JPS56152831A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS56152831A JPS56152831A JP5646180A JP5646180A JPS56152831A JP S56152831 A JPS56152831 A JP S56152831A JP 5646180 A JP5646180 A JP 5646180A JP 5646180 A JP5646180 A JP 5646180A JP S56152831 A JPS56152831 A JP S56152831A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- isopropenylphenyl
- glycidyl ether
- thermosetting resin
- mechanical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Organic Insulating Materials (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: To produce titled resin composition superior in heat resistance and mechanical and electrical characteristics and useful as impregnating resin for electric equipment, by incorporating a m-isopropenylphenyl glycidyl ether and a polyfunctional cyanic ester compound.
CONSTITUTION: 1eq. (in terms of glycidyl group of a m-isopropenylphenyl glycidyl ether [e.g., m-isopropenylphenyl (methyl)glycidyl ether] of the given formula (where R and R' are H or CH3) is mixed with 1.2W8.0eq. of a polyfunctional cyanic ester compound [e.g., 2,2-bis(4-cyanatophenyl)-propane]. Normally, the resulting thermosetting resin composition is polymerized with heating at 50W300°C in the presence of a hardening catalyst, such as an amino compound, Lewis acid and an imidazole, to give a hardened, class H(180°C) resin superior in heat resistance and mechanical and electrical characteristics.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5646180A JPS56152831A (en) | 1980-04-28 | 1980-04-28 | Thermosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5646180A JPS56152831A (en) | 1980-04-28 | 1980-04-28 | Thermosetting resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56152831A true JPS56152831A (en) | 1981-11-26 |
JPS6142928B2 JPS6142928B2 (en) | 1986-09-25 |
Family
ID=13027731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5646180A Granted JPS56152831A (en) | 1980-04-28 | 1980-04-28 | Thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56152831A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006273950A (en) * | 2005-03-28 | 2006-10-12 | Sumitomo Bakelite Co Ltd | Resin composition, laminated article and circuit board and method for producing circuit board |
-
1980
- 1980-04-28 JP JP5646180A patent/JPS56152831A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006273950A (en) * | 2005-03-28 | 2006-10-12 | Sumitomo Bakelite Co Ltd | Resin composition, laminated article and circuit board and method for producing circuit board |
Also Published As
Publication number | Publication date |
---|---|
JPS6142928B2 (en) | 1986-09-25 |
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