JPH01160851U - - Google Patents
Info
- Publication number
- JPH01160851U JPH01160851U JP1988049677U JP4967788U JPH01160851U JP H01160851 U JPH01160851 U JP H01160851U JP 1988049677 U JP1988049677 U JP 1988049677U JP 4967788 U JP4967788 U JP 4967788U JP H01160851 U JPH01160851 U JP H01160851U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- chip mounting
- sealed
- chip
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988049677U JPH01160851U (enExample) | 1988-04-13 | 1988-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988049677U JPH01160851U (enExample) | 1988-04-13 | 1988-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01160851U true JPH01160851U (enExample) | 1989-11-08 |
Family
ID=31275764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988049677U Pending JPH01160851U (enExample) | 1988-04-13 | 1988-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160851U (enExample) |
-
1988
- 1988-04-13 JP JP1988049677U patent/JPH01160851U/ja active Pending