JPH0466386B2 - - Google Patents
Info
- Publication number
- JPH0466386B2 JPH0466386B2 JP6021886A JP6021886A JPH0466386B2 JP H0466386 B2 JPH0466386 B2 JP H0466386B2 JP 6021886 A JP6021886 A JP 6021886A JP 6021886 A JP6021886 A JP 6021886A JP H0466386 B2 JPH0466386 B2 JP H0466386B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- metallized layer
- electrodes
- metal
- electrical insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 31
- 239000000919 ceramic Substances 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000010304 firing Methods 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims description 5
- 238000001259 photo etching Methods 0.000 claims description 5
- 238000007796 conventional method Methods 0.000 description 7
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000006089 photosensitive glass Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6021886A JPS62216348A (ja) | 1986-03-18 | 1986-03-18 | 半導体素子用パツケ−ジ及びその製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6021886A JPS62216348A (ja) | 1986-03-18 | 1986-03-18 | 半導体素子用パツケ−ジ及びその製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62216348A JPS62216348A (ja) | 1987-09-22 |
| JPH0466386B2 true JPH0466386B2 (nl) | 1992-10-23 |
Family
ID=13135803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6021886A Granted JPS62216348A (ja) | 1986-03-18 | 1986-03-18 | 半導体素子用パツケ−ジ及びその製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62216348A (nl) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4428583B1 (ja) * | 2009-06-26 | 2010-03-10 | 喜子 山村 | 犬用レインコート |
-
1986
- 1986-03-18 JP JP6021886A patent/JPS62216348A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4428583B1 (ja) * | 2009-06-26 | 2010-03-10 | 喜子 山村 | 犬用レインコート |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62216348A (ja) | 1987-09-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS62216259A (ja) | 混成集積回路の製造方法および構造 | |
| JPS5832785B2 (ja) | 電子部品容器 | |
| US4034467A (en) | Process for producing a multi-chip wiring arrangement | |
| JPS61244057A (ja) | 端子接続構造およびその接続方法 | |
| JPH0466386B2 (nl) | ||
| JP2501174B2 (ja) | 表面実装用端子の製造方法 | |
| JP2000165004A (ja) | 多数個取り配線基板 | |
| JPS6016749B2 (ja) | 集積回路用パツケ−ジ | |
| JP2788656B2 (ja) | 集積回路用パッケージの製造方法 | |
| EP0100727B1 (en) | Semiconductor device comprising a ceramic base | |
| JP2000165003A (ja) | 多数個取り配線基板 | |
| JPS63283051A (ja) | 混成集積回路装置用基板 | |
| JPS595977Y2 (ja) | 集積回路の塔載装置 | |
| JPH0558678B2 (nl) | ||
| JPS62281359A (ja) | セラミツク配線基板の製造法 | |
| JPH06152114A (ja) | 電気回路配線基板及びその製造方法並びに電気回路装置 | |
| JP3015504B2 (ja) | 半導体装置 | |
| JPS59201452A (ja) | 高密度テ−プボンデイング用デバイス封止 | |
| JPH022289B2 (nl) | ||
| JPH0240937A (ja) | 半導体パッケージ | |
| JPS6322615B2 (nl) | ||
| JPS60180151A (ja) | バンプ付基板及びその製作法 | |
| JPS58197863A (ja) | 半導体装置 | |
| JPH0365034B2 (nl) | ||
| JP2743524B2 (ja) | 混成集積回路装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |