetime JPH0525255Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989001016U JPH0525255Y2 (enExample) 1989-01-09 1989-01-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989001016U JPH0525255Y2 (enExample) 1989-01-09 1989-01-09

Publications (2)

Publication Number Publication Date
JPH0292953U JPH0292953U (enExample) 1990-07-24
JPH0525255Y2 true JPH0525255Y2 (enExample) 1993-06-25

Family

ID=31200535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989001016U Expired - Lifetime JPH0525255Y2 (enExample) 1989-01-09 1989-01-09

Country Status (1)

Country Link
JP (1) JPH0525255Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003257693A1 (en) * 2003-08-25 2005-03-10 Opto-Device Co., Ltd. Process for producing light emitting diode

Also Published As

Publication number Publication date
JPH0292953U (enExample) 1990-07-24

Similar Documents

Publication Publication Date Title
JP4341951B2 (ja) 発光ダイオード及びそのパッケージ構造
JP3618534B2 (ja) 光通信用ランプ装置とその製造方法
JP3964590B2 (ja) 光半導体パッケージ
CN1992362B (zh) 光半导体器件
JP6176101B2 (ja) 樹脂パッケージ及び発光装置
US20090289274A1 (en) Package structure of light emitting diode and method of manufacturing the same
JP2005294736A (ja) 半導体発光装置の製造方法
JPH11307820A (ja) 表面実装ｌｅｄとその製造方法
JP2000058924A (ja) 表面実装型発光ダイオード及びその製造方法
JP3685057B2 (ja) Ｌｅｄランプ及びその製造方法
TW201438298A (zh) 發光組件及其製造方法
JP2003303936A (ja) リードフレームとその製造方法ならびにそれを用いたチップ型ｌｅｄ
CN203325966U (zh) 发光二极管装置和导线架料片
KR20060068371A (ko) 고출력 발광 다이오드 패키지 및 그 제조방법
JP2006222271A (ja) 発光素子実装用基板
CN102365764A (zh) 半导体装置
JPH0525255Y2 (enExample)
JP2008041950A (ja) 発光ダイオードパッケージ用プリモールド部品及びその製造方法、並びに発光ダイオードパッケージ
JP4162363B2 (ja) 半導体装置
JPH0525257Y2 (enExample)
JP2000294838A (ja) チップ型発光ダイオードアレイ
JPH05315654A (ja) 発光ダイオードランプ
JP2001320093A (ja) 発光ダイオードのｂｌａｎｋと製造法
JPH0525256Y2 (enExample)
JP2519504Y2 (ja) 発光ダイオード