JPS57143320A - Novel curable resin composition - Google Patents

Novel curable resin composition

Info

Publication number
JPS57143320A
JPS57143320A JP56028972A JP2897281A JPS57143320A JP S57143320 A JPS57143320 A JP S57143320A JP 56028972 A JP56028972 A JP 56028972A JP 2897281 A JP2897281 A JP 2897281A JP S57143320 A JPS57143320 A JP S57143320A
Authority
JP
Japan
Prior art keywords
prepolymer
polyfunctional
components
polyamine
bis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56028972A
Other languages
English (en)
Other versions
JPH0457696B2 (ja
Inventor
Akitoshi Sugio
Masanobu Sho
Masatsugu Matsunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP56028972A priority Critical patent/JPS57143320A/ja
Priority to US06/352,029 priority patent/US4496695A/en
Priority to DE19823207260 priority patent/DE3207260A1/de
Publication of JPS57143320A publication Critical patent/JPS57143320A/ja
Publication of JPH0457696B2 publication Critical patent/JPH0457696B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)
  • Epoxy Resins (AREA)
JP56028972A 1981-02-28 1981-02-28 Novel curable resin composition Granted JPS57143320A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP56028972A JPS57143320A (en) 1981-02-28 1981-02-28 Novel curable resin composition
US06/352,029 US4496695A (en) 1981-02-28 1982-02-24 Curable resin composition
DE19823207260 DE3207260A1 (de) 1981-02-28 1982-03-01 Haertbare harzmasse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56028972A JPS57143320A (en) 1981-02-28 1981-02-28 Novel curable resin composition

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP14964591A Division JPH0621221B2 (ja) 1991-05-24 1991-05-24 硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
JPS57143320A true JPS57143320A (en) 1982-09-04
JPH0457696B2 JPH0457696B2 (ja) 1992-09-14

Family

ID=12263327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56028972A Granted JPS57143320A (en) 1981-02-28 1981-02-28 Novel curable resin composition

Country Status (3)

Country Link
US (1) US4496695A (ja)
JP (1) JPS57143320A (ja)
DE (1) DE3207260A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58225150A (ja) * 1982-06-22 1983-12-27 Toray Ind Inc ポリアリ−レンエ−テル組成物
JP2008115684A (ja) * 2006-10-10 2008-05-22 Gantan Beauty Ind Co Ltd 外装材用複合材、建築用外装材、及び建築物の外装構造
WO2013056419A1 (zh) 2011-10-18 2013-04-25 广东生益科技股份有限公司 环氧树脂组合物及使用其制作的高频电路基板
JP2016008229A (ja) * 2014-06-23 2016-01-18 日立化成株式会社 絶縁性樹脂組成物及びこれを用いたプリプレグ、プリント配線板用積層板

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4645805A (en) * 1984-03-14 1987-02-24 Mitsubishi Gas Chemical Company, Inc. Adhesive composition and adhesive film or sheet on which the composition is coated
DE3444099A1 (de) * 1984-12-04 1986-06-05 Basf Ag, 6700 Ludwigshafen Poly(phenylenether) und verfahren zu ihrer herstellung
US4623558A (en) * 1985-05-29 1986-11-18 W. R. Grace & Co. Reactive plastisol dispersion
US5260121A (en) * 1986-11-06 1993-11-09 Amoco Corporation Fiber-reinforced composite of cyanate ester, epoxy resin and thermoplast
US4774282A (en) * 1986-11-20 1988-09-27 Amoco Corporation Thermoset composition comprising aromatic cyanate ester, allyl ethers of bisphenol and bismaleimide
US4912172A (en) * 1987-09-03 1990-03-27 General Electric Company Compositions comprising polyphenylene ethers, polyepoxides and aluminum or zinc diketone salt
US5434224A (en) * 1987-10-05 1995-07-18 Imperial Chemical Industries Plc Thermoset and polyarylsulfone resin system that forms an interpenetrating network
US4954200A (en) * 1987-11-10 1990-09-04 The General Electric Company Method of making drill back-up material for small bore drilling of circuit boards
US4983669A (en) * 1988-03-07 1991-01-08 Aristech Chemical Corporation Thermosetting composition from maleimide, olefinic monomer and unsaturated polyester
US5385989A (en) * 1991-04-15 1995-01-31 Mitsubishi Gas Chemical Company, Inc. Thermal resistance resin dust for friction material
DE69311290T2 (de) * 1992-08-03 1997-10-30 Showa Highpolymer Hitzehaertbare harzzusammensetzung und deren herstellung aus kupferkaschierten schichtstoffplatten
ES2115730T3 (es) * 1992-10-09 1998-07-01 Gen Electric Sistema de resinas de polieter de fenileno/poliepoxido.
JPH06228308A (ja) * 1992-12-29 1994-08-16 Internatl Business Mach Corp <Ibm> トリアジン重合体およびその使用
US5312481A (en) * 1993-02-08 1994-05-17 Marcia Greiner Dimensional non-fabric paint and art-and-craft structure produced therewith
US5827907A (en) * 1993-08-30 1998-10-27 Ibm Corporation Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin
US5834565A (en) * 1996-11-12 1998-11-10 General Electric Company Curable polyphenylene ether-thermosetting resin composition and process
DE19715062C2 (de) * 1997-04-11 2000-11-23 Daimler Chrysler Ag Verfahren zur Applikation einer korrosionsschützenden Haftschicht auf ein metallisches Substrat
DE69807793T2 (de) 1997-07-04 2003-08-14 Hitachi Chemical Co Ltd Mit einem Cyanatester modifizierte härtbare Harzzusammensetzung und daraus hergestellter Lack, Prepreg, mit Metall bedeckte Schichtplatte, Film, gedruckte Leiterplatte und Mehrschichtleiterplatte
US20010020071A1 (en) 1997-10-10 2001-09-06 Capote Miguel Albert High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants
US6197898B1 (en) 1997-11-18 2001-03-06 General Electric Company Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent
US6245841B1 (en) 1998-03-23 2001-06-12 General Electric Company Cyanate ester based thermoset compositions
US6194495B1 (en) 1998-03-23 2001-02-27 General Electric Company Cyanate ester based thermoset compositions
WO2000071614A1 (en) * 1999-05-21 2000-11-30 Miguel Albert Capote High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants
US6906120B1 (en) * 2000-06-20 2005-06-14 General Electric Poly(arylene ether) adhesive compositions
US6750301B1 (en) * 2000-07-07 2004-06-15 National Starch And Chemical Investment Holding Corporation Die attach adhesives with epoxy compound or resin having allyl or vinyl groups
US7022777B2 (en) * 2001-06-28 2006-04-04 General Electric Moldable poly(arylene ether) thermosetting compositions, methods, and articles
US6835785B2 (en) * 2002-01-28 2004-12-28 Mitsubishi Gas Chemical Company, Inc. Polyphenylene ether oligomer compound, derivatives thereof and use thereof
KR100990316B1 (ko) * 2002-09-30 2010-10-26 히다치 가세고교 가부시끼가이샤 인쇄 배선판용 수지 조성물, 및 이것을 사용한 와니스,프리프레그 및 금속 피복 적층판
US20060074151A1 (en) * 2004-09-28 2006-04-06 Polyclad Laminates, Inc. Low expansion dielectric compositions
US7943242B2 (en) * 2006-03-30 2011-05-17 Becton, Dickinson And Company Sealing members, articles using the same and methods of reducing sticktion
US8075995B2 (en) * 2006-03-30 2011-12-13 Becton, Dickinson And Company Coating system, articles and assembly using the same and methods of reducing sticktion
JP5498790B2 (ja) * 2006-09-15 2014-05-21 ベクトン・ディキンソン・アンド・カンパニー 低摩擦を示すコーティングされた面を有する医療部品およびスティクションを低下させる方法
JP5239743B2 (ja) * 2007-10-29 2013-07-17 三菱瓦斯化学株式会社 樹脂組成物並びにこれを用いたプリプレグ及び積層板
US8802603B2 (en) 2010-06-17 2014-08-12 Becton, Dickinson And Company Medical components having coated surfaces exhibiting low friction and low reactivity
US8662877B2 (en) 2010-10-29 2014-03-04 Karl von Kries System, method and apparatus for solar heated manufacturing
JP5945071B2 (ja) 2012-05-07 2016-07-05 ベクトン ディキンソン フランス 医療容器用潤滑性コーティング
IN2015DN01682A (ja) 2012-10-12 2015-07-03 Dsm Ip Assets Bv
JP6432746B2 (ja) 2013-07-02 2018-12-05 ディーエスエム アイピー アセッツ ビー．ブイ．Ｄｓｍ Ｉｐ Ａｓｓｅｔｓ Ｂ．Ｖ． 複合防弾レドーム壁およびその製造方法
TWI745627B (zh) * 2018-10-23 2021-11-11 台燿科技股份有限公司 熱固性樹脂組合物，使用彼所製得之預浸漬片、金屬箔積層板及印刷電路板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5316099A (en) * 1976-07-28 1978-02-14 Mitsubishi Electric Corp Heat-resistant resin composition
JPS5397097A (en) * 1977-02-07 1978-08-24 Mitsubishi Electric Corp Preparation of heat resistant molding articles

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4315086A (en) * 1979-08-08 1982-02-09 Sumitomo Chemical Company, Limited Resin compositions

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5316099A (en) * 1976-07-28 1978-02-14 Mitsubishi Electric Corp Heat-resistant resin composition
JPS5397097A (en) * 1977-02-07 1978-08-24 Mitsubishi Electric Corp Preparation of heat resistant molding articles

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58225150A (ja) * 1982-06-22 1983-12-27 Toray Ind Inc ポリアリ−レンエ−テル組成物
JP2008115684A (ja) * 2006-10-10 2008-05-22 Gantan Beauty Ind Co Ltd 外装材用複合材、建築用外装材、及び建築物の外装構造
WO2013056419A1 (zh) 2011-10-18 2013-04-25 广东生益科技股份有限公司 环氧树脂组合物及使用其制作的高频电路基板
JP2016008229A (ja) * 2014-06-23 2016-01-18 日立化成株式会社 絶縁性樹脂組成物及びこれを用いたプリプレグ、プリント配線板用積層板

Also Published As

Publication number Publication date
JPH0457696B2 (ja) 1992-09-14
US4496695A (en) 1985-01-29
DE3207260C2 (ja) 1987-06-11
DE3207260A1 (de) 1982-09-23

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