JPH01160851U - - Google Patents
Info
- Publication number
- JPH01160851U JPH01160851U JP4967788U JP4967788U JPH01160851U JP H01160851 U JPH01160851 U JP H01160851U JP 4967788 U JP4967788 U JP 4967788U JP 4967788 U JP4967788 U JP 4967788U JP H01160851 U JPH01160851 U JP H01160851U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- chip mounting
- sealed
- chip
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の要部の斜視図、第
２図は従来の半導体装置の斜視図である。 １，２，３…リード、１ａ…チツプ搭載部、２
ａ，３ａ…ボンデイング部、４…半導体チツプ、
５…金属ワイヤ、６…樹脂、７…折曲箇所、８…
凹溝。
２図は従来の半導体装置の斜視図である。 １，２，３…リード、１ａ…チツプ搭載部、２
ａ，３ａ…ボンデイング部、４…半導体チツプ、
５…金属ワイヤ、６…樹脂、７…折曲箇所、８…
凹溝。
Claims (1)
- 金属板で形成した一のリードの先端に設けたチ
ツプ搭載部に半導体チツプを搭載するとともに、
この半導体チツプを他のリードに金属ワイヤで電
気接続し、これらを樹脂封止してなる樹脂封止型
半導体装置において、前記一のリードはチツプ搭
載部の基部においてクランク状に折曲げ形成する
とともに、チツプ搭載部の基部側表面に凹溝を形
成したことを特徴とする樹脂封止型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4967788U JPH01160851U (ja) | 1988-04-13 | 1988-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4967788U JPH01160851U (ja) | 1988-04-13 | 1988-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01160851U true JPH01160851U (ja) | 1989-11-08 |
Family
ID=31275764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4967788U Pending JPH01160851U (ja) | 1988-04-13 | 1988-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160851U (ja) |
-
1988
- 1988-04-13 JP JP4967788U patent/JPH01160851U/ja active Pending