JPH05218127A - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法

Info

Publication number
JPH05218127A
JPH05218127A JP4227135A JP22713592A JPH05218127A JP H05218127 A JPH05218127 A JP H05218127A JP 4227135 A JP4227135 A JP 4227135A JP 22713592 A JP22713592 A JP 22713592A JP H05218127 A JPH05218127 A JP H05218127A
Authority
JP
Japan
Prior art keywords
chip
lead
semiconductor device
bonding
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4227135A
Other languages
English (en)
Japanese (ja)
Inventor
Jong Young Park
鍾 永 朴
Hag Jo Jung
鶴 朝 鄭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JPH05218127A publication Critical patent/JPH05218127A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H10W72/709—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Wire Bonding (AREA)
  • Dicing (AREA)
JP4227135A 1991-11-14 1992-08-26 半導体装置及びその製造方法 Pending JPH05218127A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019910020271A KR930011143A (ko) 1991-11-14 1991-11-14 반도체장치 및 그 제조방법
KR1991-20271 1991-11-14

Publications (1)

Publication Number Publication Date
JPH05218127A true JPH05218127A (ja) 1993-08-27

Family

ID=19322836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4227135A Pending JPH05218127A (ja) 1991-11-14 1992-08-26 半導体装置及びその製造方法

Country Status (5)

Country Link
US (1) US5341027A (enExample)
JP (1) JPH05218127A (enExample)
KR (1) KR930011143A (enExample)
DE (1) DE4238402A1 (enExample)
GB (1) GB2261547A (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5462624A (en) * 1992-12-22 1995-10-31 Vlsi Technology, Inc. Embedded inter-connect frame
EP0641019A3 (en) * 1993-08-27 1995-12-20 Poly Flex Circuits Inc Flexible lead frame printed on a polymer.
JP2809115B2 (ja) * 1993-10-13 1998-10-08 ヤマハ株式会社 半導体装置とその製造方法
US5731222A (en) * 1995-08-01 1998-03-24 Hughes Aircraft Company Externally connected thin electronic circuit having recessed bonding pads
KR100227149B1 (ko) * 1997-04-15 1999-10-15 김영환 반도체 패키지
US6544820B2 (en) * 1997-06-19 2003-04-08 Micron Technology, Inc. Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
US5879965A (en) * 1997-06-19 1999-03-09 Micron Technology, Inc. Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
US6803656B2 (en) * 1997-12-31 2004-10-12 Micron Technology, Inc. Semiconductor device including combed bond pad opening
DE19840305A1 (de) * 1998-09-04 2000-03-09 Bosch Gmbh Robert Elektrische Anschlußtechnik für Kontaktpins
FR2790141B1 (fr) * 1999-02-22 2001-10-12 St Microelectronics Sa Circuit integre de faible encombrement
US20020117753A1 (en) * 2001-02-23 2002-08-29 Lee Michael G. Three dimensional packaging
EP3036688A4 (en) * 2013-08-23 2017-05-17 Fingerprint Cards AB Connection pads for a fingerprint sensing device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5211767A (en) * 1975-07-17 1977-01-28 Matsushita Electric Ind Co Ltd Semiconductor device

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3984620A (en) * 1975-06-04 1976-10-05 Raytheon Company Integrated circuit chip test and assembly package
CA1153128A (en) * 1980-04-22 1983-08-30 Jonathan L. Evans Electrical circuit assemblies
JPS56150830A (en) * 1980-04-25 1981-11-21 Hitachi Ltd Semiconductor device
US4430519A (en) * 1982-05-28 1984-02-07 Amp Incorporated Electron beam welded photovoltaic cell interconnections
JPS61187269A (ja) * 1985-02-14 1986-08-20 Nec Corp 半導体装置
US4622574A (en) * 1985-07-29 1986-11-11 The Perkin-Elmer Corporation Semiconductor chip with recessed bond pads
JPS63208252A (ja) * 1987-02-24 1988-08-29 Nec Corp 半導体装置用パツケ−ジ
US4862249A (en) * 1987-04-17 1989-08-29 Xoc Devices, Inc. Packaging system for stacking integrated circuits
FR2618666B1 (fr) * 1987-07-30 1990-01-05 Essilor Int Pupillometre automatique
JPS6450347A (en) * 1987-08-20 1989-02-27 Nec Corp Electron gun for color picture tube
JPH01319955A (ja) * 1988-06-21 1989-12-26 Nec Yamagata Ltd 半導体装置
FI893874A7 (fi) * 1989-08-17 1991-02-18 Vaisala Oy Kontaktfoersedd givare med skiktstruktur samt foerfarande foer utfoerande av kontakteringen.
US5136367A (en) * 1990-08-31 1992-08-04 Texas Instruments Incorporated Low cost erasable programmable read only memory package
JPH04179135A (ja) * 1990-11-08 1992-06-25 Matsushita Electron Corp 半導体装置の製造方法およびそれに用いるテープキャリヤー
JPH04247632A (ja) * 1991-02-01 1992-09-03 Fujitsu Ltd 半導体装置
JPH05258468A (ja) * 1992-03-11 1993-10-08 Canon Electron Inc ディスク装置
US5266833A (en) * 1992-03-30 1993-11-30 Capps David F Integrated circuit bus structure

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5211767A (en) * 1975-07-17 1977-01-28 Matsushita Electric Ind Co Ltd Semiconductor device

Also Published As

Publication number Publication date
DE4238402A1 (enExample) 1993-05-19
GB2261547A (en) 1993-05-19
GB9215477D0 (en) 1992-09-02
KR930011143A (ko) 1993-06-23
US5341027A (en) 1994-08-23

Similar Documents

Publication Publication Date Title
JP3022393B2 (ja) 半導体装置およびリードフレームならびに半導体装置の製造方法
CN100423258C (zh) 半导体器件及其制造方法
US6781240B2 (en) Semiconductor package with semiconductor chips stacked therein and method of making the package
US6921016B2 (en) Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
JP4881620B2 (ja) 半導体装置及びその製造方法
JPH05218127A (ja) 半導体装置及びその製造方法
JP3663295B2 (ja) チップスケールパッケージ
JP3540793B2 (ja) 樹脂封止型半導体装置及びその製造方法
US5808872A (en) Semiconductor package and method of mounting the same on circuit board
JPH10335368A (ja) ワイヤボンディング構造及び半導体装置
JP2674536B2 (ja) チップキャリア半導体装置及びその製造方法
JPH10335366A (ja) 半導体装置
JP3702152B2 (ja) 半導体装置
JP2856455B2 (ja) 半導体装置
JPH06112402A (ja) 半導体装置
JP2551243B2 (ja) 半導体装置
JP3745106B2 (ja) 半導体装置およびその製造方法
KR200172710Y1 (ko) 칩 크기의 패키지
JPH08181165A (ja) 半導体集積回路
JPH08250545A (ja) 半導体装置およびその製造方法
JPH04162638A (ja) 半導体集積回路装置の製造方法
JP3349465B2 (ja) 半導体装置
JPH04154137A (ja) フィルムキャリヤーテープの製造方法
JPH0547848A (ja) 半導体装置
WO2007134317A1 (en) Downhill wire bonding for semiconductor device