KR100218756B1 - Method and device for determining a position of at least one lead of an electronic component - Google Patents

Method and device for determining a position of at least one lead of an electronic component Download PDF

Info

Publication number
KR100218756B1
KR100218756B1 KR1019910701663A KR910701663A KR100218756B1 KR 100218756 B1 KR100218756 B1 KR 100218756B1 KR 1019910701663 A KR1019910701663 A KR 1019910701663A KR 910701663 A KR910701663 A KR 910701663A KR 100218756 B1 KR100218756 B1 KR 100218756B1
Authority
KR
South Korea
Prior art keywords
lead
electronic component
pct
determining
plane
Prior art date
Application number
KR1019910701663A
Other languages
English (en)
Other versions
KR920702189A (ko
Inventor
Gust Ameyers
Luc Vanderheydt
Original Assignee
Icos Vision Systems Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=3884728&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR100218756(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Icos Vision Systems Nv filed Critical Icos Vision Systems Nv
Publication of KR920702189A publication Critical patent/KR920702189A/ko
Application granted granted Critical
Publication of KR100218756B1 publication Critical patent/KR100218756B1/ko

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813Controlling of single components prior to mounting, e.g. orientation, component geometry
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8829Shadow projection or structured background, e.g. for deflectometry
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
KR1019910701663A 1990-03-23 1991-11-22 Method and device for determining a position of at least one lead of an electronic component KR100218756B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BE09000331 1990-03-23
BE9000331A BE1003136A3 (nl) 1990-03-23 1990-03-23 Werkwijze en inrichting voor het bepalen van een positie van ten minste een aansluitpen van een elektronische component.

Publications (2)

Publication Number Publication Date
KR920702189A KR920702189A (ko) 1992-08-12
KR100218756B1 true KR100218756B1 (en) 1999-09-01

Family

ID=3884728

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910701663A KR100218756B1 (en) 1990-03-23 1991-11-22 Method and device for determining a position of at least one lead of an electronic component

Country Status (8)

Country Link
US (1) US5440391A (ko)
EP (1) EP0473749B2 (ko)
JP (1) JP2936523B2 (ko)
KR (1) KR100218756B1 (ko)
AT (1) ATE133026T1 (ko)
BE (1) BE1003136A3 (ko)
DE (1) DE69116270T3 (ko)
WO (1) WO1991015104A1 (ko)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4209524A1 (de) * 1992-03-24 1993-09-30 Siemens Ag Verfahren zur Lageerkennung und/oder Teilungsprüfung und/oder Koplanaritätsprüfung der Anschlüsse von Bauelementen und Bestückkopf für die automatische Bestückung von Bauelementen
DE9401711U1 (de) * 1994-02-02 1995-06-01 Kratzer Automatisierung Gmbh Abbildungsvorrichtung
KR970700860A (ko) * 1994-02-02 1997-02-12 크라처 져하트 3차원 객체를 이미지화하기 위한 장치(device for imaging a three-dimensional object)
US6072583A (en) * 1996-12-06 2000-06-06 General Electro Mechanical Corp. Apparatus and method for detecting mis-oriented fasteners
US5926557A (en) * 1997-02-26 1999-07-20 Acuity Imaging, Llc Inspection method
US5943125A (en) * 1997-02-26 1999-08-24 Acuity Imaging, Llc Ring illumination apparatus for illuminating reflective elements on a generally planar surface
US6118524A (en) * 1997-02-26 2000-09-12 Acuity Imaging, Llc Arc illumination apparatus and method
US5828449A (en) * 1997-02-26 1998-10-27 Acuity Imaging, Llc Ring illumination reflective elements on a generally planar surface
US6201892B1 (en) 1997-02-26 2001-03-13 Acuity Imaging, Llc System and method for arithmetic operations for electronic package inspection
US6236747B1 (en) * 1997-02-26 2001-05-22 Acuity Imaging, Llc System and method for image subtraction for ball and bumped grid array inspection
JPH11148807A (ja) * 1997-07-29 1999-06-02 Toshiba Corp バンプ高さ測定方法及びバンプ高さ測定装置
US6064483A (en) * 1997-08-07 2000-05-16 Siemens Aktiengesellschaft Device for checking the position the coplanarity and the separation of terminals of components
US6915007B2 (en) 1998-01-16 2005-07-05 Elwin M. Beaty Method and apparatus for three dimensional inspection of electronic components
US6915006B2 (en) * 1998-01-16 2005-07-05 Elwin M. Beaty Method and apparatus for three dimensional inspection of electronic components
US5917655A (en) * 1998-04-06 1999-06-29 Motorola, Inc. Method and apparatus for generating a stereoscopic image
US6538750B1 (en) 1998-05-22 2003-03-25 Cyberoptics Corporation Rotary sensor system with a single detector
US6292261B1 (en) 1998-05-22 2001-09-18 Cyberoptics Corporation Rotary sensor system with at least two detectors
US5982493A (en) * 1998-06-02 1999-11-09 Motorola, Inc. Apparatus and method for acquiring multiple images
US6243164B1 (en) 1998-07-13 2001-06-05 Electro Scientific Industries Method and system for determining lead coplanarity
WO2000037926A1 (de) * 1998-12-21 2000-06-29 Hottinger Maschinenbau Gmbh Verfahren und vorrichtung zur objekterkennung
US6898333B1 (en) * 1999-08-06 2005-05-24 Cognex Corporation Methods and apparatus for determining the orientation of an object in an image
FI107192B (fi) * 1999-11-09 2001-06-15 Outokumpu Oy Menetelmä elektrodin pinnanlaadun tarkistamiseksi
US6792674B2 (en) * 2000-04-28 2004-09-21 Hitachi High-Tech Instruments Company, Ltd. Apparatus for mounting electronic components
US7985577B2 (en) * 2003-04-30 2011-07-26 Recology, Inc. Systems and processes for treatment of organic waste materials with a biomixer
WO2007047272A1 (en) * 2005-10-12 2007-04-26 Delta Design, Inc. Camera based pin grid array (pga) inspection system with pin base mask and low angle lighting
US7551272B2 (en) * 2005-11-09 2009-06-23 Aceris 3D Inspection Inc. Method and an apparatus for simultaneous 2D and 3D optical inspection and acquisition of optical inspection data of an object
US7535560B2 (en) * 2007-02-26 2009-05-19 Aceris 3D Inspection Inc. Method and system for the inspection of integrated circuit devices having leads
CN101971129A (zh) * 2008-02-11 2011-02-09 奈克斯特控股有限公司 解决光学触摸屏的多点触摸情景的系统和方法
US9885671B2 (en) 2014-06-09 2018-02-06 Kla-Tencor Corporation Miniaturized imaging apparatus for wafer edge
US9645097B2 (en) 2014-06-20 2017-05-09 Kla-Tencor Corporation In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4435837A (en) * 1981-03-05 1984-03-06 President And Fellows Of Harvard College Pattern recognition and orientation system
US4507557A (en) * 1983-04-01 1985-03-26 Siemens Corporate Research & Support, Inc. Non-contact X,Y digitizer using two dynamic ram imagers
GB8401088D0 (en) * 1984-01-16 1984-02-15 Marconi Avionics Position determination
DE3431616A1 (de) * 1984-08-28 1986-03-06 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Messvorrichtung zur bestimmung der relativlage zweier koerper
US4728195A (en) * 1986-03-19 1988-03-01 Cognex Corporation Method for imaging printed circuit board component leads
US4777360A (en) * 1986-11-24 1988-10-11 Carner Jr Don C Umbra/penumbra detector
JPS63262852A (ja) 1987-04-21 1988-10-31 Tdk Corp 電子部品リ−ドの浮き検出装置
US4873651A (en) * 1987-04-21 1989-10-10 Case Western Reserve University Method and apparatus for reconstructing three-dimensional surfaces from two-dimensional images
US4827436A (en) * 1987-04-22 1989-05-02 Micro Component Technology, Inc. Non-contact high resolution displacement measurement technique
EP0301255A1 (de) * 1987-07-30 1989-02-01 Siemens Aktiengesellschaft 3D-Lageerkennung von Bauelementeanschlüssen für die automatische Bestückung
US5008555A (en) * 1988-04-08 1991-04-16 Eaton Leonard Technologies, Inc. Optical probe with overlapping detection fields
SE463724B (sv) * 1989-05-09 1991-01-14 Atlas Copco Constr & Mining Bearbetningsverktyg foer tunnelborrningsmaskin
EP0425722A1 (de) 1989-10-31 1991-05-08 Siemens Aktiengesellschaft Anordnung zur Lageerkennung von Anschlussbeinchen

Also Published As

Publication number Publication date
EP0473749B1 (en) 1996-01-10
JP2936523B2 (ja) 1999-08-23
BE1003136A3 (nl) 1991-12-03
ATE133026T1 (de) 1996-01-15
US5440391A (en) 1995-08-08
EP0473749B2 (en) 1998-12-16
WO1991015104A1 (en) 1991-10-03
EP0473749A1 (en) 1992-03-11
DE69116270T3 (de) 1999-07-08
DE69116270D1 (de) 1996-02-22
JPH04506886A (ja) 1992-11-26
KR920702189A (ko) 1992-08-12
DE69116270T2 (de) 1996-09-05

Similar Documents

Publication Publication Date Title
KR100218756B1 (en) Method and device for determining a position of at least one lead of an electronic component
DE69202405T2 (de) Eine Leiterplattenanordnung.
FR2666662B1 (fr) Dispositif d'eclairage pour un microscope operatoire.
DE68918380D1 (de) Gehäuse für integrierte Schaltungen mit Kühlvorrichtung.
SE9200122D0 (sv) Faellarsystem
FR2671226B1 (fr) Assemblage de champ pour un electro-aimant.
GB9501647D0 (en) Miniature mounting device
IT8219597A0 (it) Apparecchio di comando su uno strumento musicale elettronico provvisto di almeno un sintetizzatore.
FR2558566B1 (fr) Circuit de commande d'un dispositif de lubrification
FR2663137B1 (fr) Dispositif electronique de connexion.
FR2666712B1 (fr) Dispositif pour commander un dispositif electronique de formation d'image.
DE69102591D1 (de) Amplitudenveränderliche Vorrichtung für mindestens einen Brennkraftmaschinensteuerventilhub.
JPS57137978A (en) Pattern detecting device
EP0996050A3 (en) Electronic device
FR2652703B1 (fr) Procede de montage d'un composant electronique sur une carte de circuit imprime.
EP1218688A4 (en) METHOD AND APPARATUS FOR THE THREE-DIMENSIONAL INSPECTION OF ELECTRONIC COMPONENTS
EP0589724A3 (en) Electronic image processing system.
DE59104376D1 (de) Montageelement.
CA2114255A1 (en) Magnetic Transfer Device
DE69110911T2 (de) Abschirmungsgehäuseanordnung für eine elektronische Vorrichtung.
ATE197109T1 (de) Baugruppe mit einer schaltungsanordnung
ATE134538T1 (de) Metallnachweis
FR2713385B3 (fr) Dispositif de commande d'un module de soupape à commande préalable électromagnétique.
FR2655484B1 (fr) Ensemble connecteur pour puces a circuits integres et modules de contact pour cet ensemble.
GB2151418B (en) An illuminator and circuit arrangement therefor

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20100528

Year of fee payment: 12

EXPY Expiration of term