JPH0468803B2 - - Google Patents
Info
- Publication number
- JPH0468803B2 JPH0468803B2 JP58047449A JP4744983A JPH0468803B2 JP H0468803 B2 JPH0468803 B2 JP H0468803B2 JP 58047449 A JP58047449 A JP 58047449A JP 4744983 A JP4744983 A JP 4744983A JP H0468803 B2 JPH0468803 B2 JP H0468803B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric oscillator
- voltage
- holding circuit
- circuit
- phase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/495—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
- C04B35/497—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates based on solid solutions with lead oxides
- C04B35/499—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates based on solid solutions with lead oxides containing also titanates
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4744983A JPS59172807A (ja) | 1983-03-22 | 1983-03-22 | 積層型位相同期圧電発振器 |
EP83112593A EP0111890B1 (en) | 1982-12-15 | 1983-12-14 | Monolithic multicomponents ceramic substrate with at least one dielectric layer of a composition having a perovskite structure |
DE8383112593T DE3382208D1 (de) | 1982-12-15 | 1983-12-14 | Monolithisches vielschichtkeramiksubstrat mit mindestens einer dielektrischen schicht aus einem material mit perovskit-struktur. |
US06/561,506 US4574255A (en) | 1982-12-15 | 1983-12-15 | MMC Substrate including capacitors having perovskite structure dielectric and electrical devices including MMC substrate |
AU22427/83A AU563467B2 (en) | 1982-12-15 | 1983-12-15 | Ceramic substrate for piezoelectric element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4744983A JPS59172807A (ja) | 1983-03-22 | 1983-03-22 | 積層型位相同期圧電発振器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59172807A JPS59172807A (ja) | 1984-09-29 |
JPH0468803B2 true JPH0468803B2 (enrdf_load_stackoverflow) | 1992-11-04 |
Family
ID=12775457
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4744983A Granted JPS59172807A (ja) | 1982-12-15 | 1983-03-22 | 積層型位相同期圧電発振器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59172807A (enrdf_load_stackoverflow) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0617339Y2 (ja) * | 1987-07-21 | 1994-05-02 | 株式会社村田製作所 | コンデンサ内蔵積層基板 |
JP5013824B2 (ja) * | 2005-11-16 | 2012-08-29 | 京セラ株式会社 | 電子部品封止用基板および複数個取り形態の電子部品封止用基板、並びに電子部品封止用基板を用いた電子装置および電子装置の製造方法 |
JP4731291B2 (ja) * | 2005-11-25 | 2011-07-20 | 京セラ株式会社 | 電子部品封止用基板およびそれを用いた電子装置、電子装置の製造方法 |
CN101351399B (zh) | 2005-11-16 | 2011-12-07 | 京瓷株式会社 | 电子部件密封用基板、可取多个形态的电子部件密封用基板、及使用了电子部件密封用基板的电子装置及其制法 |
JP2011035170A (ja) * | 2009-07-31 | 2011-02-17 | Olympus Corp | 多層積層回路 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5176062A (ja) * | 1974-12-26 | 1976-07-01 | Suwa Seikosha Kk | Denshidokei |
JPS51106050A (en) * | 1975-03-14 | 1976-09-20 | Citizen Watch Co Ltd | Denshidokeiniokeru denshikairososhi |
JPS5239871U (enrdf_load_stackoverflow) * | 1975-09-11 | 1977-03-22 | ||
JPS5240664U (enrdf_load_stackoverflow) * | 1975-09-17 | 1977-03-23 | ||
JPS5479468A (en) * | 1977-12-08 | 1979-06-25 | Fujitsu Ltd | Method of producing ceramic multiicircuit layer board |
JPS5521665A (en) * | 1978-08-04 | 1980-02-15 | Mitsubishi Electric Corp | Constituent of multi-layer transmission line |
JPS56154805A (en) * | 1980-04-30 | 1981-11-30 | Mitsubishi Electric Corp | Multilayer uniting method for triplet strip line |
JPS5816595A (ja) * | 1981-07-23 | 1983-01-31 | ティーディーケイ株式会社 | 混成集積回路 |
-
1983
- 1983-03-22 JP JP4744983A patent/JPS59172807A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59172807A (ja) | 1984-09-29 |