JPH0457436B2 - - Google Patents

Info

Publication number
JPH0457436B2
JPH0457436B2 JP62310522A JP31052287A JPH0457436B2 JP H0457436 B2 JPH0457436 B2 JP H0457436B2 JP 62310522 A JP62310522 A JP 62310522A JP 31052287 A JP31052287 A JP 31052287A JP H0457436 B2 JPH0457436 B2 JP H0457436B2
Authority
JP
Japan
Prior art keywords
adhesive
soldering
parts
temporary
rosin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62310522A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01150493A (ja
Inventor
Yoko Baba
Yoneji Sato
Sandai Iwasa
Yoichi Ooba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Laboratory Co Ltd
Original Assignee
Asahi Chemical Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Laboratory Co Ltd filed Critical Asahi Chemical Laboratory Co Ltd
Priority to JP62310522A priority Critical patent/JPH01150493A/ja
Publication of JPH01150493A publication Critical patent/JPH01150493A/ja
Publication of JPH0457436B2 publication Critical patent/JPH0457436B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Breeding Of Plants And Reproduction By Means Of Culturing (AREA)
  • Micro-Organisms Or Cultivation Processes Thereof (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP62310522A 1987-12-08 1987-12-08 はんだ付け用一時接着剤 Granted JPH01150493A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62310522A JPH01150493A (ja) 1987-12-08 1987-12-08 はんだ付け用一時接着剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62310522A JPH01150493A (ja) 1987-12-08 1987-12-08 はんだ付け用一時接着剤

Publications (2)

Publication Number Publication Date
JPH01150493A JPH01150493A (ja) 1989-06-13
JPH0457436B2 true JPH0457436B2 (enExample) 1992-09-11

Family

ID=18006241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62310522A Granted JPH01150493A (ja) 1987-12-08 1987-12-08 はんだ付け用一時接着剤

Country Status (1)

Country Link
JP (1) JPH01150493A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774328B2 (ja) * 1989-09-05 1995-08-09 千住金属工業株式会社 電子部品の仮固定用粘着剤
JP2000144082A (ja) * 1998-11-16 2000-05-26 Minnesota Mining & Mfg Co <3M> 熱硬化性接着剤組成物、接着剤、および接着剤の製造方法
JP4492893B2 (ja) * 1999-03-17 2010-06-30 株式会社Ｄｎｐファインケミカル 液状仮着接着剤
JP4739680B2 (ja) * 2004-02-04 2011-08-03 スタンレー電気株式会社 半導体装置の製造方法及び半導体装置
CN100349688C (zh) * 2005-07-16 2007-11-21 李昕 用于配制焊锡膏的焊剂组合物
JP6410164B1 (ja) * 2018-02-28 2018-10-24 千住金属工業株式会社 フラックス及びソルダペースト
JPWO2022195937A1 (enExample) * 2021-03-18 2022-09-22
US20240282594A1 (en) * 2021-06-03 2024-08-22 Panasonic Intellectual Property Management Co., Ltd. Electronic-component-mounting-substrate manufacturing method
WO2022254819A1 (ja) * 2021-06-03 2022-12-08 パナソニックＩｐマネジメント株式会社 電子部品実装基板の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58177306A (ja) * 1982-04-10 1983-10-18 信越産業株式会社 型枠剥離用組成物

Also Published As

Publication number Publication date
JPH01150493A (ja) 1989-06-13

Similar Documents

Publication Publication Date Title
TW317519B (enExample)
JP4438974B2 (ja) ソルダペ−スト
JP5667101B2 (ja) はんだ組成物およびその製造方法、並びにプリント配線基板
JP2005528224A5 (enExample)
JP5856747B2 (ja) はんだ付け用フラックスおよびはんだペースト組成物
JP6359499B2 (ja) 耐冷熱衝撃フラックス組成物、ソルダペースト組成物および電子回路基板
JP2002336992A (ja) 回路基板はんだ付用はんだ加工物及び回路基板
KR20110094714A (ko) 솔더 잉크 및 이를 이용한 전자소자 패키지
JP6136851B2 (ja) はんだ用フラックスおよびはんだペースト
JPH0457436B2 (enExample)
JP6619376B2 (ja) 熱硬化性フラックス組成物、はんだ組成物および電子基板の製造方法
JP6383544B2 (ja) はんだ付け用フラックス組成物およびそれを用いた電子基板の製造方法
JP2012084845A (ja) パッケージ部品の接合方法およびその方法に用いる熱硬化性樹脂組成物
JP2001150184A (ja) リフローはんだ付用ソルダーペースト組成物及び回路基板
US6010577A (en) Multifunctional soldering flux with borneol
CN102896440B (zh) 助焊剂组合物和包含该助焊剂组合物的无铅焊膏
CN116604223A (zh) 焊剂组合物、焊料组合物、以及电子基板的制造方法
EP3878596A1 (en) Flux, method for applying flux, and method for mounting solder ball
JP7634044B2 (ja) はんだ組成物、および電子基板
JPH0596396A (ja) クリーム半田
JP7478173B2 (ja) フラックス組成物、およびはんだ組成物
JP2964419B2 (ja) クリームはんだ
JP2014004590A (ja) はんだ組成物
JP2004025288A (ja) 回路基板はんだ付用フラックス、ソルダーペースト及び回路基板
JPH0929486A (ja) クリームはんだ