JPH04506886A - 電子部品の少なくとも1つのリードの位置を決定する方法及び装置 - Google Patents
電子部品の少なくとも1つのリードの位置を決定する方法及び装置Info
- Publication number
- JPH04506886A JPH04506886A JP3505379A JP50537991A JPH04506886A JP H04506886 A JPH04506886 A JP H04506886A JP 3505379 A JP3505379 A JP 3505379A JP 50537991 A JP50537991 A JP 50537991A JP H04506886 A JPH04506886 A JP H04506886A
- Authority
- JP
- Japan
- Prior art keywords
- image
- lead
- positions
- shadow
- determining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8829—Shadow projection or structured background, e.g. for deflectometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
Abstract
Description
Claims (12)
- 1.電子部品によって形成される平面の側方外側に位置する第1の位置からリー ドを照らし、前記リードの少なくとも一部の第1イメージをイメージ面に形成す るようにして、基準面に対して、電子部品、特に半導体要素の少なくとも1つの リードの位置を決定する方法であって、前記第1のイメージを形成する際に影イ メージを形成するとともに、前記第1の位置と異なる第2の位置から前記リード を照らして、前記イメージ面に第2の影イメージを形成し、前記第1影イメージ 及び第2影イメージの位置を定めて第3及び第4の位置を決定し、問題の位置を 前記第3及び第4の位置から決定することを特徴とする、方法。
- 2.前記第3及び第4の位置が、前記第1及び第2の影イメージの実質的に中間 に位置することを特徴とする、請求項1記載の方法。
- 3.前記第1及び第2の位置からの照射が実質的に反対側から行われることを特 徴とする、請求項1又は2記載の方法。
- 4.基準面が存在する位置に対応する第5の位置が決定されることを特徴とする 、請求項1乃至3のいずれか1つに記載の方法。
- 5.電子部品が配置される平面の側方外側に位置する第1の位置からリードを照 らすように設けられた照射手段と、照射された前記リードの少なくとも一部の第 1イメージをイメージ面に形成するようなイメージ形成部材とを有し、基準面に 対して、電子部品、特に半導体要素の少なくとも1つのリードの位置を決定する 装置であって、前記第1の位置と異なる第2位置の位置から前記リードを照らす ように照射手段が設けられており、前記イメージ形成部材が前記第2の位置から 照らされた前記リードの少なくとも一部の第2の影イメージを形成するようにな っており、前記装置が、前記イメージ形成部材に接続されるとともに、前記第1 及び第2影イメージの位置を定めて第3及び第4の位置を決定し前記第3及び第 4の位置から問題の位置を決定するようになっている位置決定部材を具えている ことを特徴とする、装置。
- 6.前記照射手段が、前記第1及び第2の位置に配置された第1及び第2光源を 有することを特徴とする、請求項5記載の装置。
- 7.前記第1及び第2位置が実質的に互いに対向していることを特徴とする、請 求項5又は6記載の装置。
- 8.前記位置決定部材が前記第3及び第4の位置の差から前記位置を決定するよ うに構成されていることを特徴とする、請求項7記載の装置。
- 9.前記装置が、前記リードと前記イメージ形成部材との間の光線の経路内に配 置されたすりガラス板を有することを特徴とする、請求項5乃至8のいずれか1 つに記載の方法。
- 10.前記イメージ形成部材がカメラからなることを特徴とする、請求項5乃至 9のいずれか1つに記載の方法。
- 11.前記光源が点光源であることを特徴とする、請求項7記載の方法。
- 12.前記点光源が自転車燈から形成されていることを特徴とする、請求項11 記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BE09000331 | 1990-03-23 | ||
BE9000331A BE1003136A3 (nl) | 1990-03-23 | 1990-03-23 | Werkwijze en inrichting voor het bepalen van een positie van ten minste een aansluitpen van een elektronische component. |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04506886A true JPH04506886A (ja) | 1992-11-26 |
JP2936523B2 JP2936523B2 (ja) | 1999-08-23 |
Family
ID=3884728
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3505379A Expired - Lifetime JP2936523B2 (ja) | 1990-03-23 | 1991-03-22 | 電子部品の少なくとも1つのリードの位置を決定する方法及び装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US5440391A (ja) |
EP (1) | EP0473749B2 (ja) |
JP (1) | JP2936523B2 (ja) |
KR (1) | KR100218756B1 (ja) |
AT (1) | ATE133026T1 (ja) |
BE (1) | BE1003136A3 (ja) |
DE (1) | DE69116270T3 (ja) |
WO (1) | WO1991015104A1 (ja) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4209524A1 (de) * | 1992-03-24 | 1993-09-30 | Siemens Ag | Verfahren zur Lageerkennung und/oder Teilungsprüfung und/oder Koplanaritätsprüfung der Anschlüsse von Bauelementen und Bestückkopf für die automatische Bestückung von Bauelementen |
DE9401711U1 (de) * | 1994-02-02 | 1995-06-01 | Kratzer Automatisierung Gmbh | Abbildungsvorrichtung |
KR970700860A (ko) * | 1994-02-02 | 1997-02-12 | 크라처 져하트 | 3차원 객체를 이미지화하기 위한 장치(device for imaging a three-dimensional object) |
US6072583A (en) * | 1996-12-06 | 2000-06-06 | General Electro Mechanical Corp. | Apparatus and method for detecting mis-oriented fasteners |
US5926557A (en) * | 1997-02-26 | 1999-07-20 | Acuity Imaging, Llc | Inspection method |
US5943125A (en) * | 1997-02-26 | 1999-08-24 | Acuity Imaging, Llc | Ring illumination apparatus for illuminating reflective elements on a generally planar surface |
US6118524A (en) * | 1997-02-26 | 2000-09-12 | Acuity Imaging, Llc | Arc illumination apparatus and method |
US5828449A (en) * | 1997-02-26 | 1998-10-27 | Acuity Imaging, Llc | Ring illumination reflective elements on a generally planar surface |
US6201892B1 (en) | 1997-02-26 | 2001-03-13 | Acuity Imaging, Llc | System and method for arithmetic operations for electronic package inspection |
US6236747B1 (en) * | 1997-02-26 | 2001-05-22 | Acuity Imaging, Llc | System and method for image subtraction for ball and bumped grid array inspection |
JPH11148807A (ja) * | 1997-07-29 | 1999-06-02 | Toshiba Corp | バンプ高さ測定方法及びバンプ高さ測定装置 |
US6064483A (en) * | 1997-08-07 | 2000-05-16 | Siemens Aktiengesellschaft | Device for checking the position the coplanarity and the separation of terminals of components |
US6915007B2 (en) | 1998-01-16 | 2005-07-05 | Elwin M. Beaty | Method and apparatus for three dimensional inspection of electronic components |
US6915006B2 (en) * | 1998-01-16 | 2005-07-05 | Elwin M. Beaty | Method and apparatus for three dimensional inspection of electronic components |
US5917655A (en) * | 1998-04-06 | 1999-06-29 | Motorola, Inc. | Method and apparatus for generating a stereoscopic image |
US6538750B1 (en) | 1998-05-22 | 2003-03-25 | Cyberoptics Corporation | Rotary sensor system with a single detector |
US6292261B1 (en) | 1998-05-22 | 2001-09-18 | Cyberoptics Corporation | Rotary sensor system with at least two detectors |
US5982493A (en) * | 1998-06-02 | 1999-11-09 | Motorola, Inc. | Apparatus and method for acquiring multiple images |
US6243164B1 (en) | 1998-07-13 | 2001-06-05 | Electro Scientific Industries | Method and system for determining lead coplanarity |
WO2000037926A1 (de) * | 1998-12-21 | 2000-06-29 | Hottinger Maschinenbau Gmbh | Verfahren und vorrichtung zur objekterkennung |
US6898333B1 (en) * | 1999-08-06 | 2005-05-24 | Cognex Corporation | Methods and apparatus for determining the orientation of an object in an image |
FI107192B (fi) * | 1999-11-09 | 2001-06-15 | Outokumpu Oy | Menetelmä elektrodin pinnanlaadun tarkistamiseksi |
US6792674B2 (en) * | 2000-04-28 | 2004-09-21 | Hitachi High-Tech Instruments Company, Ltd. | Apparatus for mounting electronic components |
US7985577B2 (en) * | 2003-04-30 | 2011-07-26 | Recology, Inc. | Systems and processes for treatment of organic waste materials with a biomixer |
WO2007047272A1 (en) * | 2005-10-12 | 2007-04-26 | Delta Design, Inc. | Camera based pin grid array (pga) inspection system with pin base mask and low angle lighting |
US7551272B2 (en) * | 2005-11-09 | 2009-06-23 | Aceris 3D Inspection Inc. | Method and an apparatus for simultaneous 2D and 3D optical inspection and acquisition of optical inspection data of an object |
US7535560B2 (en) * | 2007-02-26 | 2009-05-19 | Aceris 3D Inspection Inc. | Method and system for the inspection of integrated circuit devices having leads |
CN101971129A (zh) * | 2008-02-11 | 2011-02-09 | 奈克斯特控股有限公司 | 解决光学触摸屏的多点触摸情景的系统和方法 |
US9885671B2 (en) | 2014-06-09 | 2018-02-06 | Kla-Tencor Corporation | Miniaturized imaging apparatus for wafer edge |
US9645097B2 (en) | 2014-06-20 | 2017-05-09 | Kla-Tencor Corporation | In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4435837A (en) * | 1981-03-05 | 1984-03-06 | President And Fellows Of Harvard College | Pattern recognition and orientation system |
US4507557A (en) * | 1983-04-01 | 1985-03-26 | Siemens Corporate Research & Support, Inc. | Non-contact X,Y digitizer using two dynamic ram imagers |
GB8401088D0 (en) * | 1984-01-16 | 1984-02-15 | Marconi Avionics | Position determination |
DE3431616A1 (de) * | 1984-08-28 | 1986-03-06 | Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn | Messvorrichtung zur bestimmung der relativlage zweier koerper |
US4728195A (en) * | 1986-03-19 | 1988-03-01 | Cognex Corporation | Method for imaging printed circuit board component leads |
US4777360A (en) * | 1986-11-24 | 1988-10-11 | Carner Jr Don C | Umbra/penumbra detector |
JPS63262852A (ja) † | 1987-04-21 | 1988-10-31 | Tdk Corp | 電子部品リ−ドの浮き検出装置 |
US4873651A (en) * | 1987-04-21 | 1989-10-10 | Case Western Reserve University | Method and apparatus for reconstructing three-dimensional surfaces from two-dimensional images |
US4827436A (en) * | 1987-04-22 | 1989-05-02 | Micro Component Technology, Inc. | Non-contact high resolution displacement measurement technique |
EP0301255A1 (de) * | 1987-07-30 | 1989-02-01 | Siemens Aktiengesellschaft | 3D-Lageerkennung von Bauelementeanschlüssen für die automatische Bestückung |
US5008555A (en) * | 1988-04-08 | 1991-04-16 | Eaton Leonard Technologies, Inc. | Optical probe with overlapping detection fields |
SE463724B (sv) * | 1989-05-09 | 1991-01-14 | Atlas Copco Constr & Mining | Bearbetningsverktyg foer tunnelborrningsmaskin |
EP0425722A1 (de) † | 1989-10-31 | 1991-05-08 | Siemens Aktiengesellschaft | Anordnung zur Lageerkennung von Anschlussbeinchen |
-
1990
- 1990-03-23 BE BE9000331A patent/BE1003136A3/nl not_active IP Right Cessation
-
1991
- 1991-03-22 DE DE69116270T patent/DE69116270T3/de not_active Expired - Fee Related
- 1991-03-22 US US07/777,366 patent/US5440391A/en not_active Expired - Lifetime
- 1991-03-22 EP EP91905650A patent/EP0473749B2/en not_active Expired - Lifetime
- 1991-03-22 WO PCT/BE1991/000023 patent/WO1991015104A1/en active IP Right Grant
- 1991-03-22 AT AT91905650T patent/ATE133026T1/de not_active IP Right Cessation
- 1991-03-22 JP JP3505379A patent/JP2936523B2/ja not_active Expired - Lifetime
- 1991-11-22 KR KR1019910701663A patent/KR100218756B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0473749B1 (en) | 1996-01-10 |
JP2936523B2 (ja) | 1999-08-23 |
BE1003136A3 (nl) | 1991-12-03 |
ATE133026T1 (de) | 1996-01-15 |
US5440391A (en) | 1995-08-08 |
EP0473749B2 (en) | 1998-12-16 |
WO1991015104A1 (en) | 1991-10-03 |
KR100218756B1 (en) | 1999-09-01 |
EP0473749A1 (en) | 1992-03-11 |
DE69116270T3 (de) | 1999-07-08 |
DE69116270D1 (de) | 1996-02-22 |
KR920702189A (ko) | 1992-08-12 |
DE69116270T2 (de) | 1996-09-05 |
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