ATE133026T1 - Verfahren und vorrichtung zur bestimmung der position von mindestens einer anschlussfahne eines elektronischen bauelements - Google Patents

Verfahren und vorrichtung zur bestimmung der position von mindestens einer anschlussfahne eines elektronischen bauelements

Info

Publication number
ATE133026T1
ATE133026T1 AT91905650T AT91905650T ATE133026T1 AT E133026 T1 ATE133026 T1 AT E133026T1 AT 91905650 T AT91905650 T AT 91905650T AT 91905650 T AT91905650 T AT 91905650T AT E133026 T1 ATE133026 T1 AT E133026T1
Authority
AT
Austria
Prior art keywords
electronic component
pct
determining
lead
connection tag
Prior art date
Application number
AT91905650T
Other languages
English (en)
Inventor
Gust Smeyers
Luc Vanderheydt
Original Assignee
Icos Vision Systems Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=3884728&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE133026(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Icos Vision Systems Nv filed Critical Icos Vision Systems Nv
Application granted granted Critical
Publication of ATE133026T1 publication Critical patent/ATE133026T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8829—Shadow projection or structured background, e.g. for deflectometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
AT91905650T 1990-03-23 1991-03-22 Verfahren und vorrichtung zur bestimmung der position von mindestens einer anschlussfahne eines elektronischen bauelements ATE133026T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE9000331A BE1003136A3 (nl) 1990-03-23 1990-03-23 Werkwijze en inrichting voor het bepalen van een positie van ten minste een aansluitpen van een elektronische component.

Publications (1)

Publication Number Publication Date
ATE133026T1 true ATE133026T1 (de) 1996-01-15

Family

ID=3884728

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91905650T ATE133026T1 (de) 1990-03-23 1991-03-22 Verfahren und vorrichtung zur bestimmung der position von mindestens einer anschlussfahne eines elektronischen bauelements

Country Status (8)

Country Link
US (1) US5440391A (de)
EP (1) EP0473749B2 (de)
JP (1) JP2936523B2 (de)
KR (1) KR100218756B1 (de)
AT (1) ATE133026T1 (de)
BE (1) BE1003136A3 (de)
DE (1) DE69116270T3 (de)
WO (1) WO1991015104A1 (de)

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DE4209524A1 (de) * 1992-03-24 1993-09-30 Siemens Ag Verfahren zur Lageerkennung und/oder Teilungsprüfung und/oder Koplanaritätsprüfung der Anschlüsse von Bauelementen und Bestückkopf für die automatische Bestückung von Bauelementen
DE9401711U1 (de) * 1994-02-02 1995-06-01 Kratzer Automatisierung GmbH, 85716 Unterschleißheim Abbildungsvorrichtung
DE59500333D1 (de) * 1994-02-02 1997-07-24 Kratzer Automatisierung Gmbh Vorrichtung zum abbilden eines dreidimensionalen objekts
US6072583A (en) * 1996-12-06 2000-06-06 General Electro Mechanical Corp. Apparatus and method for detecting mis-oriented fasteners
US5943125A (en) * 1997-02-26 1999-08-24 Acuity Imaging, Llc Ring illumination apparatus for illuminating reflective elements on a generally planar surface
US6236747B1 (en) * 1997-02-26 2001-05-22 Acuity Imaging, Llc System and method for image subtraction for ball and bumped grid array inspection
US5828449A (en) * 1997-02-26 1998-10-27 Acuity Imaging, Llc Ring illumination reflective elements on a generally planar surface
US5926557A (en) * 1997-02-26 1999-07-20 Acuity Imaging, Llc Inspection method
US6118524A (en) * 1997-02-26 2000-09-12 Acuity Imaging, Llc Arc illumination apparatus and method
US6201892B1 (en) 1997-02-26 2001-03-13 Acuity Imaging, Llc System and method for arithmetic operations for electronic package inspection
JPH11148807A (ja) * 1997-07-29 1999-06-02 Toshiba Corp バンプ高さ測定方法及びバンプ高さ測定装置
US6064483A (en) * 1997-08-07 2000-05-16 Siemens Aktiengesellschaft Device for checking the position the coplanarity and the separation of terminals of components
US6915006B2 (en) * 1998-01-16 2005-07-05 Elwin M. Beaty Method and apparatus for three dimensional inspection of electronic components
US6915007B2 (en) 1998-01-16 2005-07-05 Elwin M. Beaty Method and apparatus for three dimensional inspection of electronic components
US5917655A (en) * 1998-04-06 1999-06-29 Motorola, Inc. Method and apparatus for generating a stereoscopic image
US6538750B1 (en) 1998-05-22 2003-03-25 Cyberoptics Corporation Rotary sensor system with a single detector
US6292261B1 (en) 1998-05-22 2001-09-18 Cyberoptics Corporation Rotary sensor system with at least two detectors
US5982493A (en) * 1998-06-02 1999-11-09 Motorola, Inc. Apparatus and method for acquiring multiple images
US6243164B1 (en) 1998-07-13 2001-06-05 Electro Scientific Industries Method and system for determining lead coplanarity
US6965120B1 (en) * 1998-12-21 2005-11-15 Hottinger Maschinenbau Gmbh Method and apparatus for quality control in the manufacture of foundry cores or core packets
US6898333B1 (en) * 1999-08-06 2005-05-24 Cognex Corporation Methods and apparatus for determining the orientation of an object in an image
FI107192B (fi) * 1999-11-09 2001-06-15 Outokumpu Oy Menetelmä elektrodin pinnanlaadun tarkistamiseksi
US6792674B2 (en) * 2000-04-28 2004-09-21 Hitachi High-Tech Instruments Company, Ltd. Apparatus for mounting electronic components
US7985577B2 (en) * 2003-04-30 2011-07-26 Recology, Inc. Systems and processes for treatment of organic waste materials with a biomixer
TW200730842A (en) * 2005-10-12 2007-08-16 Delta Design Inc Camera based pin grid array (PGA) inspection system with pin base mask and low angle lighting
US7551272B2 (en) * 2005-11-09 2009-06-23 Aceris 3D Inspection Inc. Method and an apparatus for simultaneous 2D and 3D optical inspection and acquisition of optical inspection data of an object
US7535560B2 (en) * 2007-02-26 2009-05-19 Aceris 3D Inspection Inc. Method and system for the inspection of integrated circuit devices having leads
US20090219256A1 (en) * 2008-02-11 2009-09-03 John David Newton Systems and Methods for Resolving Multitouch Scenarios for Optical Touchscreens
US9885671B2 (en) 2014-06-09 2018-02-06 Kla-Tencor Corporation Miniaturized imaging apparatus for wafer edge
US9645097B2 (en) 2014-06-20 2017-05-09 Kla-Tencor Corporation In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning

Family Cites Families (13)

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Publication number Priority date Publication date Assignee Title
US4435837A (en) * 1981-03-05 1984-03-06 President And Fellows Of Harvard College Pattern recognition and orientation system
US4507557A (en) * 1983-04-01 1985-03-26 Siemens Corporate Research & Support, Inc. Non-contact X,Y digitizer using two dynamic ram imagers
GB8401088D0 (en) * 1984-01-16 1984-02-15 Marconi Avionics Position determination
DE3431616A1 (de) * 1984-08-28 1986-03-06 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Messvorrichtung zur bestimmung der relativlage zweier koerper
US4728195A (en) * 1986-03-19 1988-03-01 Cognex Corporation Method for imaging printed circuit board component leads
US4777360A (en) * 1986-11-24 1988-10-11 Carner Jr Don C Umbra/penumbra detector
JPS63262852A (ja) † 1987-04-21 1988-10-31 Tdk Corp 電子部品リ−ドの浮き検出装置
US4873651A (en) * 1987-04-21 1989-10-10 Case Western Reserve University Method and apparatus for reconstructing three-dimensional surfaces from two-dimensional images
US4827436A (en) * 1987-04-22 1989-05-02 Micro Component Technology, Inc. Non-contact high resolution displacement measurement technique
EP0301255A1 (de) * 1987-07-30 1989-02-01 Siemens Aktiengesellschaft 3D-Lageerkennung von Bauelementeanschlüssen für die automatische Bestückung
US5008555A (en) * 1988-04-08 1991-04-16 Eaton Leonard Technologies, Inc. Optical probe with overlapping detection fields
SE463724B (sv) * 1989-05-09 1991-01-14 Atlas Copco Constr & Mining Bearbetningsverktyg foer tunnelborrningsmaskin
EP0425722A1 (de) † 1989-10-31 1991-05-08 Siemens Aktiengesellschaft Anordnung zur Lageerkennung von Anschlussbeinchen

Also Published As

Publication number Publication date
US5440391A (en) 1995-08-08
BE1003136A3 (nl) 1991-12-03
DE69116270T3 (de) 1999-07-08
KR920702189A (ko) 1992-08-12
EP0473749A1 (de) 1992-03-11
EP0473749B1 (de) 1996-01-10
DE69116270T2 (de) 1996-09-05
JP2936523B2 (ja) 1999-08-23
KR100218756B1 (en) 1999-09-01
JPH04506886A (ja) 1992-11-26
EP0473749B2 (de) 1998-12-16
WO1991015104A1 (en) 1991-10-03
DE69116270D1 (de) 1996-02-22

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