JPH0468804B2 - - Google Patents

Info

Publication number
JPH0468804B2
JPH0468804B2 JP58042576A JP4257683A JPH0468804B2 JP H0468804 B2 JPH0468804 B2 JP H0468804B2 JP 58042576 A JP58042576 A JP 58042576A JP 4257683 A JP4257683 A JP 4257683A JP H0468804 B2 JPH0468804 B2 JP H0468804B2
Authority
JP
Japan
Prior art keywords
sintered body
ceramic
capacitors
multilayer
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58042576A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59168705A (ja
Inventor
Juzo Shimada
Shuzo Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP58042576A priority Critical patent/JPS59168705A/ja
Priority to EP83112593A priority patent/EP0111890B1/en
Priority to DE8383112593T priority patent/DE3382208D1/de
Priority to US06/561,506 priority patent/US4574255A/en
Priority to AU22427/83A priority patent/AU563467B2/en
Publication of JPS59168705A publication Critical patent/JPS59168705A/ja
Publication of JPH0468804B2 publication Critical patent/JPH0468804B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/495—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
    • C04B35/497—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates based on solid solutions with lead oxides
    • C04B35/499—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates based on solid solutions with lead oxides containing also titanates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
    • H03B5/36—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator active element in amplifier being semiconductor device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
JP58042576A 1982-12-15 1983-03-15 積層型電圧制御圧電発振器 Granted JPS59168705A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP58042576A JPS59168705A (ja) 1983-03-15 1983-03-15 積層型電圧制御圧電発振器
EP83112593A EP0111890B1 (en) 1982-12-15 1983-12-14 Monolithic multicomponents ceramic substrate with at least one dielectric layer of a composition having a perovskite structure
DE8383112593T DE3382208D1 (de) 1982-12-15 1983-12-14 Monolithisches vielschichtkeramiksubstrat mit mindestens einer dielektrischen schicht aus einem material mit perovskit-struktur.
US06/561,506 US4574255A (en) 1982-12-15 1983-12-15 MMC Substrate including capacitors having perovskite structure dielectric and electrical devices including MMC substrate
AU22427/83A AU563467B2 (en) 1982-12-15 1983-12-15 Ceramic substrate for piezoelectric element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58042576A JPS59168705A (ja) 1983-03-15 1983-03-15 積層型電圧制御圧電発振器

Publications (2)

Publication Number Publication Date
JPS59168705A JPS59168705A (ja) 1984-09-22
JPH0468804B2 true JPH0468804B2 (enrdf_load_stackoverflow) 1992-11-04

Family

ID=12639887

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58042576A Granted JPS59168705A (ja) 1982-12-15 1983-03-15 積層型電圧制御圧電発振器

Country Status (1)

Country Link
JP (1) JPS59168705A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0617339Y2 (ja) * 1987-07-21 1994-05-02 株式会社村田製作所 コンデンサ内蔵積層基板
JPH0290515U (enrdf_load_stackoverflow) * 1988-12-28 1990-07-18

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5176062A (ja) * 1974-12-26 1976-07-01 Suwa Seikosha Kk Denshidokei
JPS51106050A (en) * 1975-03-14 1976-09-20 Citizen Watch Co Ltd Denshidokeiniokeru denshikairososhi
JPS5239871U (enrdf_load_stackoverflow) * 1975-09-11 1977-03-22
JPS5240664U (enrdf_load_stackoverflow) * 1975-09-17 1977-03-23
JPS5479468A (en) * 1977-12-08 1979-06-25 Fujitsu Ltd Method of producing ceramic multiicircuit layer board
JPS5521665A (en) * 1978-08-04 1980-02-15 Mitsubishi Electric Corp Constituent of multi-layer transmission line
JPS56107606A (en) * 1980-01-31 1981-08-26 Nec Corp Voltage control type piezoelectric oscillator
JPS56154805A (en) * 1980-04-30 1981-11-30 Mitsubishi Electric Corp Multilayer uniting method for triplet strip line
JPS5816595A (ja) * 1981-07-23 1983-01-31 ティーディーケイ株式会社 混成集積回路

Also Published As

Publication number Publication date
JPS59168705A (ja) 1984-09-22

Similar Documents

Publication Publication Date Title
US4574255A (en) MMC Substrate including capacitors having perovskite structure dielectric and electrical devices including MMC substrate
JPH0648666B2 (ja) 積層セラミックコンデンサ及びその製法
KR100345607B1 (ko) 캐패시터 잉크, 유전체 그린 테이프, 다층 그린 테이프 적층체, 매립형 캐패시터 및 그 제조방법
US4633366A (en) Laminar electrical component with magnesium orthoborate
US5324986A (en) Chip type varistor
KR20000075996A (ko) 수동 소자들이 내재된 세라믹 다층 인쇄 회로 기판
JPH0897070A (ja) セラミックコンデンサ
JPH0468804B2 (enrdf_load_stackoverflow)
JPS5917232A (ja) 複合積層セラミツク部品およびその製造方法
JPH0468803B2 (enrdf_load_stackoverflow)
JPH0346978B2 (enrdf_load_stackoverflow)
JPS59144206A (ja) 積層セラミツク化水晶発振器
JPS6221260B2 (enrdf_load_stackoverflow)
JPH0530323B2 (enrdf_load_stackoverflow)
JPS6092697A (ja) 複合積層セラミツク部品
JP2676620B2 (ja) 積層セラミックコンデンサとその製造方法
JPH0216004B2 (enrdf_load_stackoverflow)
JPH053162B2 (enrdf_load_stackoverflow)
JPH053161B2 (enrdf_load_stackoverflow)
JPS6088420A (ja) 複合積層セラミツク部品
JPH05243745A (ja) 多層セラミック基板
JPS59110208A (ja) 複合積層化多周波水晶発振器
JP3240873B2 (ja) 低温焼成セラミック誘電体及び低温焼成セラミック多層回路基板
JPS59132643A (ja) 抵抗複合基板
JPS59169209A (ja) 恒温槽付水晶発振器