JPH0457696B2 - - Google Patents

Info

Publication number
JPH0457696B2
JPH0457696B2 JP56028972A JP2897281A JPH0457696B2 JP H0457696 B2 JPH0457696 B2 JP H0457696B2 JP 56028972 A JP56028972 A JP 56028972A JP 2897281 A JP2897281 A JP 2897281A JP H0457696 B2 JPH0457696 B2 JP H0457696B2
Authority
JP
Japan
Prior art keywords
resin
polyfunctional
polyphenylene ether
weight
resins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56028972A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57143320A (en
Inventor
Akitoshi Sugio
Masanobu Sho
Masatsugu Matsunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP56028972A priority Critical patent/JPS57143320A/ja
Priority to US06/352,029 priority patent/US4496695A/en
Priority to DE19823207260 priority patent/DE3207260A1/de
Publication of JPS57143320A publication Critical patent/JPS57143320A/ja
Publication of JPH0457696B2 publication Critical patent/JPH0457696B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)
  • Epoxy Resins (AREA)
JP56028972A 1981-02-28 1981-02-28 Novel curable resin composition Granted JPS57143320A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP56028972A JPS57143320A (en) 1981-02-28 1981-02-28 Novel curable resin composition
US06/352,029 US4496695A (en) 1981-02-28 1982-02-24 Curable resin composition
DE19823207260 DE3207260A1 (de) 1981-02-28 1982-03-01 Haertbare harzmasse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56028972A JPS57143320A (en) 1981-02-28 1981-02-28 Novel curable resin composition

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP14964591A Division JPH0621221B2 (ja) 1991-05-24 1991-05-24 硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
JPS57143320A JPS57143320A (en) 1982-09-04
JPH0457696B2 true JPH0457696B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-09-14

Family

ID=12263327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56028972A Granted JPS57143320A (en) 1981-02-28 1981-02-28 Novel curable resin composition

Country Status (3)

Country Link
US (1) US4496695A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS57143320A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3207260A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58225150A (ja) * 1982-06-22 1983-12-27 Toray Ind Inc ポリアリ−レンエ−テル組成物
US4645805A (en) * 1984-03-14 1987-02-24 Mitsubishi Gas Chemical Company, Inc. Adhesive composition and adhesive film or sheet on which the composition is coated
DE3444099A1 (de) * 1984-12-04 1986-06-05 Basf Ag, 6700 Ludwigshafen Poly(phenylenether) und verfahren zu ihrer herstellung
US4623558A (en) * 1985-05-29 1986-11-18 W. R. Grace & Co. Reactive plastisol dispersion
US5260121A (en) * 1986-11-06 1993-11-09 Amoco Corporation Fiber-reinforced composite of cyanate ester, epoxy resin and thermoplast
US4774282A (en) * 1986-11-20 1988-09-27 Amoco Corporation Thermoset composition comprising aromatic cyanate ester, allyl ethers of bisphenol and bismaleimide
US4912172A (en) * 1987-09-03 1990-03-27 General Electric Company Compositions comprising polyphenylene ethers, polyepoxides and aluminum or zinc diketone salt
US5434224A (en) * 1987-10-05 1995-07-18 Imperial Chemical Industries Plc Thermoset and polyarylsulfone resin system that forms an interpenetrating network
US4954200A (en) * 1987-11-10 1990-09-04 The General Electric Company Method of making drill back-up material for small bore drilling of circuit boards
US4983669A (en) * 1988-03-07 1991-01-08 Aristech Chemical Corporation Thermosetting composition from maleimide, olefinic monomer and unsaturated polyester
US5385989A (en) * 1991-04-15 1995-01-31 Mitsubishi Gas Chemical Company, Inc. Thermal resistance resin dust for friction material
EP0606500B1 (en) * 1992-08-03 1997-06-04 Showa Highpolymer Co., Ltd. Thermosetting resin composition and production of copper-clad laminated board therefrom
DE69318665T2 (de) * 1992-10-09 1998-12-10 General Electric Co., Schenectady, N.Y. Polyphenylenether/Polyepoxid Harzzusammensetzungen
JPH06228308A (ja) * 1992-12-29 1994-08-16 Internatl Business Mach Corp <Ibm> トリアジン重合体およびその使用
US5312481A (en) * 1993-02-08 1994-05-17 Marcia Greiner Dimensional non-fabric paint and art-and-craft structure produced therewith
US5827907A (en) * 1993-08-30 1998-10-27 Ibm Corporation Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin
US5834565A (en) * 1996-11-12 1998-11-10 General Electric Company Curable polyphenylene ether-thermosetting resin composition and process
DE19715062C2 (de) * 1997-04-11 2000-11-23 Daimler Chrysler Ag Verfahren zur Applikation einer korrosionsschützenden Haftschicht auf ein metallisches Substrat
EP0889096B1 (en) 1997-07-04 2002-09-11 Hitachi Chemical Company, Ltd. Modified cyanate ester group curable resin composition, and varnish, prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the same
US20010020071A1 (en) 1997-10-10 2001-09-06 Capote Miguel Albert High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants
US6197898B1 (en) 1997-11-18 2001-03-06 General Electric Company Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent
US6245841B1 (en) 1998-03-23 2001-06-12 General Electric Company Cyanate ester based thermoset compositions
US6194495B1 (en) * 1998-03-23 2001-02-27 General Electric Company Cyanate ester based thermoset compositions
WO2000071614A1 (en) * 1999-05-21 2000-11-30 Miguel Albert Capote High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants
US6906120B1 (en) * 2000-06-20 2005-06-14 General Electric Poly(arylene ether) adhesive compositions
US6750301B1 (en) * 2000-07-07 2004-06-15 National Starch And Chemical Investment Holding Corporation Die attach adhesives with epoxy compound or resin having allyl or vinyl groups
US7022777B2 (en) * 2001-06-28 2006-04-04 General Electric Moldable poly(arylene ether) thermosetting compositions, methods, and articles
US6835785B2 (en) * 2002-01-28 2004-12-28 Mitsubishi Gas Chemical Company, Inc. Polyphenylene ether oligomer compound, derivatives thereof and use thereof
AU2003266671A1 (en) * 2002-09-30 2004-04-19 Hitachi Chemical Co., Ltd. Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same
US20060074151A1 (en) * 2004-09-28 2006-04-06 Polyclad Laminates, Inc. Low expansion dielectric compositions
US7943242B2 (en) 2006-03-30 2011-05-17 Becton, Dickinson And Company Sealing members, articles using the same and methods of reducing sticktion
US8075995B2 (en) * 2006-03-30 2011-12-13 Becton, Dickinson And Company Coating system, articles and assembly using the same and methods of reducing sticktion
EP2061529B1 (en) * 2006-09-15 2013-07-24 Becton, Dickinson & Company Medical components having coated surfaces exhibiting low friction and methods of reducing sticktion
JP5334383B2 (ja) * 2006-10-10 2013-11-06 元旦ビューティ工業株式会社 外装材用複合材、建築用外装材、及び建築物の外装構造
JP5239743B2 (ja) * 2007-10-29 2013-07-17 三菱瓦斯化学株式会社 樹脂組成物並びにこれを用いたプリプレグ及び積層板
US8802603B2 (en) 2010-06-17 2014-08-12 Becton, Dickinson And Company Medical components having coated surfaces exhibiting low friction and low reactivity
US8662877B2 (en) 2010-10-29 2014-03-04 Karl von Kries System, method and apparatus for solar heated manufacturing
EP2770005B1 (en) 2011-10-18 2019-05-08 Guangdong Shengyi Sci. Tech Co., Ltd Epoxy resin composition and high frequency electronic-circuit substrate manufactured by using the same
WO2013167617A2 (en) 2012-05-07 2013-11-14 Becton Dickinson France Lubricant coating for medical container
KR20150068958A (ko) 2012-10-12 2015-06-22 디에스엠 아이피 어셋츠 비.브이. 복합 방탄 레이돔 벽 및 이의 제조 방법
US10153546B2 (en) 2013-07-02 2018-12-11 Dsm Ip Assets B.V. Composite antiballistic radome walls and methods of making the same
JP6384711B2 (ja) * 2014-06-23 2018-09-05 日立化成株式会社 絶縁性樹脂組成物及びこれを用いたプリプレグ、プリント配線板用積層板
TWI745627B (zh) * 2018-10-23 2021-11-11 台燿科技股份有限公司 熱固性樹脂組合物，使用彼所製得之預浸漬片、金屬箔積層板及印刷電路板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817488B2 (ja) * 1976-07-28 1983-04-07 三菱電機株式会社 耐熱性樹脂組成物
JPS5840974B2 (ja) * 1977-02-07 1983-09-09 三菱電機株式会社 耐熱性成形物の製造法
US4315086A (en) * 1979-08-08 1982-02-09 Sumitomo Chemical Company, Limited Resin compositions

Also Published As

Publication number Publication date
US4496695A (en) 1985-01-29
DE3207260A1 (de) 1982-09-23
JPS57143320A (en) 1982-09-04
DE3207260C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-06-11

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