JPH0451991B2 - - Google Patents
Info
- Publication number
- JPH0451991B2 JPH0451991B2 JP57076857A JP7685782A JPH0451991B2 JP H0451991 B2 JPH0451991 B2 JP H0451991B2 JP 57076857 A JP57076857 A JP 57076857A JP 7685782 A JP7685782 A JP 7685782A JP H0451991 B2 JPH0451991 B2 JP H0451991B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting device
- electrode
- insulating frame
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000012777 electrically insulating material Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000006355 external stress Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57076857A JPS58194382A (ja) | 1982-05-08 | 1982-05-08 | 発光装置用電極構体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57076857A JPS58194382A (ja) | 1982-05-08 | 1982-05-08 | 発光装置用電極構体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58194382A JPS58194382A (ja) | 1983-11-12 |
JPH0451991B2 true JPH0451991B2 (US06818201-20041116-C00086.png) | 1992-08-20 |
Family
ID=13617318
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57076857A Granted JPS58194382A (ja) | 1982-05-08 | 1982-05-08 | 発光装置用電極構体 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58194382A (US06818201-20041116-C00086.png) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0273364B1 (en) * | 1986-12-26 | 1992-03-25 | Idec Izumi Corporation | Electronic part carrying strip and method of manufacturing the same |
DE59402033D1 (de) | 1993-09-30 | 1997-04-17 | Siemens Ag | Zweipoliges SMT-Miniatur-Gehäuse für Halbleiterbauelemente und Verfahren zu dessen Herstellung |
JP2001518692A (ja) | 1997-07-29 | 2001-10-16 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー オッフェネ ハンデルスゲゼルシャフト | 光電素子 |
EP2416372B1 (en) * | 2009-03-30 | 2017-04-19 | AutoNetworks Technologies, Ltd. | Optical communication module and method for manufacturing optical communication module |
WO2010113910A1 (ja) * | 2009-03-30 | 2010-10-07 | 株式会社オートネットワーク技術研究所 | 光通信モジュール及び光通信モジュールの製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3914786A (en) * | 1974-04-19 | 1975-10-21 | Hewlett Packard Co | In-line reflective lead-pair for light-emitting diodes |
JPS5338973A (en) * | 1976-09-22 | 1978-04-10 | Hitachi Ltd | Lead frame |
JPS5388575A (en) * | 1977-01-13 | 1978-08-04 | Nec Corp | Production of lead frame for semiconductor device |
JPS55105388A (en) * | 1979-02-07 | 1980-08-12 | Toshiba Corp | Manufacture of light emission display device |
JPS5776856A (en) * | 1980-10-30 | 1982-05-14 | Toshiba Corp | Manufacture of semiconductor device |
JPS582079A (ja) * | 1981-06-29 | 1983-01-07 | Nippon Denyo Kk | Ledランプ及びその製法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50104565U (US06818201-20041116-C00086.png) * | 1974-02-01 | 1975-08-28 | ||
JPS53108880U (US06818201-20041116-C00086.png) * | 1977-02-08 | 1978-08-31 | ||
JPS5824453Y2 (ja) * | 1978-05-11 | 1983-05-25 | 三洋電機株式会社 | 発光ダイオ−ド基板 |
-
1982
- 1982-05-08 JP JP57076857A patent/JPS58194382A/ja active Granted
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3914786A (en) * | 1974-04-19 | 1975-10-21 | Hewlett Packard Co | In-line reflective lead-pair for light-emitting diodes |
JPS5338973A (en) * | 1976-09-22 | 1978-04-10 | Hitachi Ltd | Lead frame |
JPS5388575A (en) * | 1977-01-13 | 1978-08-04 | Nec Corp | Production of lead frame for semiconductor device |
JPS55105388A (en) * | 1979-02-07 | 1980-08-12 | Toshiba Corp | Manufacture of light emission display device |
JPS5776856A (en) * | 1980-10-30 | 1982-05-14 | Toshiba Corp | Manufacture of semiconductor device |
JPS582079A (ja) * | 1981-06-29 | 1983-01-07 | Nippon Denyo Kk | Ledランプ及びその製法 |
Also Published As
Publication number | Publication date |
---|---|
JPS58194382A (ja) | 1983-11-12 |