JPH0447469B2 - - Google Patents

Info

Publication number
JPH0447469B2
JPH0447469B2 JP61072734A JP7273486A JPH0447469B2 JP H0447469 B2 JPH0447469 B2 JP H0447469B2 JP 61072734 A JP61072734 A JP 61072734A JP 7273486 A JP7273486 A JP 7273486A JP H0447469 B2 JPH0447469 B2 JP H0447469B2
Authority
JP
Japan
Prior art keywords
light emitting
insulating layer
substrate
lighting device
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61072734A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62229987A (ja
Inventor
Masaru Sasaki
Hiroyuki Serizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Priority to JP61072734A priority Critical patent/JPS62229987A/ja
Publication of JPS62229987A publication Critical patent/JPS62229987A/ja
Publication of JPH0447469B2 publication Critical patent/JPH0447469B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
JP61072734A 1986-03-31 1986-03-31 照明装置 Granted JPS62229987A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61072734A JPS62229987A (ja) 1986-03-31 1986-03-31 照明装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61072734A JPS62229987A (ja) 1986-03-31 1986-03-31 照明装置

Publications (2)

Publication Number Publication Date
JPS62229987A JPS62229987A (ja) 1987-10-08
JPH0447469B2 true JPH0447469B2 (h) 1992-08-04

Family

ID=13497883

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61072734A Granted JPS62229987A (ja) 1986-03-31 1986-03-31 照明装置

Country Status (1)

Country Link
JP (1) JPS62229987A (h)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0744029Y2 (ja) * 1990-12-28 1995-10-09 株式会社小糸製作所 Ｌｅｄモジュール
SE517916C2 (sv) * 1999-12-17 2002-08-06 Ericsson Telefon Ab L M Chipsbärare, system och förfarande vid tillverkning av chipsbärare
GB2361581A (en) * 2000-04-20 2001-10-24 Lite On Electronics Inc A light emitting diode device
JP2006295084A (ja) * 2005-04-14 2006-10-26 Citizen Electronics Co Ltd 発光ダイオードのパッケージ構造
JP4753419B2 (ja) * 2005-08-05 2011-08-24 パナソニック株式会社 発光モジュール
JP4730708B2 (ja) * 2006-05-15 2011-07-20 岩崎電気株式会社 Ｌｅｄ照射装置
TW200824142A (en) * 2006-11-22 2008-06-01 Lighthouse Technology Co Ltd High power diode holder and thereof package is described
JP2008244350A (ja) * 2007-03-28 2008-10-09 ▲せん▼宗文 多粒の表面粘着型発光ダイオードの製造方法とその構造
JP2016195177A (ja) * 2015-03-31 2016-11-17 Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 光照射モジュール
JP6409845B2 (ja) * 2016-10-06 2018-10-24 日立化成株式会社 光半導体素子搭載用基板および光半導体装置
JP6740997B2 (ja) * 2017-12-27 2020-08-19 日立化成株式会社 光半導体素子搭載用基板および光半導体装置

Also Published As

Publication number Publication date
JPS62229987A (ja) 1987-10-08

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