JPS61144339A - 金属コアエポキシ樹脂銅張積層板の製造方法 - Google Patents
金属コアエポキシ樹脂銅張積層板の製造方法Info
- Publication number
- JPS61144339A JPS61144339A JP59267749A JP26774984A JPS61144339A JP S61144339 A JPS61144339 A JP S61144339A JP 59267749 A JP59267749 A JP 59267749A JP 26774984 A JP26774984 A JP 26774984A JP S61144339 A JPS61144339 A JP S61144339A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- plate
- copper
- metal core
- clad laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims description 59
- 229920000647 polyepoxide Polymers 0.000 title claims description 59
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 229910052802 copper Inorganic materials 0.000 title claims description 6
- 239000010949 copper Substances 0.000 title claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 35
- 229910052782 aluminium Inorganic materials 0.000 claims description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 20
- 239000011889 copper foil Substances 0.000 claims description 12
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 238000005498 polishing Methods 0.000 claims description 9
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 8
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 239000004744 fabric Substances 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical group CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 3
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 claims description 3
- CNODSORTHKVDEM-UHFFFAOYSA-N 4-trimethoxysilylaniline Chemical compound CO[Si](OC)(OC)C1=CC=C(N)C=C1 CNODSORTHKVDEM-UHFFFAOYSA-N 0.000 claims description 2
- 229910000976 Electrical steel Inorganic materials 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 239000013040 bath agent Substances 0.000 claims description 2
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical group CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 claims 1
- 238000011282 treatment Methods 0.000 description 17
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 10
- 238000010521 absorption reaction Methods 0.000 description 10
- 238000005476 soldering Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 238000009835 boiling Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 5
- 238000007667 floating Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000002966 varnish Substances 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- MZWXWSVCNSPBLH-UHFFFAOYSA-N 3-(3-aminopropyl-methoxy-methylsilyl)oxypropan-1-amine Chemical compound NCCC[Si](C)(OC)OCCCN MZWXWSVCNSPBLH-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 241000219112 Cucumis Species 0.000 description 1
- 235000015510 Cucumis melo subsp melo Nutrition 0.000 description 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 241000233855 Orchidaceae Species 0.000 description 1
- 241000282806 Rhinoceros Species 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- FJJCIZWZNKZHII-UHFFFAOYSA-N [4,6-bis(cyanoamino)-1,3,5-triazin-2-yl]cyanamide Chemical compound N#CNC1=NC(NC#N)=NC(NC#N)=N1 FJJCIZWZNKZHII-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59267749A JPS61144339A (ja) | 1984-12-19 | 1984-12-19 | 金属コアエポキシ樹脂銅張積層板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59267749A JPS61144339A (ja) | 1984-12-19 | 1984-12-19 | 金属コアエポキシ樹脂銅張積層板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61144339A true JPS61144339A (ja) | 1986-07-02 |
| JPH0454577B2 JPH0454577B2 (enrdf_load_stackoverflow) | 1992-08-31 |
Family
ID=17449039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59267749A Granted JPS61144339A (ja) | 1984-12-19 | 1984-12-19 | 金属コアエポキシ樹脂銅張積層板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61144339A (enrdf_load_stackoverflow) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63147636A (ja) * | 1986-12-11 | 1988-06-20 | 日立化成工業株式会社 | 珪素鋼板ベ−ス銅張積層板の製造方法 |
| US5662776A (en) * | 1993-08-24 | 1997-09-02 | Shin-Kobe Electric Machinery Co. | Glass fiber non-woven fabric, a method of producing glass fiber non-woven fabric and a method of producing a laminate |
| WO2011045895A1 (ja) * | 2009-10-16 | 2011-04-21 | アイシン精機株式会社 | 複合成形品 |
| US9186641B2 (en) | 2011-08-05 | 2015-11-17 | International Business Machines Corporation | Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability |
| US9283514B2 (en) | 2011-01-21 | 2016-03-15 | International Business Machines Corporation | Silicone-based chemical filter and silicone-based chemical bath for removing sulfur contaminants |
| US9303047B2 (en) | 2011-05-06 | 2016-04-05 | International Business Machines Corporation | Flame retardant filler |
| US9307692B2 (en) | 2011-10-28 | 2016-04-12 | International Business Machines Corporation | Microcapsules adapted to rupture in a magnetic field |
| KR20210074036A (ko) * | 2019-12-11 | 2021-06-21 | 주식회사 포스코 | 금속-플라스틱 복합소재 및 이의 제조 방법 |
| CN114423612A (zh) * | 2019-10-02 | 2022-04-29 | 东洋纺株式会社 | 层叠体制造装置以及层叠体的制造方法 |
| US11621210B2 (en) | 2012-06-13 | 2023-04-04 | International Business Machines Corporation | Thermal interface material (TIM) with thermally conductive integrated release layer |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5884488A (ja) * | 1981-11-13 | 1983-05-20 | 日本電解株式会社 | 印刷回路用銅張積層板 |
| JPS5896660A (ja) * | 1981-12-03 | 1983-06-08 | Mitsubishi Chem Ind Ltd | 金属コア回路基板絶縁用エポキシ樹脂系粉体塗料組成物 |
-
1984
- 1984-12-19 JP JP59267749A patent/JPS61144339A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5884488A (ja) * | 1981-11-13 | 1983-05-20 | 日本電解株式会社 | 印刷回路用銅張積層板 |
| JPS5896660A (ja) * | 1981-12-03 | 1983-06-08 | Mitsubishi Chem Ind Ltd | 金属コア回路基板絶縁用エポキシ樹脂系粉体塗料組成物 |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63147636A (ja) * | 1986-12-11 | 1988-06-20 | 日立化成工業株式会社 | 珪素鋼板ベ−ス銅張積層板の製造方法 |
| US5662776A (en) * | 1993-08-24 | 1997-09-02 | Shin-Kobe Electric Machinery Co. | Glass fiber non-woven fabric, a method of producing glass fiber non-woven fabric and a method of producing a laminate |
| WO2011045895A1 (ja) * | 2009-10-16 | 2011-04-21 | アイシン精機株式会社 | 複合成形品 |
| JP4993039B2 (ja) * | 2009-10-16 | 2012-08-08 | アイシン精機株式会社 | 複合成形品 |
| US8518521B2 (en) | 2009-10-16 | 2013-08-27 | Aisin Seiki Kabushiki Kaisha | Composite molded article |
| US9283514B2 (en) | 2011-01-21 | 2016-03-15 | International Business Machines Corporation | Silicone-based chemical filter and silicone-based chemical bath for removing sulfur contaminants |
| US10124302B2 (en) | 2011-01-21 | 2018-11-13 | International Business Machines Corporation | Removing sulfur contaminants from water using a silicone-based chemical filter |
| US10112155B2 (en) | 2011-01-21 | 2018-10-30 | International Business Machines Corporation | Removing sulfur contaminants from a fluid using a silicone-based chemical filter |
| US9333454B2 (en) | 2011-01-21 | 2016-05-10 | International Business Machines Corporation | Silicone-based chemical filter and silicone-based chemical bath for removing sulfur contaminants |
| US9908902B2 (en) | 2011-05-06 | 2018-03-06 | International Business Machines Corporation | Flame retardant filler |
| US9303047B2 (en) | 2011-05-06 | 2016-04-05 | International Business Machines Corporation | Flame retardant filler |
| US10059727B2 (en) | 2011-05-06 | 2018-08-28 | International Business Machines Corporation | Flame retardant filler |
| US10053473B2 (en) | 2011-05-06 | 2018-08-21 | International Business Machines Corporation | Flame retardant filler |
| US10040807B2 (en) | 2011-05-06 | 2018-08-07 | International Business Machines Corporation | Flame retardant filler |
| US9186641B2 (en) | 2011-08-05 | 2015-11-17 | International Business Machines Corporation | Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability |
| US9694337B2 (en) | 2011-08-05 | 2017-07-04 | International Business Machines Corporation | Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability |
| US9434133B2 (en) | 2011-08-05 | 2016-09-06 | International Business Machines Corporation | Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability |
| US9313946B2 (en) | 2011-10-28 | 2016-04-19 | International Business Machines Corporation | Microcapsules adapted to rupture in a magnetic field |
| US9307693B2 (en) | 2011-10-28 | 2016-04-12 | International Business Machines Corporation | Microcapsules adapted to rupture in a magnetic field |
| US9307692B2 (en) | 2011-10-28 | 2016-04-12 | International Business Machines Corporation | Microcapsules adapted to rupture in a magnetic field |
| US11621210B2 (en) | 2012-06-13 | 2023-04-04 | International Business Machines Corporation | Thermal interface material (TIM) with thermally conductive integrated release layer |
| CN114423612A (zh) * | 2019-10-02 | 2022-04-29 | 东洋纺株式会社 | 层叠体制造装置以及层叠体的制造方法 |
| KR20210074036A (ko) * | 2019-12-11 | 2021-06-21 | 주식회사 포스코 | 금속-플라스틱 복합소재 및 이의 제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0454577B2 (enrdf_load_stackoverflow) | 1992-08-31 |
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