JPH0458197B2 - - Google Patents

Info

Publication number
JPH0458197B2
JPH0458197B2 JP63051517A JP5151788A JPH0458197B2 JP H0458197 B2 JPH0458197 B2 JP H0458197B2 JP 63051517 A JP63051517 A JP 63051517A JP 5151788 A JP5151788 A JP 5151788A JP H0458197 B2 JPH0458197 B2 JP H0458197B2
Authority
JP
Japan
Prior art keywords
mark
marks
lower layer
upper layer
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63051517A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01226194A (ja
Inventor
Tadashi Takagaki
Isao Kinumegawa
Tomoaki Umeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Techno Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Techno Engineering Co Ltd filed Critical Hitachi Techno Engineering Co Ltd
Priority to JP63051517A priority Critical patent/JPH01226194A/ja
Publication of JPH01226194A publication Critical patent/JPH01226194A/ja
Publication of JPH0458197B2 publication Critical patent/JPH0458197B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Inking, Control Or Cleaning Of Printing Machines (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP63051517A 1988-03-07 1988-03-07 重なり合うマークの相対位置を検出する装置 Granted JPH01226194A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63051517A JPH01226194A (ja) 1988-03-07 1988-03-07 重なり合うマークの相対位置を検出する装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63051517A JPH01226194A (ja) 1988-03-07 1988-03-07 重なり合うマークの相対位置を検出する装置

Publications (2)

Publication Number Publication Date
JPH01226194A JPH01226194A (ja) 1989-09-08
JPH0458197B2 true JPH0458197B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-09-16

Family

ID=12889202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63051517A Granted JPH01226194A (ja) 1988-03-07 1988-03-07 重なり合うマークの相対位置を検出する装置

Country Status (1)

Country Link
JP (1) JPH01226194A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5271006B2 (ja) * 2008-08-28 2013-08-21 アンリツ株式会社 印刷はんだ検査装置及び印刷はんだ検査方法
JP5243936B2 (ja) * 2008-12-12 2013-07-24 アンリツ株式会社 印刷はんだ検査装置

Also Published As

Publication number Publication date
JPH01226194A (ja) 1989-09-08

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