JPH048461B2 - - Google Patents

Info

Publication number
JPH048461B2
JPH048461B2 JP6206185A JP6206185A JPH048461B2 JP H048461 B2 JPH048461 B2 JP H048461B2 JP 6206185 A JP6206185 A JP 6206185A JP 6206185 A JP6206185 A JP 6206185A JP H048461 B2 JPH048461 B2 JP H048461B2
Authority
JP
Japan
Prior art keywords
parts
copolymer
laminate
epoxy resin
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6206185A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61221235A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6206185A priority Critical patent/JPS61221235A/ja
Publication of JPS61221235A publication Critical patent/JPS61221235A/ja
Publication of JPH048461B2 publication Critical patent/JPH048461B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP6206185A 1985-03-28 1985-03-28 積層板の製造方法 Granted JPS61221235A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6206185A JPS61221235A (ja) 1985-03-28 1985-03-28 積層板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6206185A JPS61221235A (ja) 1985-03-28 1985-03-28 積層板の製造方法

Publications (2)

Publication Number Publication Date
JPS61221235A JPS61221235A (ja) 1986-10-01
JPH048461B2 true JPH048461B2 (enrdf_load_stackoverflow) 1992-02-17

Family

ID=13189230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6206185A Granted JPS61221235A (ja) 1985-03-28 1985-03-28 積層板の製造方法

Country Status (1)

Country Link
JP (1) JPS61221235A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS61221235A (ja) 1986-10-01

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