JPH0454577B2 - - Google Patents

Info

Publication number
JPH0454577B2
JPH0454577B2 JP59267749A JP26774984A JPH0454577B2 JP H0454577 B2 JPH0454577 B2 JP H0454577B2 JP 59267749 A JP59267749 A JP 59267749A JP 26774984 A JP26774984 A JP 26774984A JP H0454577 B2 JPH0454577 B2 JP H0454577B2
Authority
JP
Japan
Prior art keywords
epoxy resin
copper
plate
clad laminate
metal core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59267749A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61144339A (ja
Inventor
Atsushi Fujioka
Yasuo Myadera
Toshuki Iijima
Akinari Kida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP59267749A priority Critical patent/JPS61144339A/ja
Publication of JPS61144339A publication Critical patent/JPS61144339A/ja
Publication of JPH0454577B2 publication Critical patent/JPH0454577B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Laminated Bodies (AREA)
JP59267749A 1984-12-19 1984-12-19 金属コアエポキシ樹脂銅張積層板の製造方法 Granted JPS61144339A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59267749A JPS61144339A (ja) 1984-12-19 1984-12-19 金属コアエポキシ樹脂銅張積層板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59267749A JPS61144339A (ja) 1984-12-19 1984-12-19 金属コアエポキシ樹脂銅張積層板の製造方法

Publications (2)

Publication Number Publication Date
JPS61144339A JPS61144339A (ja) 1986-07-02
JPH0454577B2 true JPH0454577B2 (enrdf_load_stackoverflow) 1992-08-31

Family

ID=17449039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59267749A Granted JPS61144339A (ja) 1984-12-19 1984-12-19 金属コアエポキシ樹脂銅張積層板の製造方法

Country Status (1)

Country Link
JP (1) JPS61144339A (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63147636A (ja) * 1986-12-11 1988-06-20 日立化成工業株式会社 珪素鋼板ベ−ス銅張積層板の製造方法
JP2734345B2 (ja) * 1993-08-24 1998-03-30 新神戸電機株式会社 積層板用ガラス繊維不織布の製造法および積層板の製造法
JP4993039B2 (ja) * 2009-10-16 2012-08-08 アイシン精機株式会社 複合成形品
US9333454B2 (en) 2011-01-21 2016-05-10 International Business Machines Corporation Silicone-based chemical filter and silicone-based chemical bath for removing sulfur contaminants
US8900491B2 (en) 2011-05-06 2014-12-02 International Business Machines Corporation Flame retardant filler
US9186641B2 (en) 2011-08-05 2015-11-17 International Business Machines Corporation Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability
US8741804B2 (en) 2011-10-28 2014-06-03 International Business Machines Corporation Microcapsules adapted to rupture in a magnetic field
US9716055B2 (en) 2012-06-13 2017-07-25 International Business Machines Corporation Thermal interface material (TIM) with thermally conductive integrated release layer
JP7205706B2 (ja) * 2019-10-02 2023-01-17 東洋紡株式会社 積層体製造装置、及び、積層体の製造方法
KR102428824B1 (ko) * 2019-12-11 2022-08-02 주식회사 포스코 금속-플라스틱 복합소재 및 이의 제조 방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5884488A (ja) * 1981-11-13 1983-05-20 日本電解株式会社 印刷回路用銅張積層板
JPS5896660A (ja) * 1981-12-03 1983-06-08 Mitsubishi Chem Ind Ltd 金属コア回路基板絶縁用エポキシ樹脂系粉体塗料組成物

Also Published As

Publication number Publication date
JPS61144339A (ja) 1986-07-02

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