JPH0525256Y2 - - Google Patents

Info

Publication number
JPH0525256Y2
JPH0525256Y2 JP1989001017U JP101789U JPH0525256Y2 JP H0525256 Y2 JPH0525256 Y2 JP H0525256Y2 JP 1989001017 U JP1989001017 U JP 1989001017U JP 101789 U JP101789 U JP 101789U JP H0525256 Y2 JPH0525256 Y2 JP H0525256Y2
Authority
JP
Japan
Prior art keywords
reflector
lead frame
led
resin
cup
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989001017U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0292954U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989001017U priority Critical patent/JPH0525256Y2/ja
Publication of JPH0292954U publication Critical patent/JPH0292954U/ja
Application granted granted Critical
Publication of JPH0525256Y2 publication Critical patent/JPH0525256Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP1989001017U 1989-01-09 1989-01-09 Expired - Lifetime JPH0525256Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989001017U JPH0525256Y2 (enExample) 1989-01-09 1989-01-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989001017U JPH0525256Y2 (enExample) 1989-01-09 1989-01-09

Publications (2)

Publication Number Publication Date
JPH0292954U JPH0292954U (enExample) 1990-07-24
JPH0525256Y2 true JPH0525256Y2 (enExample) 1993-06-25

Family

ID=31200537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989001017U Expired - Lifetime JPH0525256Y2 (enExample) 1989-01-09 1989-01-09

Country Status (1)

Country Link
JP (1) JPH0525256Y2 (enExample)

Also Published As

Publication number Publication date
JPH0292954U (enExample) 1990-07-24

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