JPH0292953U - - Google Patents
Info
- Publication number
- JPH0292953U JPH0292953U JP1989001016U JP101689U JPH0292953U JP H0292953 U JPH0292953 U JP H0292953U JP 1989001016 U JP1989001016 U JP 1989001016U JP 101689 U JP101689 U JP 101689U JP H0292953 U JPH0292953 U JP H0292953U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- plating layer
- metal plating
- display element
- reflector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989001016U JPH0525255Y2 (enExample) | 1989-01-09 | 1989-01-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989001016U JPH0525255Y2 (enExample) | 1989-01-09 | 1989-01-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0292953U true JPH0292953U (enExample) | 1990-07-24 |
| JPH0525255Y2 JPH0525255Y2 (enExample) | 1993-06-25 |
Family
ID=31200535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989001016U Expired - Lifetime JPH0525255Y2 (enExample) | 1989-01-09 | 1989-01-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0525255Y2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005020336A1 (ja) * | 2003-08-25 | 2005-03-03 | Tabuchi Electric Co., Ltd. | 発光ダイオードの製造方法 |
-
1989
- 1989-01-09 JP JP1989001016U patent/JPH0525255Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005020336A1 (ja) * | 2003-08-25 | 2005-03-03 | Tabuchi Electric Co., Ltd. | 発光ダイオードの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0525255Y2 (enExample) | 1993-06-25 |