JPH0437848B2 - - Google Patents

Info

Publication number
JPH0437848B2
JPH0437848B2 JP59226928A JP22692884A JPH0437848B2 JP H0437848 B2 JPH0437848 B2 JP H0437848B2 JP 59226928 A JP59226928 A JP 59226928A JP 22692884 A JP22692884 A JP 22692884A JP H0437848 B2 JPH0437848 B2 JP H0437848B2
Authority
JP
Japan
Prior art keywords
weight
parts
composition
synthesis example
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59226928A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61106613A (ja
Inventor
Kazumitsu Nawata
Shigeto Katayama
Minoru Yokoshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Priority to JP59226928A priority Critical patent/JPS61106613A/ja
Priority to KR1019850007902A priority patent/KR910006958B1/ko
Priority to US06/792,736 priority patent/US4636534A/en
Priority to DE8585307865T priority patent/DE3569749D1/de
Priority to EP19850307865 priority patent/EP0180466B1/en
Publication of JPS61106613A publication Critical patent/JPS61106613A/ja
Publication of JPH0437848B2 publication Critical patent/JPH0437848B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L39/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
    • C08L39/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
    • C08L39/06—Homopolymers or copolymers of N-vinyl-pyrrolidones
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP59226928A 1984-10-30 1984-10-30 光重合性組成物 Granted JPS61106613A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP59226928A JPS61106613A (ja) 1984-10-30 1984-10-30 光重合性組成物
KR1019850007902A KR910006958B1 (ko) 1984-10-30 1985-10-25 광중합 조성물
US06/792,736 US4636534A (en) 1984-10-30 1985-10-29 Photopolymerizable composition
DE8585307865T DE3569749D1 (en) 1984-10-30 1985-10-30 Photopolymerizable composition for use as an etching-resist ink
EP19850307865 EP0180466B1 (en) 1984-10-30 1985-10-30 Photopolymerizable composition for use as an etching-resist ink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59226928A JPS61106613A (ja) 1984-10-30 1984-10-30 光重合性組成物

Publications (2)

Publication Number Publication Date
JPS61106613A JPS61106613A (ja) 1986-05-24
JPH0437848B2 true JPH0437848B2 (https=) 1992-06-22

Family

ID=16852797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59226928A Granted JPS61106613A (ja) 1984-10-30 1984-10-30 光重合性組成物

Country Status (5)

Country Link
US (1) US4636534A (https=)
EP (1) EP0180466B1 (https=)
JP (1) JPS61106613A (https=)
KR (1) KR910006958B1 (https=)
DE (1) DE3569749D1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5145884A (en) * 1986-11-13 1992-09-08 Menicon Co., Ltd. Ultraviolet-hardenable adhesive
US4942001A (en) * 1988-03-02 1990-07-17 Inc. DeSoto Method of forming a three-dimensional object by stereolithography and composition therefore
US5344747A (en) * 1988-04-15 1994-09-06 Tokyo Ohka Kogyo Co., Ltd. Photopolymerizable compositions
JPH01263645A (ja) * 1988-04-15 1989-10-20 Tokyo Ohka Kogyo Co Ltd 光重合性組成物
JP2649716B2 (ja) * 1988-12-06 1997-09-03 日本化薬株式会社 光重合性組成物
AU634214B2 (en) * 1989-03-14 1993-02-18 Robert Koch Procaine double salt complexes
US5225315A (en) * 1991-09-19 1993-07-06 Dymax Corporation Water soluble formulation for masking and the like, and method utilizing the same
US7208334B2 (en) * 2004-03-31 2007-04-24 Kabushiki Kaisha Toshiba Method of manufacturing semiconductor device, acid etching resistance material and copolymer
US9574057B2 (en) 2012-03-28 2017-02-21 Becton, Dickinson And Company Hydrogel adhesion to molded polymers
EP3000853B1 (en) * 2014-09-29 2020-04-08 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing conductive patterns
CN112135883A (zh) * 2018-03-02 2020-12-25 爱克发-格法特公司 用于制造印刷电路板的喷墨油墨

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3953214A (en) * 1974-05-24 1976-04-27 Dynachem Corporation Photopolymerizable screen printing inks and use thereof
JPS528303A (en) * 1975-04-11 1977-01-22 Hitachi Chemical Co Ltd Filmmlike laminated body
DE2728780A1 (de) * 1976-07-05 1978-01-19 Ciba Geigy Ag Photohaertbare lack- und druckfarben
GB1599281A (en) * 1977-01-10 1981-09-30 Ici Ltd Photopolymerisable composition
JPS5928350B2 (ja) * 1977-12-19 1984-07-12 大日本塗料株式会社 熱硬化性高固形分塗料用組成物
JPS5713444A (en) * 1980-06-27 1982-01-23 Tamura Kaken Kk Photosensitive composition
US4514271A (en) * 1981-07-02 1985-04-30 Gaf Corporation Stable dispersion of alkylated polyvinylpyrrolidone and vinyl pyrrolidone
JPS58149040A (ja) * 1982-03-02 1983-09-05 Mitsui Toatsu Chem Inc 紫外線硬化パタ−ン形成用組成物
JPS58153930A (ja) * 1982-03-09 1983-09-13 Mitsui Toatsu Chem Inc 紫外線硬化パタ−ン形成用組成物
JPS5929246A (ja) * 1982-08-12 1984-02-16 Mitsui Toatsu Chem Inc 紫外線硬化パタ−ン形成用の組成物
JPS6026065A (ja) * 1983-07-22 1985-02-08 Yokohama Rubber Co Ltd:The シリコ−ン変性アクリルワニス
US4588664A (en) * 1983-08-24 1986-05-13 Polaroid Corporation Photopolymerizable compositions used in holograms

Also Published As

Publication number Publication date
EP0180466A2 (en) 1986-05-07
JPS61106613A (ja) 1986-05-24
DE3569749D1 (en) 1989-06-01
EP0180466B1 (en) 1989-04-26
KR860003302A (ko) 1986-05-23
US4636534A (en) 1987-01-13
KR910006958B1 (ko) 1991-09-14
EP0180466A3 (en) 1987-04-01

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term